We Offer: Robotic and semi-automatic hot solder dipping, Precision lead forming of critical devices, Tape-and-reel packaging, State-of-the-art Ball Grid Array (BGA) reflow process
Industry Directory | Equipment Dealer / Broker / Auctions
CMTec is highly specialized in dealing with assembly equipment. We support BESI (ESEC, Datacon), Kulicke & Soffa, Hesse & Knipps, F&K Delvotec, Orthodyne, ASM, Dage and others. CMTec delivers 'turn-key' projects worldwide.
New Equipment | Assembly Services
G9 + automatic vision printing machine is a new product for SMT high-end application field, which can perfectly meet the process requirements of 03015, 0.25pich and other fine spacing, high precision and high speed. Introduction to standard function
New Equipment | Cleaning Equipment
Features: 1. A comprehensive cleaning system: the surface of the product residues of organic matter, inorganic substances for thorough and effective cleaning; 2. Automatic cleaning mode: in a clean room to complete the cleaning, rinsing, drying all
Electronics Forum | Thu Jan 02 10:31:48 EST 2020 | slthomas
It is strange that you're having issues while using the same process parameters (including stencil) that worked successfully before. It doesn't guarantee that it's not one of those parameters changing in a manner that's not apparent, but it does sugg
Electronics Forum | Thu Jan 31 04:48:04 EST 2002 | yaq
Hi, Has anyone done some research (measurement/simulation) on the effect of PWB vias on solder ball temperature of the component? Would this have some effect on solder joint reliability especially during power cycling? Any comments will be appreciat
Used SMT Equipment | AOI / Automated Optical Inspection
OMRON AOI VT-S720-A MACHINE Hardware Configuration Image signal input unit Main unit Power supply Air Camera Illumination Image resolution Feed method Line height PCB carrier width adjustment Ambient operating temperature Ambient opera
Used SMT Equipment | Coating and Encapsulation
Reflow oven by Technoprint in good condition. Technoprint Mistral 260 Product information: Forced air convection reflow oven heat to maximum temperatures of up to 300°C. Forced air convection provides uniform heating and prevents shadowing. Th
Industry News | 2005-09-19 16:07:56.0
No higher temperature and No process changes needed
Industry News | 2018-07-16 17:50:00.0
Side View Camera now available with all BGA Rework Stations
Parts & Supplies | Pick and Place/Feeders
KHY-M221A-A0 KGT-M221A-A0 YAMAHA YG12 tank chain gland KHY-M2267-00 YG12 tank chain YS12 towline keel X axis PISCO SP2550 R75 KHY-M2276-S0 YS12 screw X-axis YG12 X-axis screw YG12F YS12F screw guide KHY-M371R-00 RAIL GUIDE 12P YS24 YS100 Feida pl
Parts & Supplies | Repair/Rework
Three independent heaters control systems. FG-P6000 is available heating portion of the PCB board by hot-air circulate both from top and bottom at the same time. With large IR bottom heating, it can completely avoid PCB deformation during reworking
Technical Library | 2023-01-17 17:22:28.0
The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.
Technical Library | 2015-11-19 18:15:07.0
The move to lead free (Pb-free) electronics by the commercial industry has resulted in an increasing number of ball grid array components (BGAs) which are only available with Pb-free solder balls. The reliability of these devices is not well established when assembled using a standard tin-lead (SnPb) solder paste and reflow profile, known as a backward compatible process. Previous studies in processing mixed alloy solder joints have demonstrated the importance of using a reflow temperature high enough to achieve complete mixing of the SnPb solder paste with the Pb-free solder ball. Research has indicated that complete mixing can occur below the melting point of the Pb-free alloy and is dependent on a number of factors including solder ball composition, solder ball to solder paste ratio, and peak reflow times and temperatures. Increasing the lead content in the system enables full mixing of the solder joint with a reduced peak reflow temperature, however, previous research is conflicting regarding the effect that lead percentage has on solder joint reliability in this mixed alloy solder joint.
BGA component installation demo with the Shuttle Star SV560 that has the Side View Camera option.
Lyra Reflow Oven is a soft soldering that realizes the mechanical and electrical connection between the solder ends of surface mount components or the pins and the printed board pads by remelting the solder paste pre-distributed on the printed board
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,
IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2
Events Calendar | Mon May 04 00:00:00 EDT 2020 - Mon May 04 00:00:00 EDT 2020 | ,
Ball Grid Array Rework - How to Do It Successfully
Career Center | Sta. Rosa, Philippines | Maintenance,Production,Technical Support
Complete knowledge in smt,aoi and reflow. 11 years working experienced in production and 5 years experienced in the field service job.
Career Center | Sta. Rosa, Manila Philippines | Technical Support
I am in the field of smt equipment for 15 years already and at present i am working as a Service Engineer for High Speed mounter machines . Our Company is solly Sales & Service providers of all pcb assembly and semiconductor equipment. I do inter
Featured Article Return to Front Page Soldering Technolo
How to Profile a PCB News Forums SMT Equipment Company Directory Calendar Career Center Advertising About FREE Company Listing! How to Profile a PCB Especially with the new lead free solders, getting the correct temperature
Imagineering, Inc. | https://www.pcbnet.com/blog/how-to-prevent-a-solder-ball-defect/
. To resolve this, ensure that your ramp-up is less than 1.5°C/sec from average room temperature to 150°C. Solder Ball Removal Spray in air systems are the best method for removing solder ball contamination
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