New Equipment | Rework & Repair Services
BGA Reballing and Solder Bumping for all types of SMD's Lead, Lead Free and Solder Alloy Conversion. Package types include but are not limited to: PBGA (Plastic Ball Grid Array) TBGA (Tape Ball Grid Array) uBGA (Micro BGA) CCGA (Ceramic Colum
New Equipment | Rework & Repair Equipment
Custom made reballing fixtures designed for your specific component. Allows for high yield reballing of multiple parts at one time. Use for ball attach to BGA components and for solder bumping of LGA's and QFN's. Simply send us the data sheet and
Electronics Forum | Fri Aug 26 17:27:48 EDT 2005 | saragorcos
Hello there, Most probably, since the solder balls are entrapped, it is a process indicator, but refer to IPC 610-6.5.3.1 on Excess solder / solder balls / splashes - it really depends on what class you are manufacturing, and the minimum electrical c
Electronics Forum | Mon Aug 29 11:05:10 EDT 2005 | foresiteeric
davef: I am a colleague of Sara at Foresite and we came to the conclusion that the solder balls were entrapped based on the minimal amount of information from the original question and the fact that the x-ray showed the balls and it wasn't mentioned
Used SMT Equipment | AOI / Automated Optical Inspection
2011 MIRTEC MV-3L PCB AOI MACHINE IS IN GOOD WORKING CONDITION AND CAN BE DEMO'D IN PERSON OR VIRTUALLY! SN: 13110930-0839 DOM: 30 SEP 2011 2D Inspection Power: 85-264V / 4.4A / 50-60 Hz INSPECTION AREA: 450 x 400 mm INSPECTION ITEMS:&n
Used SMT Equipment | AOI / Automated Optical Inspection
Mirtec MV-3L PCB AOI MACHINE IS IN GOOD WORKING CONDITION AND CAN BE DEMO'D IN PERSON OR VIRTUALLY! SN: 13100524-0524 DOM: 24 MAY 20102D InspectionPower: 85-264V / 4.4A / 50-60 HzINSPECTION AREA: 450 x 400 mmINSPECTION ITEMS: Lifted Lead, Lifted Comp
Industry News | 2012-01-22 23:16:58.0
More than 350 engineers who attended last week’s IPC webinar, Soldering and Assembly Defects, were polled on their biggest headaches with printed boards, PCB components and PCB assembly process failures. The survey results which identify solder finish, ball grid array (BGA) components and reflow soldering as the greatest challenges, provide webinar co-sponsor, National Physical Laboratory (NPL) of the United Kingdom with useful information as it prepares its NPL Process Defect Clinic for IPC APEX EXPO® 2012.
Industry News | 2009-04-23 20:54:01.0
MINNEAPOLIS, MN � The SMTA is pleased to announce its latest technical event in Penang, Malaysia. The SMTA South East Asia Technical Conference on Electronics Assembly Technologies will be held November 19-20, 2009 at the Equatorial Hotel in Penang, Malaysia. Presentations are currently being solicited for the following key technology tracks:
Parts & Supplies | Assembly Accessories
YAMAHA YS24 track mounter table Y axis tank chain keel drag chain KKE-M919F-00 YAMAHA YS24 track mounter table Y axis tank chain keel drag chain KKE-M919F-00 We also supply the below products: KHY-M71G5-A0 Z UNIT ASSY. YS12 Z-axis motor YG12 Z
Parts & Supplies | Repair/Rework
Three independent heaters control systems. FG-P6000 is available heating portion of the PCB board by hot-air circulate both from top and bottom at the same time. With large IR bottom heating, it can completely avoid PCB deformation during reworking
Technical Library | 2017-08-17 12:28:30.0
At SMT assembly, flux outgassing/drying is difficult for devices with poor venting channel, and resulted in insufficiently dried/burnt-off flux residue for no-clean process. Examples including: Large low stand-off components such as QFN, LGA Components covered under electromagnetic shield which has either no or few venting holes Components assembled within cavity of board Any other devices with small open space around solder joints
Technical Library | 2015-02-12 16:57:56.0
Electronic systems are known to be affected by the environmental and mechanical conditions, such as humidity, temperature, thermal shocks and vibration. These adverse environmental operating conditions, with time, could degrade the mechanical efficiency of the system and might lead to catastrophic failures.The aim of this study is to investigate the mechanical integrity of lead-free ball grid array (BGA) solder joints subjected to isothermal ageing at 150°C for up to 1000 hours. Upon ageing at 150°C the Sn-3.5Ag solder alloy initially age-softened for up to 200 hours. This behaviour was linked to the coarsening of grains. When aged beyond 200 hours the shear strength was found to increase up to 400 hours. This age-hardening was correlated with precipitation of hard Ag3Sn particles in Sn matrix. Further ageing resulted in gradual decrease in shear strength. This can be explained as the combined effect of precipitation coarsening and growth of intermetallic layer. The fractured surfaces of the broken solder balls were also investigated under a Scanning Electron Microscope. The shear failures were generally due to ductile fractures in bulk solders irrespective of the ageing time.
BGA component installation demo with the Shuttle Star SV560 that has the Side View Camera option.
BGA component installation demo with the Shuttle Star SV560 that has the Side View Camera option.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Wed Mar 07 00:00:00 EST 2018 - Wed Mar 07 00:00:00 EST 2018 | ,
Solder Paste Qualification Testing - SMTA Webinar
Events Calendar | Mon Mar 16 00:00:00 EDT 2020 - Mon Mar 16 00:00:00 EDT 2020 | ,
BGA & Area Array Failures, Causes & Corrective Actions Online Webinar
Career Center | Brooklyn, New York USA | Engineering,Production
Mini-Circuits designs, manufactures and distributes integrated circuits, modules, and sub-systems for high performance radio frequency (RF) and microwave applications. With design, sales and manufacturing locations in over 30 countries, Mini-Ci
Career Center | Wesley Chapel, Florida USA | Engineering,Management,Quality Control
15 years of experience on Electronic Manufacturing. Certified SMT Process Engineer TQM Knowledge Statistics DOE Screen Printer Thermal Process Knowledge JIT International Project Engineering Experience
Career Center | banaglore, karnataka India | Maintenance,Production,Quality Control,Technical Support
tel u later
SMT Express, Volume 2, Issue No. 3 - from SMTnet.com Volume 2, Issue No. 3 Thursday, March 16, 2000 Featured Article Return to Front Page Curtailing Voids in Fine Pitch Ball Grid Array Solder Joints by Gary Morrison and Kevin Lyne
| https://www.eptac.com/solder-tips/
Solder Pot Maintenance and Dross Removal Question: We found an article online about solder pot maintenance and the removal of dross, specifically there is an interest to us in the “changing bar solder” Section
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_3d-step-to-vrml_topic976.xml
:07pm jameshead wrote:To be honest for something like a BGA or QFN I wouldn't bother with the balls or terminals - I'd just want a square cube.
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