Industry Directory | Manufacturer
HDI PCB capability, Our company is especially dedicated in PCB related products and services, such as PCB fabrication, laser cut stencils, BGA and high density chip soldering, board assembly etc..
Industry Directory | Manufacturer
We specializes in quickturn prototype printed circuit board service. With extensive experience in serving electronic industry, we believe we can benefit you in cost control and shortening the time to market.
New Equipment | Solder Paste Mixers
SMT solder paste mixing equipment Mix soldering machine Solder cream Mixer Product introduction: 1.Using precision guide rail and the import motor to drive the blade seat conversion, printing, and high accuracy. 2.Printing scraper can rotate 45
New Equipment | Wave Soldering
HR-300 LF Lead Free Wave Soldering Machine STD: Touch Screen Controlled ; OPT: Computer Controlled ¤ Suitable For Low Component Density Products/High Throughput Requirement ¤ Motor Driven Fluxer Spray Head Transverse ¤ Japanses Spray Nozzle Wit
Electronics Forum | Tue Jan 31 11:56:12 EST 2006 | kmorris
Just wanted to take a quick poll, as to how others are taking flux density measurements on their wave solder machines.(those that don't have flux density contollers) We are using a glass hydrometer, but I see there is a digital model on the market.
Electronics Forum | Wed Feb 01 17:07:15 EST 2006 | Chunks
It does work. I tried it myself back in the day. You might look at used equipment to find and automatic flux density machine.
Used SMT Equipment | Soldering - Reflow
The 1800 reflow oven models support high mix / high volume throughput… at speeds up to 32 inches (80 centimeters) per minute, while conserving valuable factory floor space. Rapid response times and precise temperature controls assure process uniformi
Used SMT Equipment | Soldering - Reflow
Production Overview: The 1700 reflow soldering oven models support high mix / medium volume throughput… at speeds up to 24 inches (60 centimeters) per minute, while conserving valuable factory floor space. Rapid response times and precis
Industry News | 2013-08-15 20:58:22.0
Heller Industries announced today that they have entered into a joint development agreement with International Business Machines Corporation (NYSE: IBM), to collaborate on the development of fluxless mass reflow furnace equipment and process for high volume manufacturing. The fluxless process utilizes gas phase formic acid to replace standard fluxing agents, and eliminates the need for pre-reflow fluxing and post-reflow flux cleanup steps.
Industry News | 2003-05-23 08:24:49.0
Solid cables of up to 35mm2 cross-section now can be connected to PCBs easily, reliably and cost-effectively with the new Power Combicon range of connectors.
Parts & Supplies | Pick and Place/Feeders
The definition of SMT SMT is the surface assembly technology,surface mount technology(surface mount technology)(Surface Mounted Technology abbreviation),is currently the most popular electronic assembly industry,a technology and technology. What a
Parts & Supplies | Pick and Place/Feeders
101004 TRANSISTOR BC108 NPN 101020 POWER SUPPLY – UPRATED CURRENT 101047 SQUEEGEE MATERIAL 9.5 X 9.5 85-90 101081 CONNECTOR CIRCULAR 14WAY 97-3102A 101142 FRONT SQUEEGEE CARRIAGE 101143 OUTER MTG SQUEEGEE BLOCK 101145 COVER (TXT) 101146
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Technical Library | 2019-07-10 23:36:14.0
Pockets of gas, or voids, trapped in the solder interface between discrete power management devices and circuit assemblies are, unfortunately, excellent insulators, or barriers to thermal conductivity. This resistance to heat flow reduces the electrical efficiency of these devices, reducing battery life and expected functional life time of electronic assemblies. There is also a corresponding increase in current density (as the area for current conduction is reduced) that generates additional heat, further leading to performance degradation.
Hear what attendees had to say about the Electronics in Harsh Environments Conference. Start planning your participation for the 2020 event: 21-23 April 2020 | Amsterdam, Netherlands https://www.smta.org/harsh
QXJ-NC32 SMT pick and place nozzle cleaning machine In the field of the semiconductor industry today, with the development of SMT, small parts into small, high-density mounting and base for reality, and future development trends will be further co
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
Events Calendar | Tue Apr 21 00:00:00 EDT 2020 - Thu Apr 23 00:00:00 EDT 2020 | Amsterdam, Netherlands
Electronics in Harsh Environments Conference
Events Calendar | Tue Jun 02 00:00:00 EDT 2020 - Thu Jun 04 00:00:00 EDT 2020 | Markham, Ontario Canada
International Conference for Electronics Hardware Enabling Technologies (ICEHET)
Career Center | Daviddav, India | Engineering,Maintenance,Production,Quality Control,Research and Development
Created and defined component landing patterns for high density layouts beyond the specifications of IPC standards and in compliance with RoHs. • Designing SMT stencils (Solder paste & Glue(Epoxy) stencils).
Career Center | , | 2013-01-31 04:29:34.0
• Programming of AOI, SPI and Routing m/c’s. • SMT(Surface Mount Technology) • Basic Electronics • Semi Conductors • Operating System: Windows- 98/XP/Vista/7 • MS Office: 2003/2007/2010
SMTnet Express, March 1, 2018, Subscribers: 31,280, Companies: 10,908, Users: 24,452 Deposition of Solder Paste into High Density Cavity Assemblies Fernando Coma, Jeffrey Kennedy, Thilo Sack; Celestica Corporation Circuit functional density
GPD Global | https://www.gpd-global.com/lead-free-solder-paste-dispensing.php
Lead Free Solder Paste Dispensing, Leaded Solder Paste Dispensing Home Products Fluid Dispensing Equipment High Precision Dispenser - MAX Series Large Format Board Dispensing - DS Series Table Top Dispensing Equipment Loader
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/fluid-types/solder-paste?con=t&page=6
Solder Paste | Nordson ASYMTEK ASYMTEK Products Corporate | Global Directory | Languages Division Only All of Nordson Fluid Dispensing Systems Jets
