SMTnet Express, December 30, 2021, Subscribers: 26,039, Companies: 11,482, Users: 26,994 " ---> Effects of PCB Substrate Surface Finish and Flux on Solderability of Lead-Free SAC305 Alloy The solderability of the SAC305 alloy
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-glossary-of-terms
). Bridging Formation of a solder alloy connection between two or more adjacent contacts. Bumped Circuit Boards Bare printed circuit boards that have had solder paste deposited and reflowed on the pads prior to component installation
Imagineering, Inc. | https://www.pcbnet.com/blog/identifying-and-correcting-solder-bridge-defects/
: No solder mask is present between adjacent pads Spacing of pads is too close Residue accumulation on the surface of a printed circuit board or stencil Misalignment during solder paste printing or
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