Industry Directory | Consultant / Service Provider
We work on the physical design, reliability and failure analysis of electronic components, solder joints and PCB assemblies. We provide expertise in the assessment of both standard SnPb and Pb-free solder joint reliability.
Industry Directory | Consultant / Service Provider
Provides strain gage bonding service, calibration and data acquisition service for pc board strain measurement
New Equipment | Fabrication Services
Rigid flex printed circuit boards (PCBs) are manufactured by combining rigid and flexible board technologies. These circuit boards are made up of multiple flexible circuit inner layers. An epoxy pre-preg bonding film is used to attach together these
New Equipment | Assembly Services
> 6Spindle, 6 Flying Vision (FOV 24mm) Head -Batch recognition with 6 cameras while picking up 6 components -Processable components: 0402 ~ 21mm, H12mm >> Low-noise, low-vibration high-speed placement with Linearmotor -Suitable for Y-axis Linear Moto
Electronics Forum | Tue Feb 08 04:27:55 EST 2011 | thomas111
hi, I am a Hardware designer . One of my products is undergoing a Reliability test in which a resistor shows a high value on board from its specified value .However it retains the original value when its cooled under room temperature. The resistor
Electronics Forum | Mon Aug 24 07:16:52 EDT 1998 | Paul Horan
| | | I am looking for advice or information from anyone about the possible reliability problems associated with epoxy on solder pads of discrete devices. Will the epoxy expand and lift over time, Will there be adverse reaction between the solder and
Industry News | 2018-10-18 08:00:40.0
SMT solder joint quality and appearance inspection process
Industry News | 2018-10-18 08:01:00.0
SMT solder joint quality and appearance inspection process
Parts & Supplies | Pick and Place/Feeders
The definition of SMT SMT is the surface assembly technology,surface mount technology(surface mount technology)(Surface Mounted Technology abbreviation),is currently the most popular electronic assembly industry,a technology and technology. What a
Technical Library | 2023-08-16 18:20:44.0
One of our defense customers planned to dispense underfill material for small and large die, using Hysol FP4545FC epoxy encapsulant. This process dissipates stress on solder joints and prevents cracking and fracturing between the bottom of the die and the surface of the substrate.
Technical Library | 2020-01-09 00:00:30.0
PCBs have a wide range of applications in electronics where they are used for electric signal transfer. For a multilayer build-up, thin copper foils are alternated with epoxy-based prepregs and laminated to each other. Adhesion between copper and epoxy composites is achieved by technologies based on mechanical interlocking or chemical bonding, however for future development, the understanding of failure mechanisms between these materials is of high importance. In literature, various interfacial failures are reported which lead to adhesion loss between copper and epoxy resins. This review aims to give an overview on common coupling technologies and possible failure mechanisms. The information reviewed can in turn lead to the development of new strategies, enhancing the adhesion strength of copper/epoxy joints and, therefore, establishing a basis for future PCB manufacturing.
Hear what attendees had to say about the Electronics in Harsh Environments Conference. Start planning your participation for the 2020 event: 21-23 April 2020 | Amsterdam, Netherlands https://www.smta.org/harsh
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Events Calendar | Mon Dec 02 00:00:00 EST 2019 - Mon Dec 02 00:00:00 EST 2019 | ,
Webinar: QFN/LGA Design, Assembly Process Issues & Reliability Failures
Career Center | Wellsboro, Pennsylvania USA | Engineering
SMT PROCESS ENGINEER: (Wellsboro, PA) - Designs, defines and plans the manufacturing process. Specifies and directs installation of new processes. Plans equipment build schedules and monitors vendor progress. Defines and recommends equipment, methods
Career Center | Williamsport, Pennsylvania USA | Engineering,Management
PRIMUS Technologies Corporation is an electronic manufacturing services (EMS) provider that produces highly reliable products for global government and commercial markets. Our company is an integrated lean enterprise that fully embodies the Six Sigma
Career Center | GARLAND, Texas USA | Production
exp in Fuji, Juki and universal smt pick and place machines . Component verification.
Career Center | GARLAND, Texas USA | Production
Fuji, Juki, Universal SMT pick and place machines experience.
SMTnet Express, January 8, 2020, Subscribers: 33,435, Companies: 10,958, Users: 25,498 Copper/Epoxy Joints in Printed Circuit Boards: Manufacturing and Interfacial Failure Mechanisms Credits: Polymer Competence Center Leoben GmbH PCBs have a wide
SMTnet Express, September 23, 2021, Subscribers: 26,674, Companies: 11,444, Users: 26,860 Micro-Sectioning of PCBs for Failure Analysis Micro-sectioning (sometimes referred to as cross-sectioning)is a technique, used to characterize
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/Vacuum-Void-Reduction-Reflow.pdf
], which is the major wear-out failure mode and major source of failure for surface mount (SMT) components in electronic assemblies [8]. A specific type of voiding called planar microvoiding has been shown to lower reliability either by effectively reducing the attachment area or by weakening the solder in regions of the solder joint
| http://etasmt.com/cc?ID=te_news_industry,3761&url=_print
. There are three major mechanisms of solder joint failure, although these often interplay with each other simultaneously. These are: 1) tensile rupture or fracture due to mechanical overloading
