Electronics Forum | Tue Jul 25 13:40:04 EDT 2017 | davegoad
I have some CERSOT-23 transistor packages with castellated terminals. The 4th lead (drain castellation) is electrically connected to the top of the device by the castellation. The castellation goes up the ceramic body and contacts the metal package
Electronics Forum | Tue Jul 25 14:30:04 EDT 2017 | emeto
Looks like you have a great wetting of your paste :). Once body has been in contact with molten solder, the package could suffer damages on the body(outside and inside) and on the circuitry inside. It is considered a defect. I have seen that before a
Industry News | 2019-08-12 20:03:57.0
MIRTEC, ‘The Global Leader in Inspection Technology,’ today announced that it will display its award-winning 3D AOI, 2D AOI and SPI Inspection Systems in booth #1C55 with Mir Tech-win at the upcoming NEPCON ASIA (NEPCON SOUTH CHINA) exhibition, scheduled to take place August 28-30, 2019 at the Shenzhen Convention & Exhibition Center in China.
Industry News | 2023-05-30 06:34:56.0
For the first time, IPC hosted a regional hand soldering competition in Vincenza, Italy, at Focus on PCB May 17-18. Welcoming 28 competitors representing 20 Italian companies, contestants competed to build an assembly in accordance with IPC-A-610, Class 3 criteria and were judged on the functionality of the assembly, compliance with the assembly process, and overall product quality. IPC Master Instructors (MIT) from IPC training center GestLabs judged contestants, allowing a maximum of one hour to complete the process.
Technical Library | 2012-10-18 21:58:51.0
First published in the 2012 IPC APEX EXPO technical conference proceedings. In this paper, we report on a comprehensive study regarding the morphology evolution and voiding of SnAgCu solder joints on the central pad of two different packages – QFN and an Agilent package called TOPS – on PCBs with a Ni/Au surface finish.
EKT AOI machine application: inspection after stencil printing, pre/post reflow oven, pre/post wave soldering?FPC etc. Stencil printing: Solder unavailability, insufficient or excessive solder, solder misalignment, bridging, stain, scratch etc. Compo
SMTnet Express, April 20, 2017, Subscribers: 30,402, Companies: 10,575, Users: 23,153 High Throw Electroless Copper - Enabling new Opportunities for IC Substrates and HDI Manufacturing Tobias Sponholz, Lars-Eric Pribyl, Frank Brüning, Robin Taylor
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5246
The Role of Nickel in Solder Alloys - Part 2. The Effect of Ni on the Integrity of the Interfacial Intermetallic in Sn-Based/Cu Substrate Solder Joints 中文
Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf
The Effect of Vacuum Reflow Processing On Solder Joint Voiding And Thermal Fatigue Reliability To be published in the Proceedings of SMTA International, September 17 - 21, 2016, Rosemont, IL
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