Industry Directory | Manufacturer
Nordson Electronics Solutions makes reliable electronics an everyday reality. Our ASYMTEK, MARCH, and SELECT brands deliver precision fluid dispensing, conformal coating, plasma treatment and selective soldering equipment.
Industry Directory | Manufacturer
I.C.T is a manufacturer from China that offers SMT, DIP, PCBA conformal coating equipment and turnkey solution.
Flux Free Formic Reflow Reflow in Formic Acid Vapor Heller has designed and built an production ready horizontal reflow oven for formic acid vapor. This new oven has been designed to meet Semi S2/S8 safety standards (including toxic gases). Form
When Applications Require Large Board Processing &/or Versatility The DS Series of dispensers is a robust, large format platform designed to handle all types of applications with ease. Ideal for dispense applications utilizing adhesive, solder paste
Electronics Forum | Tue Jul 28 13:27:31 EDT 2009 | davef
It's possible that there is limited application of "3M™ XYZ-Axis Electrically Conductive Adhesive Transfer Tape 9719" similar to your intended use. What do 3M™ application types say? Certainly high temperature soldering would make a mess of a piezoc
Electronics Forum | Sun Aug 02 19:47:16 EDT 2009 | isd_jwendell
Now that I've seen the pics... Soldering could work just fine. If you are going for large production then you could get copper discs cut and mounted in tape carrier ($$). This would make it very easy for automated equipment to assemble. Mounting a
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Used SMT Equipment | Solder Paste Mixers
Name:YV100Xg Placement Speed: 20000cph(0.18sec/chip) Placement Station:100 PCB Dimensions: 460*335 Applicable elements: 0201 chip ~32mm elements Accuracy: ±0.05mm Power Supply:3 PH, 200-415V,4.4KVA Machine Dimensions: 1650*1408*1850
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Used SMT Equipment | Solder Paste Mixers
Name:YV100Xg Placement Speed: 20000cph(0.18sec/chip) Placement Station:100 PCB Dimensions: 460*335 Applicable elements: 0201 chip ~32mm elements Accuracy: ±0.05mm Power Supply:3 PH, 200-415V,4.4KVA Machine Dimensions: 1650*1408*1850
Industry News | 2021-04-14 10:42:33.0
The 2021 Service Excellence Award for Soldering Equipment was given to Heller Industries. Circuits Assembly recognizes companies that receive the highest customer service ratings, as judged by their own customers.
Industry News | 2013-05-21 22:12:09.0
Based on its recent analysis of the surface mount technology (SMT) reflow soldering equipment market, Frost & Sullivan recognizes Heller Industries, Inc. with the 2013 Global Frost & Sullivan Award for Market Share Leadership.
Parts & Supplies | SPI / Solder Paste Inspection
Quick programming, friendly programming interface Multiple measurement methods True one-button measurement Eight-way motion button, one-click focus Adjustable scanning pitch Solder paste 3D simulation function Powerful SPC function MARK
Parts & Supplies | Pick and Place/Feeders
The definition of SMT SMT is the surface assembly technology,surface mount technology(surface mount technology)(Surface Mounted Technology abbreviation),is currently the most popular electronic assembly industry,a technology and technology. What a
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Technical Library | 2023-01-17 17:12:33.0
Reflowed indium metal has for decades been the standard for solder thermal interface materials (solder TIMs or sTIMs) in most high-performance computing (HPC) TIM1 applications. The IEEE Heterogeneous Integration Thermal roadmap states that new thermal interface materials solutions must provide a path to the successful application of increased total-package die areas up to 100cm2. While GPU architectures are relatively isothermal during usage, CPU hotspots in complex heterogeneously-integrated modules will need to be able to handle heat flux hotspots up to 1000W/cm2 within the next two years. Indium and its alloys are used as reflowed solder thermal interface materials in both CPU and GPU "die to lid/heat spreader" (TIM1) applications. Their high bulk thermal conductivity and proven long-term reliability suit them well for extreme thermomechanical stresses. Voiding is the most important failure mode and has been studied by x-ray. The effects of surface pretreatment, pressure during reflow, solder flux type/fluxless processing, and preform design parameters, such as alloy type, are also examined. The paper includes data on both vacuum and pressure (autoclave) reflow of sTIMs, which is becoming necessary to meet upcoming requirements for ultralow voiding in some instances.
Nano-copper sintering in formic acid vapor.
1809 MK5 - Heller Advanced In-Line Vacuum Reflow Oven Nitrogen System with Balanced Flow Technology 9 Top And Bottom Heated Zones - highest zone count per linear foot in the industry! 100" Heated Length - for super throughput! 2 Internal C
Training Courses | | | IPC J-STD-001 Specialist (CIS)
The Certified IPC J-STD-001 Specialist (CIS) training focuses on the knowledge and hand skills employees need to produce high-quality soldered interconnections.
Training Courses | | | IPC J-STD-001 Space Specialist (CIS)
The J-STD-001 Space Addendum is an additional optional module for the Certified IPC J-STD-001 CIS (Specialist) program for organizations that are required to meet these additional requirements.
Events Calendar | Wed Apr 18 00:00:00 EDT 2018 - Thu Apr 19 00:00:00 EDT 2018 | ,
Stencil Printing Process and Solder Paste Inspection – An In-Depth Look - SMTA Webtorial
Events Calendar | Thu Oct 21 00:00:00 EDT 2021 - Thu Oct 21 00:00:00 EDT 2021 | ,
Great Lakes Chapter Webinar: Low Melting Alloy & Selection of the Right Chemistry for Reliability
Career Center | Huntsville, Alabama USA | Production,Technical Support
Seasoned SMT assembly/soldering specialist with Fuji equipment experience. A solid understanding of soldering/paste application technologies and equipment is desired.
Career Center | Clinton, Connecticut USA | Production
Assembler position available for contract manufacturer of printed circuit board assemblies. Includes soldering and mechanical assembly. Full time position with good benefits. Higher pay for those applicants that have or can display soldering skills.
Career Center | Madurai, India | Engineering,Production
I have 1.6 years of experience in SMT as team leader I have manage 40 member in our company we production team leaders must check the loading materials first then the quality team will check.. And I have a knowledge in Quality too..
Career Center | Delton, Michigan USA | Engineering,Maintenance,Production,Technical Support
IPC Master instructor with a number of years experience in Engineering as well as Machine technician.
GPD Global | https://www.gpd-global.com/map-application-solutions.php
Precision Fluid Dispensing Application Solutions Home Products Fluid Dispensing Equipment High Precision Dispenser -MAX Series Large Format Board Dispensing -DS Series Table Top Dispensing Equipment Loader
Heller Industries Inc. | https://hellerindustries.com/grainy-solder/
Grainy Solder Phone 1-973-377-6800 Company About News Events New Equipment Convection Reflow Ovens Reflow Oven MK7 -New! Dual Lane, Dual Temperature Reflow Oven Pressure Curing Ovens
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