Industry Directory | Manufacturer
Selective Soldering Equipment and Solutions for Printed Circuit Board Assembly
Industry Directory | Manufacturer
Duotec is a leading electronics manufacturing company in Arteaga, Coahuila, Mexico, specializing in SMT manufacturing, soldering solutions, chemical applications, and box build assembly.
The PCB Footprint Expert is a powerful CAD library development tool powered by our own proprietary CAD LEAP Technology (Libraries Enhanced with Automated Preferences). It is packed with very powerful advanced library management features that cuts foo
New Equipment | Cleaning Equipment
CW-210 pneumatic PCB auto cleaning machine is designed to clean misprint solder paste, squeegee, feeder partgs, a small amount of PCBA. Driven by compressed air, the machine clean PCB from upper and lower side, by “one button” wasy operation, the mac
Electronics Forum | Wed Jan 16 11:20:52 EST 2002 | bentzen
Hi... We tend to do a lot of footprint calculating for new SMD components. But what about the amount of solder paste on the solder pads. The amount of solder alloy is of cause determined by the stencil aperture size, stencil thickness and the sold
Electronics Forum | Wed Jan 16 15:22:29 EST 2002 | Terry Burnette
In his book titled "Manufacturing Techniques for Surface Mount Assemblies" author R.J. Klein Wassink describes the relationship between solder land dimensions, component lead coplanarity, board warpage, solder volumes, and solder paste flux wetting b
Used SMT Equipment | SPI / Solder Paste Inspection
Solder paste thickness detector Measurement software: MC-110-2.5D video observation, image storage, thickness measurement, data recording, background light, laser brightness control, area (square Shape, irregular polygon, circle) / volume / spacin
Used SMT Equipment | SPI / Solder Paste Inspection
Product Details of 3D SPI-6500 Thick Paste Measurement Instrument Product Functions 1, friendly programming interface 2, a variety of measurement methods 3, scan spacing adjustable 4, image 3D simulation function 5, independent 3D dynamic obser
Industry News | 2013-08-15 20:58:22.0
Heller Industries announced today that they have entered into a joint development agreement with International Business Machines Corporation (NYSE: IBM), to collaborate on the development of fluxless mass reflow furnace equipment and process for high volume manufacturing. The fluxless process utilizes gas phase formic acid to replace standard fluxing agents, and eliminates the need for pre-reflow fluxing and post-reflow flux cleanup steps.
Industry News | 2018-10-18 08:43:30.0
Pin-in-Paste Reflow Calculations and Special Cases
Parts & Supplies | SPI / Solder Paste Inspection
Quick programming, friendly programming interface Multiple measurement methods True one-button measurement Eight-way motion button, one-click focus Adjustable scanning pitch Solder paste 3D simulation function Powerful SPC function MARK
Parts & Supplies | Pick and Place/Feeders
The definition of SMT SMT is the surface assembly technology,surface mount technology(surface mount technology)(Surface Mounted Technology abbreviation),is currently the most popular electronic assembly industry,a technology and technology. What a
Technical Library | 2023-09-26 19:14:44.0
The transition from tin-lead to lead free soldering in the electronics manufacturing industry has been in progress for the past 10 years. In the interim period before lead free assemblies are uniformly accepted, mixed formulation solder joints are becoming commonplace in electronic assemblies. For example, area array components (BGA/CSP) are frequently available only with lead free Sn-Ag-Cu (SAC) solder balls. Such parts are often assembled to printed circuit boards using traditional 63Sn-37Pb solder paste. The resulting solder joints contain unusual quaternary alloys of Sn, Ag, Cu, and Pb. In addition, the alloy composition can vary across the solder joint based on the paste to ball solder volumes and the reflow profile utilized. The mechanical and physical properties of such Sn-Ag-Cu-Pb alloys have not been explored extensively in the literature. In addition, the reliability of mixed formulation solder joints is poorly understood.
Technical Library | 2024-07-24 00:51:44.0
A blade server system (BSS) utilizes voltage regulator modules (VRMs), in the form of quad flat no-lead (QFN) devices, to provide power distribution to various components on the system board. Depending on the power requirements of the circuit, these VRMs can be mounted as single devices or banked together. In addition, the power density of the VRM can be high enough to warrant heat dissipation through the use of a heat sink. Typically, at field conditions (FCs), the BSS are powered on and off up to four times per day, with their ambient temperature cycling between 258C and 808C. This cyclical temperature gradient drives inelastic strain in the solder joints due to the coefficient of thermal expansion (CTE) mismatch between the QFN and the circuit card. In addition, the heat sink, coupled with the QFN and the circuit card, can induce additional inelastic solder joint strain, resulting in early solder joint fatigue failure. To understand the effect of the heat sink mounting, a FEM (finite element model of four QFNs mounted to a BSS circuit card was developed. The model was exercised to calculate the maximum strain energy in a critical joint due to cyclic strain, and the results were compared for a QFN with and without a heat sink. It was determined that the presence of the heat sink did contribute to higher strain energy and therefore could lead to earlier joint failure. Although the presence of the heat sink is required, careful design of the mounting should be employed to provide lateral slip, essentially decoupling the heat sink from the QFN joint strain. Details of the modeling and results, along with DIC (digital image correlation) measurements of heat sink lateral slip, are presented.
The ZEVAm+ selective soldering machine brings patented soldering technology that excels at meeting the challenges of miniaturization. Tilting allows the ZEVAm+ to solder at any angle to guarantee proper soldering results for the ever decreasing pitch
The PCB Footprint Expert is a powerful CAD library development tool powered by our own proprietary CAD LEAP Technology (Libraries Enhanced with Automated Preferences). It is packed with very powerful advanced library management features that cuts foo
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Events Calendar | Mon Apr 12 00:00:00 EDT 2021 - Mon Apr 12 00:00:00 EDT 2021 | ,
Europe Chapter Webinar: Tombstoning Components during Reflow Soldering - Causes & Cures
Events Calendar | Thu Jun 13 00:00:00 EDT 2024 - Thu Jun 13 00:00:00 EDT 2024 | Melbourne, Florida USA
Space Coast Event: Maximizing Automation Efficiency: Are You Making the Most of Your Investment?
Career Center | Van Nuys, California USA | Production
We are an ISO 9000, AS 9100, ISO 13485 and NASA certified; Quick Turn, High Reliability, Contract Manufacturer of PCB assemblies, located in the San Fernando Valley. We serve the aerospace, military, space, medical and telecommunications and other L
Career Center | Orlando, Florida USA | Sales/Marketing
We are looking for a full time field sales representative to join our growing team of professionals offering manufacturing equipment and supplies to the Electronics Manufacturing Industry. This is a new sales position that has been created due to gro
Career Center | , | Engineering,Production
Project Management, SMT Process Engineering
Career Center | Theni, Tamilnadu India | Engineering
NPI Engineer: • Playing a role as NPI leader of the Telecom, Aerospace & Server Products to introduce and run to qualify the engineering build from customer. • Conducting Weekly NPI meeting with the CFT team to review the progress of the NPI schedu
INSERT INTO tracking_express (userid, username, page_id, ts) VALUES ('#Quser_profile.id#', '#Quser_profile.username#', 9, (#ts#)) SMT Express, Volume 2, Issue No. 1 - from SMTnet.com Volume 2, Issue No. 1 Thursday, January 20, 2000
SMT Express, Issue No. 3 - from SMTnet.com Volume 1, Issue No. 3 Wednesday, August 18, 1999 Featured Article Return to Front Page BGA REWORK Earl Moon Proof Of Design (POD) INTRODUCTION This article is written to ensure everyone interested
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic2813&OB=ASC.html
that are out of range. Footprint Expert uses the IPC-7351 mathematical model for pad size and location calculations. But we also use IPC-J-STD-001 rules for solder joint goal acceptability
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The Fundamentals of Solder Joint Design – Part 1 – Through Hole Technology (THT) | EPTAC Skip to content Scroll Toll Free: 800.643.7822 Toggle navigation Training All Classes
