For die attach and general electronics assembly Die Attach Adhesives Zymet's electrically conductive die attach adhesives for semiconductor package assembly, hybrid IC assembly, COB IC assembly, and smartcard IC assembly. The adhesives are syring
YINCAE Launches Snap Cure, Highly filled ,100% No-Clean Flux Residue Compatible Underfill: UF 120HA 6/20/2023 (Albany, NY)– YINCAE, a leading manufacturer of electronic materials, has announced the launch of its new product, UF 120HA. The innovative
Electronics Forum | Fri Nov 11 09:41:12 EST 2005 | Eric C
Thanks for all your inputs. As I read through your responses, and through my research on the web, I have learned there are so many options to try and evaluate. The material we are using is loctite FP4531 - a snap cure flip chip underfill. Loctite ha
Electronics Forum | Wed Feb 23 04:47:29 EST 2000 | Dean
Hey Sal. Requests I typically receive from management stay just that - requests! Maby its just me but unless you have a single line capable of full double sided capability (printer, P&P, flipper (inverter), printer, P&P, reflow oven) the extra trou
Industry News | 2015-07-21 08:21:52.0
Engineered Materials Systems introduced its new EMS 561-403 Low-Cost Snap Cure Conductive Adhesive for stringing applications in crystalline silicon and thin-film solar modules. EMS 561-403 is designed to electrically interconnect solar cells using ribbons.
Industry News | 2016-08-08 20:27:23.0
Engineered Materials Systems is pleased to introduce its new EMS 561-676 Low-Cost Snap Cure Conductive Adhesive for stringing or shingling applications in crystalline silicon and thin-film solar modules. EMS 561-676 is designed to electrically interconnect solar cells using ribbons or direct cell-to-cell contact.
Technical Library | 2023-09-07 14:54:10.0
A global manufacturer of a broad line of electronic interconnect solutions worked with us to dispense conductive adhesive EpoTek H20E-FC. EpoTek H20E-FC is a two-component, electrically conductive, snap curing epoxy for photovoltaic thin film module stringing, semiconductor packaging and PCB circuit assembly. The primary goal was filling a rectangular cavity on a connector. The epoxy needed to fill the connector to the top of the walls in less than three seconds.
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/products/solder-paste?con=t&page=25
Series automated dispensing system. 752HF High Flow Diaphragm Valves Nordson EFD The 752HF Series high flow diaphragm valve provides precise, drip-free dispensing of UV-cure resins and similar fluids used in the media manufacturing of
