Electronics Forum | Mon Sep 11 04:13:14 UTC 2006 | C.K.
So, your scenario is: * Lead Free Solder Paste * Lead Free Reflow Profile * RoHS Components * Non-RoHS (Sn-Pb HASL plated)PCB If that's the case, you should be just fine running your Lead-Free process. There is literature on the topic of lead
Electronics Forum | Tue Jun 20 04:45:44 UTC 2006 | samir
Again, the verdict is mixed here as well, but from the seminars, white papers, etc. the consensus seems to be that Pb BGA's are not compatible in a Pb-Free RoHS Process...but... Pb-Free SAC BGA's are compatible in a Sn-Pb process as long as your pro
Industry News | 2018-10-18 09:34:29.0
Application of lead-free solder
Industry News | 2018-10-18 08:21:10.0
How to Prevent Non-Wetting Defect during the SMT Reflow Process
Technical Library | 2022-10-31 17:30:40.0
This paper presents a quantitative analysis of solder joint reliability data for lead-free Sn-Ag-Cu (SAC) and mixed assembly (SnPb + SAC) circuit boards based on an extensive, but non-exhaustive, collection of thermal cycling test results. The assembled database covers life test results under multiple test conditions and for a variety of components: conventional SMT (LCCCs, resistors), Ball Grid Arrays, Chip Scale Packages (CSPs), wafer-level CSPs, and flip-chip assemblies with and without underfill. First-order life correlations are developed for SAC assemblies under thermal cycling conditions. The results of this analysis are put in perspective with the correlation of life test results for SnPb control assemblies. Fatigue life correlations show different slopes for SAC versus SnPb assemblies, suggesting opposite reliability trends under low or high stress conditions. The paper also presents an analysis of the effect of Pb contamination and board finish on lead-free solder joint reliability. Last, test data are presented to compare the life of mixed solder assemblies to that of standard SnPb assemblies for a wide variety of area-array components. The trend analysis compares the life of area-array assemblies with: 1) SAC balls and SAC or SnPb paste; 2) SnPb balls assembled with SAC or SnPb paste.
Technical Library | 2022-10-31 17:09:04.0
The global transition to lead-free (Pb-free) electronics has led component and equipment manufacturers to transform their tin–lead (SnPb) processes to Pb-free. At the same time, Pb-free legislation has granted exemptions for some products whose applications require high long-term reliability. However, due to a reduction in the availability of SnPb components, compatibility concerns can arise if Pb-free components have to be utilized in a SnPb assembly. This compatibility situation of attaching a Pb-free component in a SnPb assembly is generally termed "backward compatibility." This paper presents the results of microstructural analysis of mixed solder joints which are formed by attaching Pb-free solder balls (SnAgCu) of a ball-grid-array component using SnPb paste. The experiment evaluates the Pb phase coarsening in bulk solder microstructure and the study of intermetallic compounds formed at the interface between the solder and the copper pad.
| https://www.eptac.com/blog/leaded-vs-lead-free-solder-which-is-better
. In 2006, the European Union banned certain hazardous substances in electronic products, including lead. In the past two decades, the electronic manufacturing world has experienced a dynamic development of alternative soldering material centered on tin metal, with manufacturers switching to lead-free
GPD Global | https://www.gpd-global.com/lead-free-solder-paste-dispensing.php
. Since leaded paste (SnPb) has a higher density than a common lead free (SAC305) paste, we recommend adjusting metal percentage when changing from leaded to lead free
