Industry Directory: solder balls under capacitors (2)

SMT and PCB Assembly in Indonesia

Industry Directory | Manufacturer

PCB Assembly in Indonesia with ISO Certificate Are you looking for SMT and PCB Assembly ? We provide SMT and PCB Assembly service in Indonesia. Located at bonded zone West Java Indonesia. Suitable for export oriented market.

FAROAD

Industry Directory | Manufacturer

FAROAD, located in Shenzhen, China, has been acting professionally in SMT EQUIPMENT manufacture from the year 2006, concentrating on providing the finest quality equipment at an affordable price.

New SMT Equipment: solder balls under capacitors (33)

PCB Rework, PCB Repair Services

PCB Rework, PCB Repair Services

New Equipment | Rework & Repair Services

On the cutting edge of technology, we offer a full line of high tech services to assist contract manufacturer's and  product  research and developers.  Specializing in quick turn around times to help get your product to market on time. Training Serv

Precision PCB Services, Inc

BGA Rework Machine for soldering and desoldering.  Hot Air BGA rework station for printed circuit board repair.

BGA Rework Machine for soldering and desoldering. Hot Air BGA rework station for printed circuit board repair.

New Equipment | Rework & Repair Equipment

BGA Rework Stations from the BGA Experts with over 25 years rework process experience and customer support! For high volume BGA Rework on even the largest computer and networking boards! The model SV560A has a high resolution optical system for pla

Precision PCB Services, Inc

Electronics Forum: solder balls under capacitors (335)

Moisture under chip capacitors

Electronics Forum | Thu Sep 11 23:50:51 EDT 2003 | Dean

Epoxy is hydroscopic. A cavity will form when the cure furnace reaches the boiling point of water. The steam expansion creates the pocket. It can be large enough to be filled with molten solder from the wave machine and cause a hard short under th

Moisture under chip capacitors

Electronics Forum | Thu Sep 11 15:23:31 EDT 2003 | Peter L.

I have come across a rash of failed assemblies that have 0805 capacitors and resistors, bottom side glued, wave soldered and washed. Trouble shooter reported touching up the solder joints on a few areas and the boards would pass test. I had a look a

Used SMT Equipment: solder balls under capacitors (7)

DEK Horizon 03i Printer

DEK Horizon 03i Printer

Used SMT Equipment | Screen Printers

DEK Horizon 03i automatic stencil printer Specification : DEK Horizon 03i High Precision Automatic Solder Paste Printer designed for high precision steel mesh printing or stencil printing in SMT industry. Printing PCB size: 50x50mm to 508x510mm;

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

MVP Ultra 1820

MVP Ultra 1820

Used SMT Equipment | AOI / Automated Optical Inspection

Hello and thank you for your interest in our MVP Machine Vision Products AOI Machines For Sale. We have a total of (4) MVP Automated Optical Inspection Machines and (2) Inspection Repair Stations.. They were taken off line due to company closer. All

1st Place Machinery Inc.

Industry News: solder balls under capacitors (103)

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Industry News | 2018-12-08 03:29:29.0

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Flason Electronic Co.,limited

Electronic Components, Parts and Their Function

Industry News | 2018-12-08 03:22:25.0

Electronic Components, Parts and Their Function

Flason Electronic Co.,limited

Parts & Supplies: solder balls under capacitors (9)

Yamaha YS24 Track Mounter Table Y Axi

Yamaha YS24 Track Mounter Table Y Axi

Parts & Supplies | Assembly Accessories

YAMAHA YS24 track mounter table Y axis tank chain keel drag chain KKE-M919F-00 YAMAHA YS24 track mounter table Y axis tank chain keel drag chain KKE-M919F-00 We also supply the below products: KHY-M71G5-A0 Z UNIT ASSY. YS12 Z-axis motor YG12 Z

KingFei SMT Tech

Juki 750(760) CARRY PWB E86177210A0

Juki 750(760) CARRY PWB E86177210A0

Parts & Supplies | Pick and Place/Feeders

Supply&repair juki spare parts at l lower price: JUKI 710(720) CARRY UNIT E86127150B0  JUKI 710(720) CPU CARD E8601715AA0 JUKI 730(740) CARRY BOARD E86067210A0 JUKI 730(740) DC SERVO DRIVER E86037210A0 JUKI 750(760) AC SERVO CARD E86027210A0    

FUJINTAI TECHNOLOGY CO.,LIMITED

Technical Library: solder balls under capacitors (8)

Evaluating the Mechanical Reliability of Ball Grid Array (BGA) Flexible Surface-Mount Electronics Packaging under Isothermal Ageing

Technical Library | 2015-02-12 16:57:56.0

Electronic systems are known to be affected by the environmental and mechanical conditions, such as humidity, temperature, thermal shocks and vibration. These adverse environmental operating conditions, with time, could degrade the mechanical efficiency of the system and might lead to catastrophic failures.The aim of this study is to investigate the mechanical integrity of lead-free ball grid array (BGA) solder joints subjected to isothermal ageing at 150°C for up to 1000 hours. Upon ageing at 150°C the Sn-3.5Ag solder alloy initially age-softened for up to 200 hours. This behaviour was linked to the coarsening of grains. When aged beyond 200 hours the shear strength was found to increase up to 400 hours. This age-hardening was correlated with precipitation of hard Ag3Sn particles in Sn matrix. Further ageing resulted in gradual decrease in shear strength. This can be explained as the combined effect of precipitation coarsening and growth of intermetallic layer. The fractured surfaces of the broken solder balls were also investigated under a Scanning Electron Microscope. The shear failures were generally due to ductile fractures in bulk solders irrespective of the ageing time.

School of Engineering, University of Greenwich

Understanding the Effect of Process Changes and Flux Chemistry on Mid-Chip Solder Balling

Technical Library | 2016-11-30 21:30:50.0

Mid-chip solder balling is a defect typically associated with solder paste exhibiting poor hot slump and/or insufficient wetting during the reflow soldering process, resulting in paste flowing under the component or onto the solder resist. Once molten, this solder is compressed and forced to the side of the component, causing mid-chip solder balling.This paper documents the experimental work performed to further understand the impact on mid-chip solder balling from both the manufacturing process and the flux chemistry.

Henkel Electronic Materials

Videos: solder balls under capacitors (11)

How to reduce solder joint voids from 30% to 1%? Try I.C.T Vacuum Reflow Oven

How to reduce solder joint voids from 30% to 1%? Try I.C.T Vacuum Reflow Oven

Videos

  · What is the difference between SMT vacuum reflow soldering machine and ordinary reflow soldering machine?    · What problems can be solved by smt vacuum reflow soldering machine?   · What is the basic principle of vacuum reflow machine?   · Ho

Dongguan Intercontinental Technology Co., Ltd.

I.C.T Lyra Series Reflow Oven with CBS Function

I.C.T Lyra Series Reflow Oven with CBS Function

Videos

Lyra Reflow Oven is a soft soldering that realizes the mechanical and electrical connection between the solder ends of surface mount components or the pins and the printed board pads by remelting the solder paste pre-distributed on the printed board

Dongguan Intercontinental Technology Co., Ltd.

Training Courses: solder balls under capacitors (2)

IPC 7095 BGA Rework Certification

Training Courses | | | PCB Rework and Hand Soldering Courses

The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.

Precision PCB Services, Inc

BGA Inspection, Rework and Repair Course

Training Courses | | | PCB Inspection Courses

The PCB inspection courses focus on improving PCB yield and reliability through validation and detection of defects on electronics assemblies.

ACI Technologies, Inc.

Events Calendar: solder balls under capacitors (3)

Solder Paste Qualification Testing - SMTA Webinar

Events Calendar | Wed Mar 07 00:00:00 EST 2018 - Wed Mar 07 00:00:00 EST 2018 | ,

Solder Paste Qualification Testing - SMTA Webinar

Surface Mount Technology Association (SMTA)

BGA & Area Array Failures, Causes & Corrective Actions Online Webinar

Events Calendar | Mon Mar 16 00:00:00 EDT 2020 - Mon Mar 16 00:00:00 EDT 2020 | ,

BGA & Area Array Failures, Causes & Corrective Actions Online Webinar

Surface Mount Technology Association (SMTA)

Career Center - Jobs: solder balls under capacitors (1)

Senior Engineering Microassembler

Career Center | Brooklyn, New York USA | Engineering,Production

Mini-Circuits designs, manufactures and distributes integrated circuits, modules, and sub-systems for high performance radio frequency (RF) and microwave applications.  With design, sales and manufacturing locations in over 30 countries, Mini-Ci

Mini-Circuits

Career Center - Resumes: solder balls under capacitors (3)

rozenblit1

Career Center | , Israel | Engineering,Maintenance,Technical Support

I was born on June , 1972 in Khmelnitsky city , Ukraine . I am male. From 1979 to 1987 I was studying at secondary school #7, having finished which I entered the Technical College of Khmelnitsky in specialty Machine Tools with Computer Numeric Contr

EMS-PCBA/PCA Process/Quality (Six sigma Black belt)

Career Center | Mysore, India | Engineering,Production,Quality Control,Technical Support

· New Product production line setup, Risk assessment, quality system deployment. · Process Engineering activities, PCB Design review w.r.t Design for manufacturability in Pilot lot. · Printed wiring Assembly Process Improvement (Stencil, PCB type, sc

Express Newsletter: solder balls under capacitors (1003)

SMTnet Express - May 21, 2015

SMTnet Express, May 21, 2015, Subscribers: 22,770, Members: Companies: 14,358, Users: 38,224 Reliability of Embedded Planar Capacitors under Temperature and Voltage Stress Mohammed A. Alam, Michael H. Azarian, Michael Osterman and Michael Pecht

Partner Websites: solder balls under capacitors (162)

Chip Array Solder Joint Goals - PCB Libraries Forum

PCB Libraries, Inc. | https://www.pcblibraries.com/forum/chip-array-solder-joint-goals_topic483_post1439.html

.   The are solder joint goals for micro-miniature components must be reduced to avoid excess solder to prevent solder balls and tombstoning

PCB Libraries, Inc.

Under what conditions do you set different temperatures for the TOP and Bottom heating elements of a

| http://etasmt.com/cc?ID=te_news_industry,23963&url=_print

Under what conditions do you set different temperatures for the TOP and Bottom heating elements of a reflow oven?-SMT Technical-Reflow oven,SMT Reflow Soldering Oven-cmsadmin Reflow oven,SMT Reflow Soldering Oven 当前位置: Home >> News


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