New Equipment | Solder Paste Stencils
Eliminate hours of solder mask damage repair time for bga sites while improving rework yield. Are you frustrated by the time it takes to repair mask damage underneath the BGA during the rework process? Are you squeezed for space on the PCB in an
New Equipment | Cleaning Agents
AQUANOX® A4241 is an aqueous cleaning solution designed with revolutionary inhibition technology to be effective on the toughest soils while protecting even the most sensitive parts from etch or darkening. AQUANOX® A4241can be used in multi-p
Electronics Forum | Tue Sep 23 20:56:08 EDT 2008 | davef
For additional information, download IPC-7526 - Stencil and Misprinted Board Cleaning Handbook http://www.ipc.org/html/IPC-7526.pdf
Electronics Forum | Tue Sep 23 07:27:31 EDT 2008 | realchunks
Do not wipe the board at first before putting it in your cleaner. It will leave more paste in your tank, but you won't smear it into every corner of your solder resist. We found that only our stencil cleaner would clean a board properly and leave n
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Industry News | 2009-08-19 19:55:21.0
EAST WINDSOR, CT — August 2009 — High-Tech Conversions Inc., a manufacturer of high-quality wiping products and a supplier of consumable items used in cleanrooms, assembly lines, laboratories and manufacturing, announces that its GREEN MONSTER formulation has the abrasion resistance to withstand the high friction caused by the wiping action, the integrity to resist fibers from being pulled off by sticky solder paste, and the toughness to withstand the harsh scraping and grating action caused by the stencil’s apertures.
Technical Library | 2015-12-31 15:19:28.0
Today's consumer electronic product are characterized by miniatuization, portability and light weight with high performance, especially for 3G mobile products. In the future more fine pitch CSPs (0.4mm) component will be required. However, the product reliability has been a big challenge with the fine pitch CSP. Firstly, the fine pitch CSPs are with smaller solder balls of 0.25mm diameter or even smaller. The small solder ball and pad size do weaken the solder connection and the adhesion of the pad and substrate, thus the pad will peel off easily from the PCB substrate. In addition, miniature solder joint reduce the strength during mechanical vibration, thermal shock, fatigue failure, etc. Secondly, applying sufficient solder paste evenly on the small pad of the CSP is difficult because stencil opening is only 0.25mm or less. This issue can be solved using the high end type of stencil such as Electroforming which will increase the cost.
Technical Library | 2023-05-22 16:49:42.0
Our customers' issues • Apertures are getting smaller • Paste does not release as well • Contaminates the bottom of the stencil • Increases defects / reduces yield Insufficient solder Bridging Solder balls on surface of PCB Flux residue • Requires more frequent cleaning • Reduced efficiency (wasted time) • Increased use of consumables (cost) USC fabric (use "cheap" fabric to reduce cost) Lint creates more defects Cleaning chemistries (use IPA to reduce cost) IPA breaks down flux and can create more defects
DIP Double-side Camera Online AOI Machine ETA-V5300 If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. solder paste inspection,SMT SPI,SPI mac
1200MM/1500MM Online SPI , Big Size Solder Paste Inspection Machine mail: sales@smtlinemachine.com whatapp/wechat:+8613537875415 Specification: 技术参数/Parameters 技术平台/Technology Platform super big size platform 适用
Events Calendar | Tue Apr 13 00:00:00 EDT 2021 - Tue Apr 13 00:00:00 EDT 2021 | ,
Boston Chapter Webinar: Cleaning Chemistry For PWB and Rework - Part 2, session 1
Events Calendar | Tue Apr 13 00:00:00 EDT 2021 - Tue Apr 13 00:00:00 EDT 2021 | ,
Boston Chapter Webinar: Cleaning Chemistry For PWB and Rework - Part 2, session 2
Career Center | san diego,, California USA | Engineering,Production,Quality Control,Technical Support
SMT Process Engineer, ISO-9001, IPC-600/610/620/7711/7721, J-STD-001, Thermal profiling, Lean manufacturing.
SMTnet Express, March 06, 2014, Subscribers: 22524, Members: Companies: 13810, Users: 35835 Investigation and Development of Tin-Lead and Lead-Free Solder Pastes to Reduce the Head-In-Pillow Component Soldering Defect. Jasbir Bath, Roberto Garcia
Imagineering, Inc. | https://www.pcbnet.com/blog/how-to-prevent-a-solder-ball-defect/
. To resolve this, ensure that your ramp-up is less than 1.5°C/sec from average room temperature to 150°C. Solder Ball Removal Spray in air systems are the best method for removing solder ball contamination
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COT specializes in high quality SMT nozzles and consumables for pick and place machines. We provide special engineering design service of custom nozzles for those unique and odd components.
2481 Hilton Drive
Gainesville, GA USA
Phone: (770) 538-0411
