Industry Directory | Consultant / Service Provider / Distributor / Equipment Dealer / Broker / Auctions / Manufacturer / Manufacturer's Representative
DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD is a company which mainly provide used and new SMT parts, provide repair SMT key parts service,new/used SMT machine trading,SMT consumables and Peripherals equipment,Clean room, ESD..
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Industry Directory | Equipment Dealer / Broker / Auctions
Buyer, Seller, Broker of Electronic Assembly Equipment
New Equipment | Assembly Services
G9 + automatic vision printing machine is a new product for SMT high-end application field, which can perfectly meet the process requirements of 03015, 0.25pich and other fine spacing, high precision and high speed. Introduction to standard function
Type no ： K-MC8835 Heating parameters Number of heating zones：On 8 August Length of heating zone：2850mm Heating mode：Hot air Number of cooling zones ：1 Send some parameters Mesh belt width ：350mm Transport direction： Left and right Belt hei
Electronics Forum | Thu Aug 24 14:42:30 EDT 2006 | any
y we had solder ball after reflow owen?
Electronics Forum | Thu Aug 24 15:37:50 EDT 2006 | Chunks
Hi Any, This is from an earlies thread "Solder Ball After Reflow Process". Date: August 16, 2006 01:52 PM Author: Russ Subject: Solder Ball After Reflow Process Oven settings are meaningless here. What does the board see? It is the paste we a
Used SMT Equipment | Soldering - Reflow
Vintage: 2015 (90% look new after reconditioned). 2 units available. PCB flow ：Left to right. Excellent condition. Ex-work / Penang, Malaysia. Available for inspection prior to shipment.
Used SMT Equipment | Chipshooters / Chip Mounters
KE3010 High-speed Placement Machine JUKI KE3010 High-speed Placement Machine Our main products are [second-hand high-speed placement machine, smt second-hand placement machine, second-hand automatic placement machine, reflow, JUKI placement machin
Industry News | 2023-10-18 17:43:18.0
HELLER's High UPH Vacuum Reflow Oven clinched the coveted "Step-by-Step Excellence Awards" - Innovation Award owing to its industry-leading product strength and outstanding performance.
Industry News | 2005-09-19 16:07:56.0
No higher temperature and No process changes needed
Parts & Supplies | Pick and Place/Feeders
CP45 Filter Part No:N454ZX11-049-001 Our company products fields : 1.used SMT machines , peripheral equipments and spare parts : SMT feeders, nozzles, belts, filters, motors, boards, Cylinders,Guides, Feeder parts etc... (Mainly parts brand
Parts & Supplies | SMT Equipment
SAMSUNG SMT MARGINAL RAY CP40LV VACUUM GENERATOR Our company products fields : 1.used SMT machines , peripheral equipments and spare parts : SMT feeders, nozzles, belts, filters, motors, boards, Cylinders,Guides, Feeder parts etc... (Mainly par
Technical Library | 2023-01-17 17:19:44.0
A test program was developed to evaluate the effectiveness of vacuum reflow processing on solder joint voiding and subsequent thermal cycling performance. Area array package test vehicles were assembled using conventional reflow processing and a solder paste that generated substantial void content in the solder joints. Half of the population of test vehicles then were re-processed (reflowed) using vacuum reflow. Transmission x-ray inspection showed a significant reduction in solder voiding after vacuum processing. The solder attachment reliability of the conventional and vacuum reflowed test vehicles was characterized and compared using two different accelerated thermal cycling profiles. The thermal cycling results are discussed in terms of the general impact of voiding on solder thermal fatigue reliability, results from the open literature, and the evolving industry standards for solder voiding. Recommendations are made for further work based on other void reduction methods and additional reliability studies.
Technical Library | 2023-01-17 17:27:13.0
Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305) solder joint shear force. Specifically, the effect of the reflow peak temperature and time above solder liquidus temperature are studied. Nine reflow profiles for SAC 305 and nine reflow profiles for SnPb have been developed with three levels of peak temperature (230 o C, 240 o C, and 250 o C for SAC 305; and 195 o C, 205 o C, and 215 o C for SnPb) and three levels of time above solder liquidus temperature (30 sec., 60 sec., and 90 sec.). The shear force data of four different sizes of chip resistors (1206, 0805, 0603, and 0402) are compared across the different profiles. The shear force of the resistors is measured at time 0 (right after assembly). The fracture surfaces have been studied using a scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS)
PCB magazine unloader/Multi magazine unloader how to receive the PCB after soldering, more detail check :https://www.ascen.ltd/Products/Automatic_SMT_equipment/PCB_loader/91.html Multi Magazine PCB unloader is used at the end of the SMT line for unlo
PCB magazine unloader/Multi magazine unloader how to receive the PCB after soldering, more detail check :https://www.ascen.ltd/Products/Automatic_SMT_equipment/PCB_loader/91.html Multi Magazine PCB unloader is used at the end of the SMT line for unlo
Training Courses | ONLINE | ON DEMAND | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Events Calendar | Mon Mar 16 00:00:00 EDT 2020 - Mon Mar 16 00:00:00 EDT 2020 | ,
BGA & Area Array Failures, Causes & Corrective Actions Online Webinar
Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,
IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2
Career Center | Fremont, California USA | Production,Quality Control
Local industry leading EMS Company seeking SMT operators. Will be doing SMT line Change overs, SMT machine operation for solder printing, placement, reflow. Solder paste height measurement and record. Solder printing quality check after solder paste
Career Center | Boulder, Colorado USA | Engineering,Production,Quality Control
Senior-level micro-electronic technician capable of independent manufacture of custom hybrids, focal plane assemblies, and prototype detector assemblies in cleanroom environment (in Advanced Packaging and Detector Laboratory). MINIMUM QUALIFICATIONS
Career Center | , | Engineering,Production
Project Management, SMT Process Engineering
Career Center | , Israel | Engineering,Maintenance,Technical Support
I was born on June , 1972 in Khmelnitsky city , Ukraine . I am male. From 1979 to 1987 I was studying at secondary school #7, having finished which I entered the Technical College of Khmelnitsky in specialty Machine Tools with Computer Numeric Contr
Reliability of BGA Solder Joints after Re-Balling Process SMTnet Express October 4, 2012, Subscribers: 25550, Members: Companies: 9004, Users: 33746 Reliability of BGA Solder Joints after Re-Balling Process First published in the 2012 IPC APEX EXPO
| http://etasmt.com/cc?ID=te_news_bulletin,23568&url=_print
Solder Ball Defects-News-Reflow oven,SMT Reflow Soldering Oven-cmsadmin Reflow oven,SMT Reflow Soldering Oven 当前位置: Home >> News >> News Solder Ball Defects Solder Ball Defects Defect
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/ball-shear-solder-ball-shear?con=t&page=4
). Surface-mount technology has been the primary device attachment method for a wide variety of… Correlating the Presence of Popcorned BGA Devices Post Reflow with solder-ball diameter measurements from X-ray Inspection Nordson DAGE Micro Materials Testing Brochure Nordson DAGE Micro Testing
