Leading supplier of Solid Solder Deposit (SSD) technology and equipment to the electronics industry. Mask Tek's patented PPT process eliminates solder paste at assembly. Ideal for fine pitch and BGAs. Please visit our web site at masktek.com.
Industry Directory | Manufacturer
The exclusive supplier of SIPAD Solid Solder Deposit in North America and the only SIPAD Solid Solder Deposit (SSD) coating service bureau in the world.
New Equipment | Test Equipment
Koh Young KY8080 3D SPI Min component: 01005 PCB size:350x330mm Dimension:1000x1335x1627mm weight:600kg Product description: Koh Young KY8080 3D SPI, Min component: 01005, PCB size:350x330mm, weight:600kg, Dimension:1000x1335x1627mm Koh Young KY808
SIPAD Solid Solder Deposit (ssd) is a Siemens patented process that pre loads the pc board surface mount pads with solder in a solid form. Boards are printed, reflowed without components producing a predictable repeatable meniscus. SIPAD boards are t
Electronics Forum | Sat Jan 07 06:43:44 EST 2006 | davef
Metal is about 50 percent by volume
Electronics Forum | Fri Jan 06 19:57:19 EST 2006 | abhinavajmera
What would be the most suitable expression for ratio of Volume of Alloy to Volume of Paste for a solder paste? For example if we use 63Sn/37Pb alloy with a 90 Wt% metal what would be an appopriate expression for the Volume Ratio?
Used SMT Equipment | Soldering - Reflow
Configuration details: · Conveyor type: mesh/rail conveyor- single edge rail with mesh on bottom. · Chain lubrication. · 8 heater zones. · Configured Left to Right. · Air. Condition: In use, compl
Used SMT Equipment | Screen Printers
Make: Mydata Model: My500 Vintage: 12/2011 Description: Jet Printer Details: • Windows XP • Individual Deposit Programming • Quick Mode Programming • Automatic Board Stretch and Board Warpage Compensation
Industry News | 2003-03-21 08:12:24.0
Tecan reckons it is consistently producing what may be regarded as the most efficient stencils in the world today.
Industry News | 2003-04-30 08:51:08.0
Electrolube played the role of environmental champion in Australia recently.
Technical Library | 2008-10-15 20:16:12.0
Solder paste dispensing is usually considered a slow process. Due to the speed advantages, screen printing is used to apply solder paste whenever possible. However, screen printing is not always an option. Leveraging the high speed of piezo drive technology opens the door to a broad range of solder paste dispensing applications. The ability to dispense dots under 300-μm diameter, even as small as 125 μm, enables BGA rework, small geometry deposits for miniaturized passive components, electrical connections in recessed cavities, and RF shield attach for handheld devices.
Technical Library | 2007-02-01 09:57:15.0
The rapid assimilation of Ball Grid Array (BGA) and other Area Array Package technology in the electronics industry is due to the fact that this package type allows for a greater I/O count in a smaller area while maintaining a pitch that allows for ease of manufacture.
Flexible, in-line, modular selective soldering system Designed as a modular system, the Synchrodex range of in-line equipment offers the ultimate in flexibility with the ability to upgrade to high speed throughput when multiple modules are placed to
High Quality Selective Wave Soldering Machine If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included allof our products. wave soldering, wave soldering machine, D
Training Courses | ONLINE | ON DEMAND | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Events Calendar | Thu Apr 30 00:00:00 EDT 2020 - Thu Apr 30 00:00:00 EDT 2020 | ,
Screen Printing Key Factors
Events Calendar | Fri Apr 16 00:00:00 EDT 2021 - Fri Apr 16 00:00:00 EDT 2021 | ,
Auburn University Student Chapter Event: Get Hired in Electronics Industry
Career Center | Boulder, Colorado USA | Engineering,Production,Quality Control
Senior-level micro-electronic technician capable of independent manufacture of custom hybrids, focal plane assemblies, and prototype detector assemblies in cleanroom environment (in Advanced Packaging and Detector Laboratory). MINIMUM QUALIFICATIONS
Career Center | Wesley Chapel, Florida USA | Engineering,Management,Quality Control
15 years of experience on Electronic Manufacturing. Certified SMT Process Engineer TQM Knowledge Statistics DOE Screen Printer Thermal Process Knowledge JIT International Project Engineering Experience
Career Center | Botevgrad, Sofia Bulgaria | Engineering,Production,Quality Control,Research and Development,Sales/Marketing
AOI - Omron RNS/RNS_ptH, VI3000, Marantz 22X IPC-610D Class 3, Pb/Pb free process, 5S, FMEA, MSA, PPAP, SPC, CPK, 6Sigma, lean manufacturing, Quality management, ISO/TS 16949 ,ISO 9001,ISO 14 001
Dispensing Solder Paste Micro-Deposits If you don't see the images, please visit online version at #Application.SmtNet.baseURL#/express/ News • Forums • SMT Equipment • Company Directory • Calendar • Career Center • Advertising • About • FREE
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/00600-248.pdf
How Challenging Conventional Wisdom Can Optimize Solder Reflow With solder reflow, relying on commonlyaccepted practices can lead engineers tooverlook some relatively simple factors thatare critical
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. It should also be noted that most solder defects originate in the solder deposition stage, either through improper printer parameters, damaged or incorrectly designed stencils, or less than adequate solder paste
