Industry Directory | Manufacturer
Yincae Advanced Materials, LLC is a developer, manufacturer, and supplier of high performance coatings, adhesives, electronic and optoelectronic materials.
Industry Directory | Distributor
Stocking distributor featuring adhesives, sealants, encapsulates, coatings, solder, solder chemicals, release agents, dispensing equipment and supplies.
Retrofit existing system with Innovative Dispensing Technology for Excellent Dispense Control and Repeatability Advanced pump technologies available for retrofitting include: True Volumetric Pump, Precision Auger Pump, Simplified Jetting Pump and Ti
When Applications Require Large Board Processing &/or Versatility The DS Series of dispensers is a robust, large format platform designed to handle all types of applications with ease. Ideal for dispense applications utilizing adhesive, solder paste
Used SMT Equipment | Soldering - Reflow
TrioTek: Ultraviolet UV Curing, IR Thermal Curing, Moisture Curing for encapsulants, adhesives, conformal coatings and potting compounds TrioTek™ inline curing ovens from ETS are ideal for medium to high-volume curing or drying of encapsulants, con
Used SMT Equipment | Coating and Encapsulation
The SCS P-3201 Dip Coat System is a free-standing precision dip coater designed to coat circuit boards in non-automated production settings. With this system, you can effectively and efficiently apply a range of coatings, including urethane, epoxy, s
Industry News | 2016-07-16 13:32:29.0
Advanced dispense technology is available for integration into your dispensing system. Continuously Volumetric, drip-and-drool free dispense technology can now be retrofitted into your dispense robot. GPD Global's Volumetric PCD pumps ensure the success of applications like underfill, LED encapsulation, solder mask, silicones, conductive ink, conformal coatings, and more. Improve your throughput and yields by retrofitting a Volumetric PCD Pump into your dispense system to simplify the dispense process.
Industry News | 2011-04-22 21:36:56.0
GPD Global announces that its MAX Series Dispensing Systems are the dispensers of choice for high accuracy and repeatability applications.
Technical Library | 2023-08-16 18:20:44.0
One of our defense customers planned to dispense underfill material for small and large die, using Hysol FP4545FC epoxy encapsulant. This process dissipates stress on solder joints and prevents cracking and fracturing between the bottom of the die and the surface of the substrate.
Technical Library | 2010-01-13 12:34:10.0
Micro-sectioning (sometimes referred to as cross-sectioning)is a technique, used to characterize materials or to perform a failure mode analysis, for exposing an internal section of a PCB or package. Destructive in nature, cross-sectioning requires encapsulation of the specimen in order to provide support, stability, and protection. Failures that can be investigated through micro-sectional analysis include component defects, thermo-mechanical failures, processing failures related to solder reflow, opens or shorts, voiding and raw material evaluations.
http://www.gpd-global.com No drip no drool across a wide range of fluid viscosities (low-to-mid and low-to-high). No manual adjustment to compensate for pump variability. Truly Volumetric PCD Pumps for total control of dispensing fluids. Ability to
When Applications Require Large Board Processing &/or Versatility The DS Series of dispensers is a robust, large format platform designed to handle all types of applications with ease. Ideal for dispense applications utilizing adhesive, solder paste
Training Courses | | | IPC J-STD-001 Specialist (CIS)
The Certified IPC J-STD-001 Specialist (CIS) training focuses on the knowledge and hand skills employees need to produce high-quality soldered interconnections.
Training Courses | | | IPC J-STD-001 Specialist (CIS)
The Certified IPC J-STD-001 Specialist (CIS) training focuses on the knowledge and hand skills employees need to produce high-quality soldered interconnections.
Events Calendar | Mon Apr 12 18:30:00 UTC 2021 - Mon Apr 12 18:30:00 UTC 2021 | ,
Boston Chapter Webinar: Cleaning Chemistry For PWB and Rework - Part 2, session 1
Events Calendar | Mon Apr 12 18:30:00 UTC 2021 - Mon Apr 12 18:30:00 UTC 2021 | ,
Boston Chapter Webinar: Cleaning Chemistry For PWB and Rework - Part 2, session 2
Career Center | Brookfield, Wisconsin USA | Engineering
ELECTRONICS MANUFACTURING ENGINEER Salary $50 to 65k Company: Our client is a manufacturer of electronic controls used in a wide variety of industrial and consumer uses. This organization has seen some very strong growth lately, sales have double
Career Center | Morton, Illinois USA | Maintenance,Production
Vansco Electronics is quickly becoming a world leader in the design and engineering of rugged electronic equipment for mobile equipment manufacturers. For us, that means staying at the forefront of today�s global electronics industry, and helping to
Career Center | Flower Mound, Texas USA | Engineering,Management,Production,Quality Control,Research and Development,Technical Support
SMT and THT Soldering Process Optimization Working knowledge of MPM Screen Printers, Fuji and Siemens Placement Equipment, BTU, ERSA and Vitronics Reflow Ovens, Camalot 3500 Underfill Dispense Machine, SEHO and Electrovert Wave Soldering Systems
Career Center | Sto. Tomas, Batangas, Philippines | Engineering
SKILLS & EXPERIENCES A.Materials engineering and management 1.Handles matters about materials -Ceramic and laminate substrates & Surface Mount Devices (SMDs) i.e. chip capacitors and resistors -Perishable materials i.e. solder paste (including Pb-fr
The Future of Solder Joint Encapsulant Online Version SMTnet Express, January 14, 2016, Subscribers: 23,987, Members: Companies: 14,894, Users: 39,724 The Future of Solder Joint Encapsulant Dr. Mary Liu and Dr. Wusheng Yin; YINCAE Advanced
GPD Global | https://www.gpd-global.com/co_website/fluid-dispensing-benchtop-robot.php
dispensing system robots are compact plus full-featured with automatic vision, laser surface sensing, and nozzle alignment. Applications using solder pastes, underfill, glues, encapsulants, gasketing, underfills, conductive adhesives, and more benefit from our Catalina Series table top dispensing system
1st Place Machinery Inc. | http://www.firstplacemachinery.com/firstplace_asymtek_1010_dispenser.html
4.7.1 Left to Right Flow Pass Thru Conveyor System Weight Scale Computer Controlled CE Marked 208-220 Volt - 50/60 HZ Recommended Applications from the manufactures website Underfill for flip chip and chip scale packaging Chip Encapsulation Dam and Fill Solder Paste Thermal Compounds
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