New Equipment | Assembly Services
SMT Xtra offers a comprehensive range of quality pre-owned SMT and PTH equipment at competitive prices to suit all requirements and budgets... Smt Xtra is backed by the HSBC bank enabling us to offer customers easy payment terms with extended payme
New Equipment | Test Equipment
Koh Young KY8030-3 3D Inline SPI component Range: 01005 PCB size:350x330mm Dimension:1000x1335x1627mm weight:800kg Product description: Koh Young KY8030-3 3D Inline SPI, component Range: 01005, PCB size:350x330mm, Dimension:1000x1335x1627mm, weight:
Electronics Forum | Tue May 07 12:50:17 EDT 2019 | sankarseptember
Thanks for the response Thomas..You are correct I got solder paste on both edge on the nozzle type 4007. But it uses for nearly 30 types of part number ..and also I will get missing without any issues in nozzle..I am unable to find the trace in that.
Electronics Forum | Tue May 07 13:49:05 EDT 2019 | tey422
Like I stated before, I am not familiar with the machine. I can only make suggestions. If you found solder paste on the nozzle, clean it off to prevent part stuck to the nozzle tip. I would also check if the nozzle tips are being worn off; uneven we
Used SMT Equipment | AOI / Automated Optical Inspection
OMRON AOI VT-S720-A MACHINE Hardware Configuration Image signal input unit Main unit Power supply Air Camera Illumination Image resolution Feed method Line height PCB carrier width adjustment Ambient operating temperature Ambient opera
Used SMT Equipment | Soldering - Reflow
Electrovert Omniflow 7 Reflow Oven Model Number: Omniflow 7 Year 1997-1998 7 Heating Zones Top and Bottom 2 Cooling Zone Left to Right PCB Flow
Industry News | 2013-05-21 22:12:09.0
Based on its recent analysis of the surface mount technology (SMT) reflow soldering equipment market, Frost & Sullivan recognizes Heller Industries, Inc. with the 2013 Global Frost & Sullivan Award for Market Share Leadership.
Industry News | 2014-09-06 19:18:17.0
Briefing Co-hosted by IPC as Part of Continuing Effort to Connect IPC Members with Policymakers.
Technical Library | 2020-01-28 00:23:58.0
This paper explores new advances in the reflow soldering process including vacuum technology and warpage mitigation systems. The first topic for discussion will be the implementation of a vacuum process directly in a conventional inline soldering system. The second topic presented is the mitigation of warpage on substrates or wafers.
Technical Library | 2019-07-10 23:36:14.0
Pockets of gas, or voids, trapped in the solder interface between discrete power management devices and circuit assemblies are, unfortunately, excellent insulators, or barriers to thermal conductivity. This resistance to heat flow reduces the electrical efficiency of these devices, reducing battery life and expected functional life time of electronic assemblies. There is also a corresponding increase in current density (as the area for current conduction is reduced) that generates additional heat, further leading to performance degradation.
i4.0 Today caught up with Marc Peo of Heller Industries at IPC Apex Expo in San Diego, to discuss the IPC CFX initiative. Check out the rest of the CFX Videos from IPC APEX EXPO 2018 here: CFX Highlights: https://youtu.be/Q7_fWK7_zeA IPC Representati
https://www.ascen.ltd/Products/Solder_paste_printer/513.html full auto PCB screen printer and SMT solder paste printing machine with Image and optical system,It is a very accurate fully automatic SMT stencil printer.automatic PCB screen printer main
Events Calendar | Thu Jan 10 00:00:00 EST 2019 - Thu Jan 10 00:00:00 EST 2019 | Manassas, Virginia USA
SMTA Capital Chapter: Operation of a Vacuum Reflow Oven with Preliminary Void Reduction Data
Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,
IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2
Career Center | , Alabama Saudi Arabia | Engineering,Production,Research and Development
SNR MANUFACTURING ENGINEER WANTED Design Change Management and New product Introduction. Solder paste printing process (knowledge of Fuji screen printer machines. Stencil design/ modification and the use of Gerber data. SMT placement machines (Kno
Career Center | Brockton, Massachusetts USA | Production
Responsible for the programming, setup, complete maintenance, and troubleshooting of circuit board assembly line equipment and processes including, but not limited to, surface mount assembly machines, screen printer, pick and place machine, reflow ov
Career Center | Bangalore-560026, Karnataka India | Engineering,Maintenance,Technical Support
New Product Introduction & Product dovelopment
for missing balls (BGA's - figure 23), or bent or missing l
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/in-orcad-pcb-dra-missing-pad-stacks_topic2929_post11672.html
In OrCAD PCB .DRA, Missing Pad Stacks - PCB Libraries Forum Forum Home > PCB Footprint Expert > Questions & Answers New Posts FAQ Search Events Register Login In OrCAD PCB
GPD Global | https://www.gpd-global.com/co_website/fluid-dispense-solderpaste-pininpaste.php
Contacts Technical Support About Company Profile News Events Awards Employment » Applications » Paste Pin-In-Paste Soldering Pin-In-Paste Solder Paste Dispensing Pin-in-Paste for Solder Reflow Technology Solder Paste is used to make the electrical connection between a PCB and component
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