New Equipment | Solder Materials
Cored Solder Wire is specially designed with low residue, chlorine content less than 0.1%, flux content 2.0%+0.5 for Hand/Automatic soldering applications assembly. Soldering Wire is available in many alloy composition, Sn60 and Sn63 are the most re
New Equipment | Solder Materials
Bars / Solid Wires Proposal Pro Contra Wave and selective soldering SN100C® Favourable price
Electronics Forum | Mon Aug 04 14:54:09 EDT 2008 | blnorman
J-STD-001 Table 5-1 lists the allowable impurity levels for SnPb wave solder pots.
Electronics Forum | Thu Jul 31 20:01:08 EDT 2008 | crashoveride
Hi guys! We just had our SnPb wave solder samples tested. However, the papers just gave us the contents and the percentage of each contents found with the sample. Does anybody know the passing range and/or paramters of the following elements: Pb, Cu,
Industry News | 2018-10-18 09:34:29.0
Application of lead-free solder
Industry News | 2013-10-08 14:47:36.0
The Balver Zinn Group announces that it will exhibit in Hall A4, Stand 451 at the 20th international Productronica Trade Fair, scheduled to take place November 12 - 15, 2013 at the New Munich Trade Fair Centre in Munich, Germany.
Technical Library | 2014-08-07 15:13:44.0
Gold embrittlement in SnPb solder is a well-known failure mechanism in electronic assembly. To avoid this issue, prior studies have indicated a maximum gold content of three weight percent. This study attempts to provide similar guidance for Pb-free (SAC305) solder. Standard surface mount devices were assembled with SnPb and SAC305 solder onto printed boards with various thicknesses of gold plating. The gold plating included electroless nickel immersion gold (ENIG) and electrolytic gold of 15, 25, 35, and 50 microinches over nickel. These gold thicknesses resulted in weight percentages between 0.4 to 7.0 weight percent.
Technical Library | 2015-11-19 18:15:07.0
The move to lead free (Pb-free) electronics by the commercial industry has resulted in an increasing number of ball grid array components (BGAs) which are only available with Pb-free solder balls. The reliability of these devices is not well established when assembled using a standard tin-lead (SnPb) solder paste and reflow profile, known as a backward compatible process. Previous studies in processing mixed alloy solder joints have demonstrated the importance of using a reflow temperature high enough to achieve complete mixing of the SnPb solder paste with the Pb-free solder ball. Research has indicated that complete mixing can occur below the melting point of the Pb-free alloy and is dependent on a number of factors including solder ball composition, solder ball to solder paste ratio, and peak reflow times and temperatures. Increasing the lead content in the system enables full mixing of the solder joint with a reduced peak reflow temperature, however, previous research is conflicting regarding the effect that lead percentage has on solder joint reliability in this mixed alloy solder joint.
| https://www.eptac.com/wp-content/uploads/2007/10/webinar_eptac_10_17_07.pdf
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/industries/packaging?con=t&page=5
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