Industry Directory | Manufacturer
Reflow ovens for automated SMT PCB assembly, specializing in lead free processing and nitrogen reflow. The best convection reflow ovens on the market.
Industry Directory | Standards Setting / Certification / Training Provider / Consultant / Service Provider / Manufacturer
Blackfox is the industry leader in providing IPC Certifications, Solder Training, Customized Training Programs, and Counterfeit Component Training and Certification.
The World's Best SMT Convection Reflow Ovens for Large Boards and Dual Lane 1826 Mark 5 reflow oven provides consistent performance for high volume reflow requirements while minimizing preventative maintenance and floorspace. Lead Free Certified!
The World's Best Convection Reflow Oven The ultimate high volume production reflow oven with belt speeds up to 1.4 m/min to accommodate the fastest pick and place systems. Lead Free Certified reflow oven! Maintenance Free! Lowest Nitrogen &
Used SMT Equipment | Soldering - Wave
Details: • Dual Wave Pots on (2) carts • (1) RoHS, (1) Lead • Comes with Foam Fluxer currently on machine, also has a Spray Fluxer • 15.6 “ Process Width • Forced Air Convection Condition: Complete & Operational Location & Shipping: USA/FOB
Used SMT Equipment | Screen Printers
DEK HORIZON 03IX PRINTER DEK HORIZON 03IX PRINTER | QYSMT is a solder paste printing machine with stable performance and high-cost performanc
Industry News | 2020-11-03 18:16:39.0
2020 Global Surface Mount Technology Company Of The Year Award (Soldering Equipment)
Industry News | 2013-01-04 16:00:38.0
04 Jan 2013 Heller Industries will showcase the Mark5 Series - SMT Reflow Soldering Ovens February 19-21 in San Diego, CA USA at the IPC APEX EXPO.
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Technical Library | 2013-07-03 10:31:54.0
It has been demonstrated in numerous pieces of work that stencil printing, one of the most complex PCB assembly processes, is one of the largest contributors to defects (Revelino et el). This complexity extends to prototype builds where a small number of boards need to be assembled quickly and reliably. Stencil printing is becoming increasingly challenging as packages shrink in size, increase in lead count and require closer lead spacing (finer pitch). Prototype SMT assembly can be further divided between industrial and commercial work and the DIYer, hobbyist or researcher groups. This second group is highly price sensitive when it comes to the materials used for the board assembly as their funds are sourced from personal or research monies as opposed to company funds. This has led to development of a lower cost SMT printing stencil made from plastic film as opposed to the more traditional stainless steel stencil used by industrial and commercial users.This study compares the performance of these two traditional materials and their respective impact on solder paste printing including efficiency and print quality.
New Advanced Precision Auger Pump - Single Pump Solution The Precision Auger pump is designed to work with mid-to-high viscosity liquid such as glues, conductive, and non-conductive adhesive and pastes. The pump is controlled with a servo motor equ
Training Courses | ON DEMAND | | Other Courses
Other courses related to electronics manufacturing and assembly
Training Courses | ON DEMAND | | IPC-7711/7721 Specialist (CIS)
The Certified IPC-7711/7721 Specialist (CIS) training focuses on rework of electronic assemblies and repair and modification of printed boards and electronic assemblies.
Events Calendar | Mon Jun 01 18:30:00 UTC 2020 - Wed Jun 03 18:30:00 UTC 2020 | Markham, Ontario Canada
International Conference for Electronics Hardware Enabling Technologies (ICEHET)
Events Calendar | Tue Jul 11 18:30:00 UTC 2023 - Tue Jul 11 18:30:00 UTC 2023 | ,
Penang Chapter Webinar: 6G Manufacturing Challenges and Opportunities
Career Center | Dorval, Quebec Canada | Production
Full time position 40 hrs week hourly wages to be discussed Manual solderer surface mount and through hole leaded and Rohs. 3 to 5 years experience Interview and test required ONLY QUALIFIED NEED APPLY
Career Center | Flowery Branch, Georgia USA | Production
Ideal candidate must already be located in Atlanta metro area and have significant experience programming and operating Siemens F-15 and S-20 SMT, Reflow (Seho experience a plus) and Wave-Solder (Seho expererience a plus). Lead and RoHS experience re
Career Center | , Tamilnadu India | Engineering
Mobile: 9940127531 email: sooree_k@yahoo.com , sooree.k@gmail.com Engineering – Process and Product quality (Semiconductors and Electronics Manufacturing) Professional Experience: Total of 9 year Flextronics Technologies (I) Pvt LTD : Assistant
Career Center | Georgetown, Penang | Engineering
Philips Lumileds Lighting Sdn. Bhd Position Title : SMT Engineer Specialization : Manufacturing/Production Operations Industry : Electrical & Electronics Duration : May 2006 - Present Work Description: To conduct NPI & all SMT related process in Lu
High Reliability Lead-free Solder SN100C(Sn-0.7Cu-0.05Ni+Ge) High Reliability Lead-free Solder SN100C(Sn-0.7Cu-0.05Ni+Ge) While the situation varies from country to country, nearly one year after the EU RoHS Directive came into force
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/about-us/standards/rohs
. In This Section About Us Customer Testimonials Nordson EFD Events Events News Standards IPC J-Standards ROHS WEEE Solder Quality Assurance Terms and Conditions of Sale Back To Top Nordson EFD is the
Imagineering, Inc. | https://www.pcbnet.com/blog/the-cost-of-pcb-fabrication-pricing-factors/
The Cost of PCB Fabrication: Pricing Factors Skip to main content Resources Support Contact Us FAQs Live Chat My Account 847-806-0003 Menu PCB Capabilities Fabrication Technology Roadmap Materials Available HDI Tolerances
