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TRC Circuits provides high quality printed circuit boards to a wide range of industries. We have 23 years of experience manufacturing printed circuit boards.
Tape KD851/852 is a polyimide film-backed silicone adhesive tape with high temperature resistant. Application Mask for printed circuit boards during wave solder or solder dip process. Features：KD851 Total Tape T
Advanced Solder Paste Printer with 2D and 3D SPI On-Board Standard Features Include: 3D Solder Paste Inspection 2D Solder Paste Inspection 3 Stage Automatic Conveyor Under Stencil Cleaning Full Process Control Programmable
Electronics Forum | Thu Jul 12 20:53:59 EDT 2001 | davef
Hussman: Please help us understand how knowing the profile will point us in the direction of how solder got under solder mask.
Electronics Forum | Thu Jul 05 21:42:28 EDT 2001 | davef
Most of our boards are fabricated with solder mask over bare copper [SMOBC], but we have couple where the solder isn't removed before masking. And ever so offin they's a liddy bit mo' solder than we'd like, which when reflowed, ends-up connecting so
Industry News | 2015-03-11 14:26:45.0
IPC’s global statistical programs for the laminate, solder, process consumables and assembly equipment industries are now open to new participants for 2015. The deadline for IPC members to sign up is April 15. Participation is free to IPC-member companies as a benefit of membership.
Industry News | 2010-04-10 02:09:54.0
If a picture is worth a thousand words, the new H revision of IPC-A-600, Acceptability of Printed Boards, is a priceless work of art for fabricators and assemblers, particularly inspectors and product developers. IPC — Association Connecting Electronics Industries® announces the new releases of IPC-A-600H and its companion document the C revision of IPC-6012, Qualification and Performance Specification for Rigid Printed Boards.
Technical Library | 2019-08-14 22:20:55.0
Cleanliness is a product of design, including component density, standoff height and the cleaning equipment’s ability to deliver the cleaning agent to the source of residue. The presence of manufacturing process soil, such as flux residue, incompletely activated flux, incompletely cured solder masks, debris from handling and processing fixtures, and incomplete removal of cleaning fluids can hinder the functional lifetime of the product. Contaminates trapped under a component are more problematic to failure. Advanced test methods are needed to obtain "objective evidence" for removing flux residues under leadless components.Cleaning process performance is a function of cleaning capacity and defined cleanliness. Cleaning performance can be influenced by the PCB design, cleaning material, cleaning machine, reflow conditions and a wide range of process parameters.This research project is designed to study visual flux residues trapped under the bottom termination of leadless components. This paper will research a non-destructive visual method that can be used to study the cleanability of solder pastes, cleaning material effectiveness for the soil, cleaning machine effectiveness and process parameters needed to render a clean part.
Technical Library | 2008-04-08 17:42:27.0
Concern about the failure of lead-free BGA packages when portable devices such as cell phones are accidentally dropped and a general concern about the resistance of these packages under shock loading has prompted an interest in the impact strength of the soldered BGA connection. This paper reports the results of the measurement of the impact strength of lead-free 0.5±0.01mm diameter BGA spheres on 0.42mm solder mask defined pads on copper/OSP and ENIG substrates using recently developed equipment that can load individual BGA spheres at high strain rates in shear and tension.
http://www.gpd-global.com No drip no drool across a wide range of fluid viscosities (low-to-mid and low-to-high). No manual adjustment to compensate for pump variability. Truly Volumetric PCD Pumps for total control of dispensing fluids. Ability to
PCB pad repair technique demonstrated using the 2-part epoxy method. More on this PCB pad repair technique: http://www.solder.net/services/pcb-repair/pad-and-trace-repair/ More on the recommended epoxy: http://www.soldertools.net/pcb-repair-epoxy-r
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Other courses related to electronics manufacturing and assembly
Events Calendar | Tue Aug 18 00:00:00 EDT 2020 - Tue Aug 18 00:00:00 EDT 2020 | ,
How to Minimize Humidity Interaction with PCBAs for Robustness
| http://etasmt.com:9060/te_news_industry/2021-09-01/24161.chtml
) Under what conditions do you set different temperatures for the TOP and Bottom heating elements of a reflow oven? (15) About us (23) SMT Reflow Oven Video
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-glossary-of-terms
. Low Temperature Alloy Refers to a solder alloy with a liquidus temperature below 183° C (361° F). See Liquidus . M Manhattan Effect See Tombstoning . Mask (Solder Mask
