Industry Directory: solder paste area pec (15)

Flason Electronic Co.,limited

Flason Electronic Co.,limited

Industry Directory | Manufacturer

Flason is high-tech enterprise focusing on SMT research and development,building new advanced solutions in SMT Assembly machines, like reflow oven, wave soldering machine, pick and place machine, AOI,SPI,PCB conveyor etc.

USA STENCILS , INC.

Industry Directory | Consultant / Service Provider / Manufacturer

Manufacturing SMT Stencil, Reballing stencil. SMT pallet; Wave solder pallet and Engineering Services

New SMT Equipment: solder paste area pec (95)

Large / Versatile Board Processing - DS Series Dispenser

Large / Versatile Board Processing - DS Series Dispenser

New Equipment | Dispensing

When Applications Require Large Board Processing &/or Versatility The DS Series of dispensers is a robust, large format platform designed to handle all types of applications with ease. Ideal for dispense applications utilizing adhesive, solder paste

GPD Global

High Precision Dispenser - MAX Series (Non-Heated)

High Precision Dispenser - MAX Series (Non-Heated)

New Equipment | Dispensing

High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En

GPD Global

Electronics Forum: solder paste area pec (597)

QFP area solder paste shifted

Electronics Forum | Wed Sep 19 21:04:57 EDT 2007 | wailiang81

Hi,davef, thanks for your concern. The condition was the pasted printed off with around 0.8~0.9mm from the land pattern. This will easy observe at QFP area. At fiducial, the stencil seens aligned accurately. Once solder bridge happend, its easy to

QFP area solder paste shifted

Electronics Forum | Wed Sep 19 21:08:28 EDT 2007 | wailiang81

Those others parts also happend printed not accurate, but there is no solder problem. Only the QFP area looks bad condition.

Used SMT Equipment: solder paste area pec (43)

DEK Horizon 03iX Solder Paste Printer

DEK Horizon 03iX Solder Paste Printer

Used SMT Equipment | Screen Printers

DEK Horizon 03iX Fully Automatic Screen Solder Paste Printer Model Horizon 03iX Operating System Win XP+09sp13 or up  PCB support Tooling&n

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

DEK Horizon 03iX Screen Printer

DEK Horizon 03iX Screen Printer

Used SMT Equipment | Screen Printers

DEK Horizon 03iX Fully Automatic Screen Solder Paste Printer Model Horizon 03iX Operating System Win XP+09sp13 or up  PCB support Tooling&n

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Industry News: solder paste area pec (566)

Frost & Sullivan Award Highlights Heller Industries' Achievements in Global SMT Reflow Soldering Equipment Market

Industry News | 2013-05-21 22:12:09.0

Based on its recent analysis of the surface mount technology (SMT) reflow soldering equipment market, Frost & Sullivan recognizes Heller Industries, Inc. with the 2013 Global Frost & Sullivan Award for Market Share Leadership.

Heller Industries Inc.

Henkel Names New Global Sales Director for Semiconductor Materials

Industry News | 2009-02-02 18:48:47.0

Henkel today announced the appointment of Mr. Luc Godefroid as the company's Global Sales Director for its Semiconductor Group. A key member of Henkel's electronics sales team since 2001, Godefroid's new role sees him building on his previous success and directing the global sales efforts of Henkel's worldwide team and expanded product portfolio.

Heller Industries Inc.

Parts & Supplies: solder paste area pec (3)

ASC International 3D SPI-7500 Vision CE

ASC International 3D SPI-7500 Vision CE

Parts & Supplies | SPI / Solder Paste Inspection

Quick programming, friendly programming interface Multiple measurement methods True one-button measurement Eight-way motion button, one-click focus Adjustable scanning pitch Solder paste 3D simulation function Powerful SPC function MARK

KingFei SMT Tech

Saki Saki 3D SPI machine

Parts & Supplies | Soldering Equipment/Fluxes

3D Solder Paste Inspection Machine  Features : Easy to use by fully motorize X-Y scan mechanism. Easy to program by Gerber image navigator Easy to repeat the same job by loading the saved program User-friendly color image live view operation Ea

Goodluck Electronic Equipment Co.,Ltd

Technical Library: solder paste area pec (22)

THE EFFECT OF VACUUM REFLOW PROCESSING ON SOLDER JOINT VOIDING AND THERMAL FATIGUE RELIABILITY

Technical Library | 2023-01-17 17:19:44.0

A test program was developed to evaluate the effectiveness of vacuum reflow processing on solder joint voiding and subsequent thermal cycling performance. Area array package test vehicles were assembled using conventional reflow processing and a solder paste that generated substantial void content in the solder joints. Half of the population of test vehicles then were re-processed (reflowed) using vacuum reflow. Transmission x-ray inspection showed a significant reduction in solder voiding after vacuum processing. The solder attachment reliability of the conventional and vacuum reflowed test vehicles was characterized and compared using two different accelerated thermal cycling profiles. The thermal cycling results are discussed in terms of the general impact of voiding on solder thermal fatigue reliability, results from the open literature, and the evolving industry standards for solder voiding. Recommendations are made for further work based on other void reduction methods and additional reliability studies.

Heller Industries Inc.

BGA Rework. A Comparative Study of Selective Solder Paste Deposition For Area Array Packages

Technical Library | 2007-02-01 09:57:15.0

The rapid assimilation of Ball Grid Array (BGA) and other Area Array Package technology in the electronics industry is due to the fact that this package type allows for a greater I/O count in a smaller area while maintaining a pitch that allows for ease of manufacture.

BEST Inc.

Videos: solder paste area pec (228)

Contour Mapping for Precision Fluid Dispense

Contour Mapping for Precision Fluid Dispense

Videos

When Applications Require Large Board Processing &/or Versatility The DS Series of dispensers is a robust, large format platform designed to handle all types of applications with ease. Ideal for dispense applications utilizing adhesive, solder paste

GPD Global

High SPEED Glue dispensing with GPD Global Max series Glue Dispenser

High SPEED Glue dispensing with GPD Global Max series Glue Dispenser

Videos

High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En

GPD Global

Training Courses: solder paste area pec (5)

Non-Destructive BGA/Area Array Component Rework - Technical Workshop

Training Courses | | | PCB Rework and Hand Soldering Courses

The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.

PACE Worldwide

Void Formation in Solder Joints - Causes & Cures - Online Webinar

Training Courses | | | PCB Assembly Courses

The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.

ASKbobwillis.com

Events Calendar: solder paste area pec (9)

SMTA Capital Chapter: Non-Destructive BGA/Area Array Component Rework

Events Calendar | Tue Feb 19 00:00:00 EST 2019 - Tue Feb 19 00:00:00 EST 2019 | Elkridge, Maryland USA

SMTA Capital Chapter: Non-Destructive BGA/Area Array Component Rework

Surface Mount Technology Association (SMTA)

SMTA China East Conference 2018

Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China

SMTA China East Conference 2018

Surface Mount Technology Association (SMTA)

Career Center - Jobs: solder paste area pec (6)

Sales Representative

Career Center | Costa Mesa, California USA | Engineering,Sales/Marketing,Technical Support

SALES- Growth opportunity to join a growing Manufacturers Rep firm. Looking for an aggressive sales professional to cover San Diego and the Mexican boarder areas of Tijuana, Tecate and Mexicali. Previous sales experience required selling to ele

West-Tech Materials

Process Engineer

Career Center | Brookfield, Wisconsin USA | Engineering

MANUFACTURING ENGINEER, SMT ELECTRONICS -- $45,000 to $55,000 + O.T. Company: Well established and very profitable division of a Fortune 500 Company that is manufacturing a wide variety of automotive aftermarket products. They have seen steady gro

Prime Resource Associates, Inc.

Career Center - Resumes: solder paste area pec (29)

CAD CAM (SMT Stencil Design) Engr &Team leader

Career Center | Bangalore, India | Engineering,Maintenance,Production,Technical Support

SMT Stencil designing & Knowledge of full SMT process software known CAD/CAM -circuit CAM Pro 7.3,GC Power station, GCCAM Edit,Auto CAD, Fault finding of Electronic Boards & Servicing electronic machines.

BankeemChheda-Resume

Career Center | Rochester, New York USA | Engineering

I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research

Express Newsletter: solder paste area pec (1035)

Partner Websites: solder paste area pec (1266)

Solder Paste | Nordson ASYMTEK

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/fluid-types/solder-paste?con=t&page=6

Solder Paste | Nordson ASYMTEK ASYMTEK Products Corporate | Global Directory | Languages Division Only All of Nordson Fluid Dispensing Systems Jets

ASYMTEK Products | Nordson Electronics Solutions

Solder Paste Shelf Life and Testing | EPTAC

| https://www.eptac.com/soldertips/solder-paste-shelf-life-and-testing/

. The same applies to flux within the core of the wire solders being used in the industry, however; the flux in the solder paste has an extra function, preparing the solder powder in addition to preparing the component lead and pad area


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