Industry Directory: solder balls criteria (34)

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Industry Directory | Consultant / Service Provider / Distributor / Equipment Dealer / Broker / Auctions / Manufacturer / Manufacturer's Representative

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD is a company which mainly provide used and new SMT parts, provide repair SMT key parts service,new/used SMT machine trading,SMT consumables and Peripherals equipment,Clean room, ESD..

Max Top Company

Industry Directory |

Solder Wire, Solder Bar, Solder Paste, Solder Ball

New SMT Equipment: solder balls criteria (152)

IPC Certification

IPC Certification

New Equipment | Education/Training

IPC - Association Connecting Electronics Industries® offers globally recognized industry-traceable training and certification programs on key Electronics Industry Standards. Blackfox, founded in 1996, is the premier Worldwide Approved IPC Training Ce

Blackfox Training Institute, LLC

IPC-A-610D - Acceptability of Electronic Assemblies - 1 Day Classes

New Equipment | Education/Training

This latest version D of the IPC-A-610 released in  Released February 2005,  Presented in a one day class this is a must for all quality assurance and assembly departments.  IPC-A-610D illustrates industry-accepted workmanship criteria for electronic

Precision PCB Services, Inc

Electronics Forum: solder balls criteria (2379)

Leadless(passives) solder joint criteria

Electronics Forum | Fri Sep 29 13:51:46 EDT 2000 | C. Ortner

We work in a "low" volume high reliability house building mixed tech double sided multi layer CCA's for long lived space applications. Our present problem is inspection questioning every dimple/anomaly on every leadless part(we put passives only thr

Solder balls

Electronics Forum | Tue Jul 06 10:46:12 EDT 2004 | blnorman

We have now switched to Kester EP256. During our solder paste evaluation, resistance to humidity was one of the selection criteria. We printed multiple boards, then exposed them to 85�F/65% RH. At 30 minutes, 1 hour, 2 hours, and 4 hours exposure

Used SMT Equipment: solder balls criteria (31)

YesTech YTV-F1

YesTech YTV-F1

Used SMT Equipment | AOI / Automated Optical Inspection

YesTech YTV-F1 Automated PCB Inspection System >Multi-function all purpose In-Line system • (2) Top-down Cameras; Incl. (1) High Magnification • (4) side viewing cameras • LED top light, bi-color multiangle LED lighting •

Baja Bid

YesTech YTV-F1

YesTech YTV-F1

Used SMT Equipment | AOI / Automated Optical Inspection

YesTech YTV-F1 Automated PCB Inspection System >Multi-function all purpose In-Line system • (2) Top-down Cameras; Incl. (1) High Magnification • (4) side viewing cameras • LED top light, bi-color multiangle LED lighting •

Baja Bid

Industry News: solder balls criteria (671)

Parts & Supplies: solder balls criteria (36)

KIC KIC X5 Thermal Profiler with SPC software and RF capability For Reflow

KIC KIC X5 Thermal Profiler with SPC software and RF capability For Reflow

Parts & Supplies | Assembly Accessories

Detailed Product Description Features: 7 Channel Brand: KIC Part Name: X5 Reflow Profiler Model: X5 Condition: Original New Leadtime: 7days KIC X5 Thermal Profiler with SPC software and RF capability For Reflow Track More Data Points With 7,

KingFei SMT Tech

Yamaha Automatic PCB Lead Cutter

Parts & Supplies | Other Equipment

Automtaic PCB Lead Cutter, Lead Cutting Machine   FEATHERS    The eagle claw shrapnel clamp can nip PC boards tightly and push them forward automatically and stably. The track board-delivery speed can be adjusted according to pins to increase t

QYSMT SOLUTION USA LLC / Qinyi Electronics Co.,Ltd

Technical Library: solder balls criteria (51)

THE LAST WILL AND TESTAMENT OF THE BGA VOID

Technical Library | 2023-01-17 17:22:28.0

The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.

Heller Industries Inc.

Surface Insulation Resistance (SIR) Testing

Technical Library | 2007-02-01 09:36:26.0

Purpose: Compare the Surface Insulation Resistance of reworked BGA Test samples made with standard solder balls using a flux only reattachment and samples made including the StencilQuik™ product from Best Inc. with solder balls using a flux only reattachment.

BEST Inc.

Videos: solder balls criteria (340)

Shuttle Star BGA Rework Station Features Side View Camera

Shuttle Star BGA Rework Station Features Side View Camera

Videos

BGA component installation demo with the Shuttle Star SV560 that has the Side View Camera option.

Precision PCB Services, Inc

Precision PCB Services, Inc. Introduces Side View Camera for BGA Inspection

Precision PCB Services, Inc. Introduces Side View Camera for BGA Inspection

Videos

Amid the COVID 19 crisis, Precision PCB Sevices, Inc. remains open and cable to provide quick turn BGA Rework and Reballing Services with offices in Northern Californa and Dallas, Texas. Today are introducing our new Side View Camera for BGA Rework

Precision PCB Services, Inc

Training Courses: solder balls criteria (718)

IPC J-STD-001 Trainer (CIT) Certification Training Course

Training Courses | | | IPC J-STD-001 Trainer (CIT)

The Certified IPC J-STD-001 Trainer (CIT) courses prepare individuals as qualified trainers in the area of producing high quality soldered interconnections and prepares them to deliver Certified IPC J-STD-001 Specialist (CIS) training.

Blackfox Training Institute, LLC

IPC J-STD-001 Space Addendum Trainer (CIT) Certification Training Course

Training Courses | | | IPC J-STD-001 Space Trainer (CIT)

The IPC J-STD-001 Space Addendum (CIT) certification courses allow individuals to conduct Certified IPC J-STD-001 Space Addendum Specialist (CIS) training.

Blackfox Training Institute, LLC

Events Calendar: solder balls criteria (15)

Solder Paste Qualification Testing - SMTA Webinar

Events Calendar | Wed Mar 07 00:00:00 EST 2018 - Wed Mar 07 00:00:00 EST 2018 | ,

Solder Paste Qualification Testing - SMTA Webinar

Surface Mount Technology Association (SMTA)

IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2

Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,

IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2

Association Connecting Electronics Industries (IPC)

Career Center - Jobs: solder balls criteria (19)

Mid-Atlantic Regional Sales Manager

Career Center | Philadelphia, New Jersey USA | Sales/Marketing

LOCATION BASE SALARY USA - NJ - Central USA - NJ - Southern USA - PA - Philadelphia $67000 - 73000 Another $50K to $70K in commissions based on plan COMPANY BRIEF My client is a leading supplier of automated broadband communications assembly e

Electronics Search Group of MRI

WAVE SOLDER

Career Center | Oakville, Ontario Canada | Production

Technicians / Technologists To help us continue setting the pace in a rapidly changing manufacturing environment, we need people to operate state of the art manufacturing equipment, perform failure analysis and quality inspection on a wide variety o

XLTEK

Career Center - Resumes: solder balls criteria (12)

Debug engineer or bga rework engineer

Career Center | banaglore, karnataka India | Maintenance,Production,Quality Control,Technical Support

tel u later

Project Manager - Electronics Products

Career Center | , | Engineering,Production

Project Management, SMT Process Engineering

Express Newsletter: solder balls criteria (988)

Inclusion Voiding in Gull Wing Solder Joints

Inclusion Voiding in Gull Wing Solder Joints SMTnet Express August 30, 2012, Subscribers: 25432, Members: Companies: 8960, Users: 33565 Inclusion Voiding in Gull Wing Solder Joints First published in the 2012 IPC APEX EXPO technical conference

Partner Websites: solder balls criteria (907)

Solder Ball Defects - Heller

Heller Industries Inc. | https://hellerindustries.com/solder-balls-defects/

Solder Ball Defects - Heller Home » Solder Ball Defects Re-printed in partnership with  ITM Solder Ball Defects Defect: solder balls Solder balls are very small fines of solder that have separated from the main body that forms the joint

Heller Industries Inc.


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consignment program

High Throughput Reflow Oven
Void Free Reflow Soldering

High Precision Fluid Dispensers
pressure curing ovens

World's Best Reflow Oven Customizable for Unique Applications
Fully Automatic BGA Rework Station

Reflow Soldering Oven & Pressure Curing Oven Manufacturer in India