Industry Directory | Consultant / Service Provider / Equipment Dealer / Broker / Auctions / Manufacturer's Representative / Training Provider
Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.
Industry Directory | Consultant / Service Provider
An independent solder analysis lab. Our services include solder analysis of wave solder machines and solder pots. We test for impurities based on J-STD-006B for most tin and lead based alloys.
New Equipment | Assembly Services
BEST can provide you with analysis services for your BGAs using x-ray equipment. We rework thousands of BGAs and POPs every year, therefore, we have the expertise in BGA X-ray inspection. BEST can be your outsourced BGA x-ray inspection source for o
New Equipment | Wave Soldering
> ◇Windows XP operation software with Chinese and English alternative available, whole machine under integration control can display the failure and save all production data for further analysis. ◇External streamline design and modularized desi
Electronics Forum | Tue Nov 28 16:01:34 EST 2006 | billwestiet
John, I'd be interested in providing you with some input, E mail me. Bill@ietechnology.net
Electronics Forum | Tue Nov 28 14:02:06 EST 2006 | jsloot
I am starting to use a DATAPAQ wave analysis software on our Econopak EPK II machines. I would like to know what values you may be using for alarm conditions. I can email an example if you can help. Thanks
Used SMT Equipment | SPI / Solder Paste Inspection
Make: Koh Young Model: 8030-3L Vintage: 2011 Details: • Windows XP Operating System • 3D • 4M Pixel High Speed Camera • Automatic Conveyor Width Adjustment • Front/Rear Fixed Conveyor • SPC Plu
Used SMT Equipment | Pick and Place/Feeders
Product Details of 3D SPI-6500 Thick Paste Measurement Instrument Product Functions 1, friendly programming interface 2, a variety of measurement methods 3, scan spacing adjustable 4, image 3D simulation function 5, independent 3D dynamic obser
Industry News | 2013-05-21 22:12:09.0
Based on its recent analysis of the surface mount technology (SMT) reflow soldering equipment market, Frost & Sullivan recognizes Heller Industries, Inc. with the 2013 Global Frost & Sullivan Award for Market Share Leadership.
Industry News | 2016-06-22 15:33:28.0
Based on its recent analysis of the surface mount technology (SMT) reflow soldering equipment market, Frost & Sullivan recognizes Heller Industries, Inc. with the 2016 Global Frost & Sullivan Award for Growth Excellence Leadership. Heller Industries has made remarkable improvements to its product and technology portfolios over the last 10 years to emerge a top participant in the SMT reflow soldering equipment market.
Parts & Supplies | SPI / Solder Paste Inspection
Quick programming, friendly programming interface Multiple measurement methods True one-button measurement Eight-way motion button, one-click focus Adjustable scanning pitch Solder paste 3D simulation function Powerful SPC function MARK
Parts & Supplies | Assembly Accessories
Detailed Product Description Features: 7 Channel Brand: KIC Part Name: X5 Reflow Profiler Model: X5 Condition: Original New Leadtime: 7days KIC X5 Thermal Profiler with SPC software and RF capability For Reflow Track More Data Points With 7,
Technical Library | 2023-01-17 17:22:28.0
The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.
Technical Library | 2010-01-13 12:34:10.0
Micro-sectioning (sometimes referred to as cross-sectioning)is a technique, used to characterize materials or to perform a failure mode analysis, for exposing an internal section of a PCB or package. Destructive in nature, cross-sectioning requires encapsulation of the specimen in order to provide support, stability, and protection. Failures that can be investigated through micro-sectional analysis include component defects, thermo-mechanical failures, processing failures related to solder reflow, opens or shorts, voiding and raw material evaluations.
https://www.ascen.ltd/Products/Solder_paste_printer/513.html full auto PCB screen printer and SMT solder paste printing machine with Image and optical system,It is a very accurate fully automatic SMT stencil printer.automatic PCB screen printer main
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
Training Courses | | | PCB Inspection Courses
The PCB inspection courses focus on improving PCB yield and reliability through validation and detection of defects on electronics assemblies.
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Events Calendar | Tue Apr 06 00:00:00 EDT 2021 - Tue Apr 06 00:00:00 EDT 2021 | ,
Capital Chapter Webinar: Next Gen Lead Free Solders for High Reliability & SMT Yield improvement
Events Calendar | Mon Apr 12 00:00:00 EDT 2021 - Mon Apr 12 00:00:00 EDT 2021 | ,
Europe Chapter Webinar: Tombstoning Components during Reflow Soldering - Causes & Cures
Career Center | South Plainfield, New Jersey USA | Research and Development
Alpha Assembly Solutions, a MacDermid Performance Solutions Business and a world leader in the development, manufacturing, and sales of innovative materials used in the assembly electronics, industrial joining and Photo Voltaic market places, is seek
Career Center | South Plainfield, New Jersey USA | Research and Development
Alpha Assembly Solutions, a MacDermid Performance Solutions Business and a world leader in the development, manufacturing, and sales of innovative materials used in the assembly electronics, industrial joining and Photo Voltaic market places, is seek
Career Center | , India | Engineering,Maintenance,Production,Technical Support
Hands on experience in PLC based machine, DEK Printer Machine, Camlot Glue dot machine, Fuji NXT, SPI machine, reflow: Vitronics XPM2/3, Expertise in SMT Profiling Qualification & NPI Build, Soldering defects, Analysis & rework. Line modifi
Career Center | Poplar Grove, Illinois | Engineering,Production,Quality Control,Technical Support
Please see resume.
SMT Express, Volume 4, Issue No. 5 - from SMTnet.com Volume 4, Issue No. 5 Thursday, May 23, 2002 Featured Article Return to Front Page Book Review Reviewed by Dave Fish (davef ), Pandion Electronics, Inc. Title: Reflow Soldering
SMTnet Express, September 16, 2021, Subscribers: 26,691, Companies: 11,438, Users: 26,841 Mathematical Model For Dynamic Force Analysis Of Printed Circuit Boards Mathematical model for dynamic force analysis of printed circuit
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LED Bulb Production Line in Egypt and Market Analysis - I.C.T SMT Machine English Bahasa indonesia Сербия Česky Dansk Deutsch Español
Baja Bid | https://bajabid.com/product/2016-cyberoptics-se600-solder-paste-inspection/
2016 CyberOptics SESE600 3D Solder Paste Inspection Solder Paste Inspection - Baja Bid LLC Skip to content Your EMS Asset Management Partner Careers
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