Industry Directory: solder bridging at qfn (1)

Shuttle Star Technology Co., Ltd.

Industry Directory | Manufacturer

Shuttle Star Technology designs and builds advanced off-line 2.5D&3D x-ray inspection systems for solder joint and final assembly test inspection in SMT&EMS. It uses world-class X-ray techniques with advanced defect detection.

New SMT Equipment: solder bridging at qfn (2)

X-eye 6200 - In-Line 2D AXI / WAXI

X-eye 6200 - In-Line 2D AXI / WAXI

New Equipment | Inspection

In-Line X-ray Inspection System Automatically in-line inspect Solder joint defects of PCBA and other defects on Hidden Components. Able to judge Good/NG fast with inspection speed of 1sec/FOV and the program can set ROIs conveniently. Performing X-r

SEC

SEC 6300AXI(3D CT) - In-Line 3D CT AXI

SEC 6300AXI(3D CT) - In-Line 3D CT AXI

New Equipment | Inspection

In-Line X-ray Inspection System Automatically in-line inspect Solder joint defects of PCBA and other defects on Hidden Components. Able to judge Good/NG fast with inspection speed of 1sec/FOV and the program can set ROIs conveniently. Performing X-r

SEC

Electronics Forum: solder bridging at qfn (20)

BGA Warping at the corners

Electronics Forum | Mon Jun 17 09:52:33 EDT 2013 | sara_pcb

My circuit board contains 11 x 11 matrix 1mm pitch BGA, The device was tested in socket on evaluation Board. We handed over the actual PCB & devices for re-flow. The assembly house first re-flowed all the SMT components other than BGA. BGA was placed

Glue PCBA No solder & Bridging issue at Wave soldering Process

Electronics Forum | Wed May 11 09:07:46 EDT 2016 | SN

We are facing SMT components No solder and solder bridging issue (Glue PCBA) at wave soldering process. Fine tuned the wave parameters improved but not able to eliminate the issue. Suspecting because of moisture pad and component leads contaminated d

Industry News: solder bridging at qfn (160)

SMTA China Presents Awards at SMTA China East 2010 Conference/Nepcon China 2010

Industry News | 2010-04-30 18:47:15.0

SMTA China announces that it presented awards for the 10 best papers/presentations and two best exhibits at the SMTA China East 2010 Conference Award Presentation Ceremony, held on Wednesday, April 21, 2010 at the Shanghai Everbright International Hotel in conjunction with the SMTA China Annual Breakfast Reception.

Surface Mount Technology Association (SMTA)

SMTA China Presents Best Paper/Presentation Awards & Best Exhibit Awards at SMTA China

Industry News | 2014-09-18 17:55:32.0

SMTA China announcing that it presented awards for nine papers at the SMTA China South 2014 Conference Award Presentation Ceremony, held on Tuesday, August 26, 2014 at Shenzhen Convention & Exhibition Center in conjunction with the SMTA China Annual Award Ceremony.

Surface Mount Technology Association (SMTA)

Technical Library: solder bridging at qfn (1)

Pad Design and Process for Voiding Control at QFN Assembly

Technical Library | 2024-07-24 01:04:35.0

Quad Flat No Leads (QFN) package designs receive more and more attention in electronic industry recently. This package offers a number of benefits including (1) small size, such as a near die size footprint, thin profile, and light weight; (2) easy PCB trace routing due to the use of perimeter I/O pads; (3) reduced lead inductance; and (4) good thermal and electrical performance due to the adoption of exposed copper die-pad technology. These features make the QFN an ideal choice for many new applications where size, weight, electrical, and thermal properties are important. However, adoption of QFN often runs into voiding issue at SMT assembly. Upon reflow, outgassing of solder paste flux at the large thermal pad has difficulty escaping and inevitably results in voiding. It is well known that the presence of voids will affect the mechanical properties of joints and deteriorate the strength, ductility, creep, and fatigue life. In addition, voids could also produce spot overheating, lessening the reliability of the joints.

Indium Corporation

Videos: solder bridging at qfn (3)

The XT-3 is a high quality high-resolution manual x-ray inspection system designed to address fast intuitive operation, low volume production capacity, and advanced failure analysis for SMT production inspection and quality control protocols

The XT-3 is a high quality high-resolution manual x-ray inspection system designed to address fast intuitive operation, low volume production capacity, and advanced failure analysis for SMT production inspection and quality control protocols

Videos

Semi-automated, programmable X-ray inspection system with multi-axis for prototyping, failure analysis, manufacturing process validation and rework verification for PCBs up to 18 x 20". The XT-3 is a high quality high-resolution manual x-ray inspecti

MatriX Technologies GmbH

NF120(200 nano resolution) X-ray Inspection System

NF120(200 nano resolution) X-ray Inspection System

Videos

#Xray#Inspection#SEC Nano-focus Tube of 200 nano resolution which is specialized for sub-micron defects of Semiconductor Packaging, Wafer Level Packaging(WLP). -Non-destructive Analysis System -High-Resolution Image with Dual Type CTs -Application

SEC

Express Newsletter: solder bridging at qfn (980)

Defect Free QFN Assembly

Defect Free QFN Assembly Defect Free QFN Assembly The problem with soldering QFN packages is that they float, skew and tilt on the 'domed' melted solder during the SMT re-flow process. This floating, skewing and/or tilting will lead to solder

Partner Websites: solder bridging at qfn (5261)

Solder Mask On 0.40 Pitch QFN - PCB Libraries Forum

PCB Libraries, Inc. | https://www.pcblibraries.com/forum/solder-mask-on-0-40-pitch-qfn_topic3127.html

: 11 Post Options Post Reply Quote feynman Report Post    Thanks(0)    Quote    Reply Topic: Solder Mask On 0.40 Pitch QFN     Posted: 27 May 2022 at 2:10pm You could simply make the solder mask openings 1

PCB Libraries, Inc.

Solder Shorts

Heller Industries Inc. | https://hellerindustries.com/solder-shorts/

? Reflow Soldering Problems Overview Causes & Defects – Reflow Soldering Solder Ball Defects Opensor Insufficient Solder Wicking Defects Tombstoning PCB Soldering PCB Bridging Defects PCB Dewetting PCB Nonwetting Circuit Board Voids PCB Delamination

Heller Industries Inc.


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Solder Paste Dispensing

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"回流焊炉"