Industry Directory | Consultant / Service Provider / Manufacturer
SolderStar produce thermal profiler solutions for reflow soldering, selective solder machine profiling and wave solder optimization.
Industry Directory | Manufacturer
Shuttle Star Technology designs and builds advanced off-line 2.5D&3D x-ray inspection systems for solder joint and final assembly test inspection in SMT&EMS. It uses world-class X-ray techniques with advanced defect detection.
The PCB Footprint Expert is a powerful CAD library development tool powered by our own proprietary CAD LEAP Technology (Libraries Enhanced with Automated Preferences). It is packed with very powerful advanced library management features that cuts foo
New Equipment | Rework & Repair Equipment
Protecting Heat Sensitive Components. Are you in need of a flexible method for shielding nearby components during the PCB rework process? Do you find yourself looking for an effective heat shielding product which can be easily modified to protect a
Electronics Forum | Mon Jun 01 17:49:39 EDT 2009 | gregoryyork
Sorry looking at your profile again and considering its Aluminium substrate I would opt for an increase to the preheat or introduce a soak to the profile to get the PCB up to reflow. Try soaking between 175 - 200C sufficient enough to heat the whole
Electronics Forum | Mon Jun 01 17:41:20 EDT 2009 | gregoryyork
What is your squeegee pressure and size. Also does the pad sit on a ground plane, as it looks like it is partially reflowed so surface has gone but not coallesced properly which would indicate it is more a problem with reflow above 217-219C OR obviou
Used SMT Equipment | AOI / Automated Optical Inspection
Machine available immediately including PC and dongles. Check out the link for more pictures. https://www.linkedin.com/posts/jaspervanmeerten_ispector-2019-model-for-sale-complete-w-activity-7115620630212792320-SUQV?utm_source=share&utm_medium=
Used SMT Equipment | AOI / Automated Optical Inspection
INSTALLED November 2018! Looks and smells like new. ISO-Spector M1 510L | Art Code: G300_510L AOI Machine Inline M1 AI TopographicIn-line Full 3D Artificial Intelligent AOI for up to 510x680mm (20x26") PCBs | Automatic solder joints inspection thro
Industry News | 2003-06-10 08:16:44.0
The following text describes the application of NWA Quality Analyst to quality control in the assembly of electronic components.
Industry News | 2018-05-01 19:25:27.0
Mil-aero and automotive engineers who want to increase their knowledge of electronics subjected to harsh use environments should attend IPC’s High Reliability Forum in Linthicum (Baltimore), Md., May 15-17, 2018.
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Parts & Supplies | Pick and Place/Feeders
Supply&repair below cyberoptics spare parts at a lower price: Camera: 8008629 8008630 8008632 8008633 8008634 8012979 8012980 8012982 8012983 Card 6604030 6604045 6604067 6604071 6604083 6604099 8000289 8005171 8007156 8010494 KG7-M4547
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Parts & Supplies | Pick and Place/Feeders
JUKI FX－1，FX－1R，FX－2，1070，1080，2050，2050R，2055R，2060，2060R，2070，2080，2080R TIMING BELT YB PN：40000732 SHENZHEN GREEN TECHNOLOGY Company was found in 2003.we are specialized in the field of Industrial PC boards and Electronic controls Repair,a
Technical Library | 2020-10-27 02:07:31.0
For companies that choose to take the Pb-free exemption under the European Union's RoHS Directive and continue to manufacture tin-lead (Sn-Pb) electronic products, there is a growing concern about the lack of Sn-Pb ball grid array (BGA) components. Many companies are compelled to use the Pb-free Sn-Ag-Cu (SAC) BGA components in a Sn-Pb process, for which the assembly process and solder joint reliability have not yet been fully characterized. A careful experimental investigation was undertaken to evaluate the reliability of solder joints of SAC BGA components formed using Sn-Pb solder paste. This evaluation specifically looked at the impact of package size, solder ball volume, printed circuit board (PCB) surface finish, time above liquidus and peak temperature on reliability. Four different BGA package sizes (ranging from 8 to 45 mm2) were selected with ball-to-ball pitch size ranging from 0.5mm to 1.27mm. Two different PCB finishes were used: electroless nickel immersion gold (ENIG) and organic solderability preservative (OSP) on copper. Four different profiles were developed with the maximum peak temperatures of 210oC and 215oC and time above liquidus ranging from 60 to 120 seconds using Sn-Pb paste. One profile was generated for a lead-free control. A total of 60 boards were assembled. Some of the boards were subjected to an as assembled analysis while others were subjected to an accelerated thermal cycling (ATC) test in the temperature range of -40oC to 125oC for a maximum of 3500 cycles in accordance with IPC 9701A standard. Weibull plots were created and failure analysis performed. Analysis of as-assembled solder joints revealed that for a time above liquidus of 120 seconds and below, the degree of mixing between the BGA SAC ball alloy and the Sn-Pb solder paste was less than 100 percent for packages with a ball pitch of 0.8mm or greater. Depending on package size, the peak reflow temperature was observed to have a significant impact on the solder joint microstructural homogeneity. The influence of reflow process parameters on solder joint reliability was clearly manifested in the Weibull plots. This paper provides a discussion of the impact of various profiles' characteristics on the extent of mixing between SAC and Sn-Pb solder alloys and the associated thermal cyclic fatigue performance.
Technical Library | 2014-11-06 16:43:24.0
This paper summarizes the results of recent investigations to examine the effect of electroless nickel process variations with respect to Pb-free (Sn-3.0Ag-0.5Cu) solder connections. These investigations included both ENIG and NiPd as surface finishes intended for second level interconnects in BGA applications. Process variations that are suspected to weaken solder joint reliability, including treatment time and pH, were used to achieve differences in nickel layer composition. Immersion gold deposits were also varied, but were directly dependent upon the plated nickel characteristics. In contrast to gold, different electroless palladium thicknesses were independently achieved by treatment time adjustments.
https://www.ascen.ltd/Products/Solder_paste_printer/513.html full auto PCB screen printer and SMT solder paste printing machine with Image and optical system,It is a very accurate fully automatic SMT stencil printer.automatic PCB screen printer main
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
Training Courses | | | IPC-A-610 Specialist (CIS)
The Certified IPC-A-610 Specialist (CIS) training focuses on the acceptance requirements for the manufacture of electrical and electronic assemblies
Horizontal Convection Reflow Technology Defined Horizontal Convection Reflow Technology Defined Leading up to the development of lead-free soldering alloys, Horizontal Convection* was developed for the reflow process. Getting the correct
SMT Express, Volume 2, Issue No. 3 - from SMTnet.com Volume 2, Issue No. 3 Thursday, March 16, 2000 Featured Article Return to Front Page Curtailing Voids in Fine Pitch Ball Grid Array Solder Joints by Gary Morrison and Kevin Lyne
| https://www.eptac.com/soldertips/solder-pot-maintenance-and-dross-removal/
. Another issue to consider, is the amount of solder in the wave machine pot. If the solder is too low, then the dross will be pulled into the pump and end up in the solder joints, which is not a good thing
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/Vacuum-Void-Reduction-Reflow.pdf
. Area array package test vehicles were assembled using conventional reflow processing and a solder paste that generated substantial void content in the solder joints
