New Equipment | Assembly Services
G9 + automatic vision printing machine is a new product for SMT high-end application field, which can perfectly meet the process requirements of 03015, 0.25pich and other fine spacing, high precision and high speed. Introduction to standard function
SAP26 series are semi-automatic printers developed by EMS Technologies, Pune. With various configuration available such as Camera attachment, settleable squeegee motor speed SAP26 printer range is suitable for wide variety of applications. Features:
Used SMT Equipment | Screen Printers
MPM Momentum+ Printer Substrate treatment Maximum plate size(XxY) 609.6 mm x 508 mm(24”x 20”) Segmented mode-Momentum Elite 457 mm x 508 mm(18"x20") Minimum Plate Size (XxY)
Used SMT Equipment | Screen Printers
Substrate processing: Maximum substrate size (XxY): 609.6mmx508mm(24”x20”) For circuit boards larger than 20”, special fixtures are required Minimum substrate size (XxY): 50.8mmx50.8mm(2”x2”)
Industry News | 2014-05-29 18:30:08.0
Kurtz Ersa North America recently developed and released the new Mini VARIO Wave, a game changing option for its selective solder systems.
Industry News | 2014-05-29 18:32:30.0
Kurtz Ersa North America recently developed and released the new Mini VARIO Wave, a game changing option for its selective solder systems.
Technical Library | 2016-03-17 19:09:46.0
The rapid growth of electronic devices across the globe is driving manufacturers to enhance high-speed mass production techniques in the PCB assembly arena. As manufacturers drive to reduce costs while maximizing production by expanding facilities, updating automation equipment, or implementing lean six sigma techniques, the potential to build scrap product or rework printed circuit boards increases dramatically.Manufacturers have two general paths to reduce the costs of high-speed printed circuit board assembly production. The first path is to reduce cost by focusing on high quality printing and mounting. The other, increasingly popular option is to utilize low-cost materials. In either case, the baseline must provide a consistent high-speed solder paste printing method, which considers the fill, snap-off, and cleaning processes.Building on our expertise and testing, this paper will highlight the two trains of thought with specific focus on how low-cost materials affect print performance. It will also explore technologies, which can help provide stable, high-speed screen printing.
Substrate processing: Maximum substrate size (XxY): 609.6mmx508mm(24”x20”) For circuit boards larger than 20”, special fixtures are required Minimum substrate size (XxY): 50.8mmx50.8mm(2”x2”)
Momentum was designed and built to be a no-nonsense production machine. Cost-efficient and featuring a modest footprint, it grows with the user; innovative patented features can be added on or retrofitted as needed as the user’s throughput dema
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/ko-KR/divisions/efd/products/mixers/disposable-turbo-mixers
시스템에 부착합니다. 브라켓의 이중 루프 형태가 시리즈 280 믹서의 11.2mm (0.442”) 노즐과 카트리지 네크 위에 안착되어 단단히 부착됩니다. 시리즈 281N 일회용 고속 터보 믹서 시리즈 281N 14.3mm 고속 믹서 제품은 일정한 고품질 혼합을 제공하고, 적은 노력으로 높은 유속을 낼 수 있게 해줍니다. 이 시리즈는 이격(snap off) 연장장치를 채택하고 있습니다. 대부분의 일회용 카트리지에 맞도록 설계되었습니다. 시리즈 295
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/what-does-it-mean-to-roundoff_topic1199.html
0.05 mm increments and the "C" pad span could snap your pads to 0.05 mm increments. The Round-off value will help you in Part Placement and manual Routing on a 0.05 mm grid system
