New Equipment | Assembly Services
25.0 um (>1mil) 6Max. Board Size: (580mm×1200mm) 7Min. Drilled Hole Size:4mil(0.1mm) 8Min. Line Width:3mil (0.075mm) 9Min. Line Spacing:3mil (0.075mm) 10Surface finishing:HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/
Electronics Forum | Sat Aug 29 08:43:35 EDT 1998 | Dave F
| Hi, Friends, | Could you please recommend me some solder mask materials and equitements for high quality solder mask? Details such as company name, phone numer et al are welcomed. Thanks! | Have a good day | Xingsheng Xingsheng: Consider the follo
Electronics Forum | Thu Aug 27 11:35:07 EDT 2009 | davef
There are many possibilities: * Conformal coat is incompatible with surface residue on the board * Conformal coat is incompatible with solder mask on the board * Moisture is out-gassing from the board * Conformal coat is too thick and does not allow
Industry News | 2016-09-14 17:44:33.0
IPC – Association Connecting Electronics Industries® will present “PCB Troubleshooting” on November 2, 2016 in Raleigh, N.C. in conjunction with regional trade show, PCB Carolina.
Industry News | 2016-02-24 19:33:44.0
Kurtz Ersa North America has purchased and installed an ECOSELECT 1 selective soldering machine. The ECOSELECT 1 requires less than 3 m² of space, allowing it to fit optimally into cell production environments.
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/minimum-trace-width-spacing-for-bga_topic1556.html
. If you plug both sides, super heated gas in the hole could pop through the top or bottom solder mask but if you leave the bottom open it will let the heated gas during assembly reflow escape
GPD Global | https://www.gpd-global.com/co_website/pcdpumpseries-pcdseries.php
& Fill / Glob Top Encapsulation Hot Melt LED Encapsulation Solder Mask Solder Paste Surface Mount Adhesive Thermal Interface Material Trench Filling Underfill UV Curing Wafer Processing OTHER
