Industry Directory | Equipment Dealer / Broker / Auctions
Our Company handle AOI (Auto Optical Inspection) and SPI (Solder Paste Inspection) Machines.
Industry Directory | Manufacturer
Duotec is a leading electronics manufacturing company in Arteaga, Coahuila, Mexico, specializing in SMT manufacturing, soldering solutions, chemical applications, and box build assembly.
New Equipment | Rework & Repair Services
BEST's QFN Rework Services Can Save Your Design and Save You Money BEST Inc. provides a variety of QFN rework services including the most popular QFN package styles. BEST has lots of experience in minimizing the voiding in QFN rework. BEST can mini
New Equipment | Test Equipment
KOH YOUNG Zenith 3D AOI Ultimate Solution for Inspection Challenges Incomparable True 3D Inspection Performance IPC-based Solder Joint Inspection AI-Powered Auto Programming (KAP) KOH YOUNG Zenith 3D AOI KOH YOUNG Zenith 3D AOI The Industry’s
Used SMT Equipment | AOI / Automated Optical Inspection
Placement and solder joint inspection (reflow and wave soldering) Orthogonal camera module 8M (white LEDs): Field of view: 57.6 x 43.5 mm Resolution: 23.5 µm (standard), 11.75 µm (high) switchable with On Demand HR Number of mega pixel cameras:
Used SMT Equipment | SPI / Solder Paste Inspection
Mirtec MS-11e 3D Solder Paste Inspection Make: Mirtec Model: MS-11e Year: 2018 3D SPI Inspection System High Speed 3D In-Line SPI Machine Exclusive Fifteen Megapixel Vision System 10 Micron / Pixel Precision Telecentric Compound Lens Design Precisio
Industry News | 2003-02-06 08:28:24.0
Will Premiere Its 2002 Roadmap at IPC SMEMA Council�s APEX Conference in Anaheim, CA, March 31-April 2
Industry News | 2003-06-10 08:16:44.0
The following text describes the application of NWA Quality Analyst to quality control in the assembly of electronic components.
Technical Library | 2023-01-17 17:19:44.0
A test program was developed to evaluate the effectiveness of vacuum reflow processing on solder joint voiding and subsequent thermal cycling performance. Area array package test vehicles were assembled using conventional reflow processing and a solder paste that generated substantial void content in the solder joints. Half of the population of test vehicles then were re-processed (reflowed) using vacuum reflow. Transmission x-ray inspection showed a significant reduction in solder voiding after vacuum processing. The solder attachment reliability of the conventional and vacuum reflowed test vehicles was characterized and compared using two different accelerated thermal cycling profiles. The thermal cycling results are discussed in terms of the general impact of voiding on solder thermal fatigue reliability, results from the open literature, and the evolving industry standards for solder voiding. Recommendations are made for further work based on other void reduction methods and additional reliability studies.
Technical Library | 2013-07-25 14:02:15.0
Bottom-termination components (BTC), such as QFNs, are becoming more common in PCB assemblies. These components are characterized by hidden solder joints. How are defects on hidden DFN joints detected? Certainly, insufficient solder joints on BTCs cannot be detected by manual visual inspection. Nor can this type of defect be detected by automated optical inspection; the joint is hidden by the component body. Defects such as insufficients are often referred to as "marginal" defects because there is likely enough solder present to make contact between the termination on the bottom-side of the component and the board pad for the component to pass in-circuit and functional test. Should the board be subjected to shock or vibration, however, there is a good chance this solder connection will fracture, leading to an open connection.
I.C.T Provide SMT Production Line solutions with Automated Optical Inspection (AOI) AOI is short for Automated Optical Inspection, which is widely used in the electronics industry to check the appearance of PCBA assembly at the back end of the cir
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Sun Mar 15 18:30:00 UTC 2020 - Sun Mar 15 18:30:00 UTC 2020 | ,
BGA & Area Array Failures, Causes & Corrective Actions Online Webinar
Career Center | Kirkland, Portsmouth N.H Canada | Quality Control
Contract Electronic Manufacturer of PCB Assemblies seeks experienced QA Inspector with CLUSO VISION SYSTEMS First Article Inspection experience. Excellent communication skills. Computer literate, strong sense of urgency, and motivated with good follo
Career Center | , Georgia USA | Quality Control
JOB TITLE: QA/SMT Inspection – Electronic PCB Assemblies LOCATIONS: Gwinnett County, GA SHIFT: 2nd Shift 3:30PM – 12:00AM (OT as REQUIRED, possibly including weekends!) STATUS: Indefinite Temporary PAY RATE: $12.00 Hourly Essential Dutie
Career Center | Kota(Rajasthan), India | Engineering,Maintenance,Production
�Leading a team of eighty members involved in different projects. �Responsible for Printed Circuit Board assembly line (Hi�speed Surface Mount Technology (SMT) assembly as well as Through-hole assembly), assembling PCBs for Energy Meters , Digital S
Career Center | , Israel | Engineering,Maintenance,Technical Support
I was born on June , 1972 in Khmelnitsky city , Ukraine . I am male. From 1979 to 1987 I was studying at secondary school #7, having finished which I entered the Technical College of Khmelnitsky in specialty Machine Tools with Computer Numeric Contr
The Future of Solder Joint Encapsulant Online Version SMTnet Express, January 14, 2016, Subscribers: 23,987, Members: Companies: 14,894, Users: 39,724 The Future of Solder Joint Encapsulant Dr. Mary Liu and Dr. Wusheng Yin; YINCAE Advanced
SMTnet Express, September 28, 2023, Subscribers: 25,087, Companies: 11,896, Users: 28,374 █ Electronics Manufacturing Technical Articles The Effect of Pb Mixing Levels on Solder Joint Reliability and Failure Mode of Backward
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/Vacuum-Void-Reduction-Reflow.pdf
. Component samples sizes for the accelerated temperature cycling test matrix. Solder Joint Void Characterization and Failure Analysis Transmission x-ray inspection and metallographic cross sectional analysis were used to characterize solder joint voiding and
| http://etasmt.com/cc?ID=te_news_industry,3761&url=_print
. Since visual inspection is not highly effective in weeding out devices with potential solder joint issues, new technologies have emerged to help companies increase the solder joint quality of devices
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