Industry Directory | Manufacturer
Shuttle Star Technology designs and builds advanced off-line 2.5D&3D x-ray inspection systems for solder joint and final assembly test inspection in SMT&EMS. It uses world-class X-ray techniques with advanced defect detection.
The QX600™ is designed with an all-new SIM (Strobed Inspection Module) with enhanced illumination – delivering the best 01005 and solder joint inspection performance ever. With a higher sensor resolution (12 µm), you get to see crisp, perfect qualit
New Equipment | Rework & Repair Equipment
Easy Braid’s replacement soldering tips and rework stations provide power, performance, and reliability. The EB9000S, EB5000S, and EB2000S Soldering Rework Stations are based on Curie Heat Technology, a very precise and self-regulating scientific tec
Electronics Forum | Wed Oct 03 17:08:32 EDT 2001 | davef
No comment or intent to appear critical on your particular situation, because you did the troubleshooting to determine the source of the problem, but �solder on the component lead, but not on the pad� is more often caused by a reflow profile that get
Electronics Forum | Fri Dec 14 13:58:07 EST 2001 | slthomas
This is one I haven't seen before (not in this context, anyway). We have an assembly that we have the SMT done out of house on, because of the high volumes. The boards have two distinct characteristics with respect to the appearance of the solder jo
Used SMT Equipment | Soldering - Reflow
DDM Novastar GF-12HC-HT Gold-Flow SMT Benchtop Reflow Oven appears to be in very nice cosmetic condition. It has NO USAGE, and will be sold *as-is* *where-is*. It powers up, as shown it also responds to input from the controls, and it
Industry News | 2018-10-18 08:00:40.0
SMT solder joint quality and appearance inspection process
Industry News | 2018-10-18 08:01:00.0
SMT solder joint quality and appearance inspection process
Parts & Supplies | SPI / Solder Paste Inspection
Quick programming, friendly programming interface Multiple measurement methods True one-button measurement Eight-way motion button, one-click focus Adjustable scanning pitch Solder paste 3D simulation function Powerful SPC function MARK
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Parts & Supplies | Pick and Place/Feeders
Supply&repair below cyberoptics spare parts at a lower price: Camera: 8008629 8008630 8008632 8008633 8008634 8012979 8012980 8012982 8012983 Card 6604030 6604045 6604067 6604071 6604083 6604099 8000289 8005171 8007156 8010494 KG7-M4547
Technical Library | 2013-01-18 02:42:14.0
ENIG (Electroless Nickel/Immersion Gold) is to deposit nickel gold plating which has good solderability, wear resistance , leveling appearance and small electric resistance. It included 4 steps that are pretreatment, immersion nickel, immersion gold and Post treatment...
Technical Library | 2023-08-04 15:27:30.0
A designed experiment evaluated the influence of several variables on appearance and strength of Pb-free solder joints. Components, with leads finished with nickel-palladium-gold (NiPdAu), were used from Texas Instruments (TI) and two other integrated circuit suppliers. Pb-free solder paste used was tin-silver-copper (SnAgCu) alloy. Variables were printed wiring board (PWB) pad size/stencil aperture (the pad finish was consistent; electrolysis Ni/immersion Au), reflow atmosphere, reflow temperature, Pd thickness in the NiPdAu finish, and thermal aging. Height of solder wetting to component lead sides was measured for both ceramic plate and PWB soldering. A third response was solder joint strength; a "lead pull" test determined the maximum force needed to pull the component lead from the PWB. This paper presents a statistical analysis of the designed experiment. Reflow atmosphere and pad size/stencil aperture have the greatest contribution to the height of lead side wetting. Reflow temperature, palladium thickness, and preconditioning had very little impact on side-wetting height. For lead pull, variance in the data was relatively small and the factors tested had little impact.
https://www.ascen.ltd/Products/Solder_paste_printer/513.html full auto PCB screen printer and SMT solder paste printing machine with Image and optical system,It is a very accurate fully automatic SMT stencil printer.automatic PCB screen printer main
I.C.T Provide SMT Production Line solutions with Automated Optical Inspection (AOI) AOI is short for Automated Optical Inspection, which is widely used in the electronics industry to check the appearance of PCBA assembly at the back end of the cir
SMT Express, Volume 2, Issue No. 3 - from SMTnet.com Volume 2, Issue No. 3 Thursday, March 16, 2000 Featured Article Return to Front Page Curtailing Voids in Fine Pitch Ball Grid Array Solder Joints by Gary Morrison and Kevin Lyne
SMT Express, Volume 5, Issue No. 8 - from SMTnet.com Equipment Impacts of Lead Free Wave Soldering The popular tin (Sn) rich lead free solders are causing severe corrosion to many of the materials used in today�s Wave Solder systems
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-selection-guide
. These formulas are suited to bridging gaps, filling holes, and soldering joints on vertical surfaces. Rapid reflow A term used to describe the heating of solder paste in under 5 seconds
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/Vacuum-Void-Reduction-Reflow.pdf
. Area array package test vehicles were assembled using conventional reflow processing and a solder paste that generated substantial void content in the solder joints
