Industry Directory | Manufacturer
Reflow ovens for automated SMT PCB assembly, specializing in lead free processing and nitrogen reflow. The best convection reflow ovens on the market.
Industry Directory | Consultant / Service Provider / Distributor / Equipment Dealer / Broker / Auctions / Manufacturer / Manufacturer's Representative
DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD is a company which mainly provide used and new SMT parts, provide repair SMT key parts service,new/used SMT machine trading,SMT consumables and Peripherals equipment,Clean room, ESD..
New Equipment | Education/Training
Blackfox’s Lead Free Soldering series minimizes the risks of conversion, and gives you the confidence to introduce lead free products and services quickly, with highest quality. The lead free certification program offers the latest requirements for S
New Equipment | Education/Training
IPC - Association Connecting Electronics Industries® offers globally recognized industry-traceable training and certification programs on key Electronics Industry Standards. Blackfox, founded in 1996, is the premier Worldwide Approved IPC Training Ce
Electronics Forum | Mon Jul 16 15:49:33 EDT 2001 | Steve
The solder balls you are talking about are caused by too much paste. Reduce the size of the stencil aperatures. Concerning removing the solder balls, the first thing you need to ask yourself is, do I need to remove them. IPC-610, 12.4.10 states, "Ac
Electronics Forum | Mon Nov 02 17:45:46 EST 1998 | ChrisK
In my experience, solder balls are normally caused by only a few things. In order of likelyhood: 1) Water based fluxes (VOC-Free)not having the water carrier completely dried from the board before going into the solder. I.E, too fast conveyor spee
Used SMT Equipment | Screen Printers
2006 DEK Horizon 01i Screen Printer 2D Solder Paste Inspection Green Camera S/W: 08 SPOS (930 B01) Accepts both [23" x 23"] & [29" x 29"] Stencils Manual Included Power: 230VAC; 1 Phase
Used SMT Equipment | AOI / Automated Optical Inspection
YesTech YTV-F1 Automated PCB Inspection System >Multi-function all purpose In-Line system • (2) Top-down Cameras; Incl. (1) High Magnification • (4) side viewing cameras • LED top light, bi-color multiangle LED lighting •
Industry News | 2003-01-27 10:27:31.0
At a New Facility Within the Company's U.S. Headquarters
Industry News | 2003-06-10 08:16:44.0
The following text describes the application of NWA Quality Analyst to quality control in the assembly of electronic components.
Parts & Supplies | Other Equipment
Automtaic PCB Lead Cutter, Lead Cutting Machine FEATHERS The eagle claw shrapnel clamp can nip PC boards tightly and push them forward automatically and stably. The track board-delivery speed can be adjusted according to pins to increase t
Parts & Supplies | Other Equipment
Automtaic PCB Lead Cutter, Lead Cutting Machine FEATHERS The eagle claw shrapnel clamp can nip PC boards tightly and push them forward automatically and stably. The track board-delivery speed can be adjusted according to pins to increase t
Technical Library | 2023-01-17 18:04:51.0
As a manufacturing technology, SMT has acquired a "heritage" of widely accepted assumptions about its processes. However, yesterday'spractices are continually confronted by the shifting paradigms of today's production line.
Technical Library | 2023-01-17 17:22:28.0
The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.
BGA component installation demo with the Shuttle Star SV560 that has the Side View Camera option.
Amid the COVID 19 crisis, Precision PCB Sevices, Inc. remains open and cable to provide quick turn BGA Rework and Reballing Services with offices in Northern Californa and Dallas, Texas. Today are introducing our new Side View Camera for BGA Rework
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,
IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2
Events Calendar | Tue Sep 10 00:00:00 EDT 2019 - Tue Sep 10 00:00:00 EDT 2019 | Huntsville, Alabama USA
IPC Tech Ed - Process and Acceptability Requirements: Utilizing J-STD-001 and IPC-A-610 Together
Career Center | Milpitas, California USA | Engineering,Production,Quality Control,Research and Development,Technical Support
Winslow Automation, Inc. (aka Six Sigma), an industry leader in electronic component interconnect technology & related test and failure analysis services, is seeking individuals specializing in materials lab testing to join our team. We have openin
Career Center | Philadelphia, New Jersey USA | Sales/Marketing
LOCATION BASE SALARY USA - NJ - Central USA - NJ - Southern USA - PA - Philadelphia $67000 - 73000 Another $50K to $70K in commissions based on plan COMPANY BRIEF My client is a leading supplier of automated broadband communications assembly e
Career Center | , | Engineering,Production
Project Management, SMT Process Engineering
Career Center | Phoenix, Arizona | Engineering,Management,Production,Quality Control,Research and Development,Sales/Marketing,Technical Support
• Highly motivated, solution oriented professional with proven record synergizing scientific, engineering, and business administration backgrounds to drive and sustain customer satisfaction and long term improvements. • Articulate communicator that a
SMT Express, Volume 2, Issue No. 3 - from SMTnet.com Volume 2, Issue No. 3 Thursday, March 16, 2000 Featured Article Return to Front Page Curtailing Voids in Fine Pitch Ball Grid Array Solder Joints by Gary Morrison and Kevin Lyne
A New Stencil Rulebook for Wafer Level Solder Ball Placement using High Accuracy Screen Printing A New Stencil Rulebook for Wafer Level Solder Ball Placement using High Accuracy Screen Printing Printer-hosted processes for solder ball placement
| https://www.eptac.com/webinars/hot-topics-solder-mask-bubbles-and-mask-flaking-solder-balls-rohs-cable-coating-and-more/
Hot Topics: Solder Mask Bubbles and Mask Flaking, Solder Balls, RoHS Cable Coating and More - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
Heller Industries Inc. | https://hellerindustries.com/solder-balls-defects/
Solder Ball Defects - Heller Home » Solder Ball Defects Re-printed in partnership with ITM Solder Ball Defects Defect: solder balls Solder balls are very small fines of solder that have separated from the main body that forms the joint
