New Equipment | Solder Materials
8 hours), and abandon time (>4 hours) Printing: Suitable for high speed printing up to 150 mm/s Reflow: Solderable on challenging surface finishes (CuNiZn and Copper OSP) Colorless residues for easy post-reflow inspection Careful contr
Electronics Forum | Tue May 11 15:56:10 EDT 2010 | davef
First, you mix the paste in the jar with the centrifugal thing-a-ma-jig. Then what? So, how are you going to get the paste from the jar into the syringe [cartridge], anyhow? Are you going to use an Atlas Tool? How are you going to de-air the syri
Electronics Forum | Thu May 13 01:41:31 EDT 2010 | nrw
Thank you everyone, I realise the problems now and the whole exercise might not be worth the money saved, versus just throwing out the leftover paste. I am based in Australia, so the number of players in this market is small and they know it. The pr
SMT Express, Issue No. 1 - from SMTnet.com Volume 1, Issue No. 1 Thursday, June 3, 1999 Tricks of the Trade Optimizing Time/Pressure Dispensing ofAdhesives by Chrys Shea Return to Previous Page Over the past
