New Equipment | Solder Paste Stencils
PNC Inc. uses LPKF Laser Technology to manufacture SMT Solder paste stencil, high tolerance aperture openings with superior registration for it’s solder paste stencils. With it’s 4 mil beam diameter, our Laser is capable of cutting small aperture ope
New Equipment | Solder Paste Stencils
Stentech's frame-manufacturing department can make any shape and size according to our customers' needs. Frames can be made of aluminium, steel, plastic and most any kind of material. Frames can be cast, formed, welded, screwed, and/or bolted togethe
Electronics Forum | Wed Jan 23 18:15:33 EST 2008 | gsala
Hi, are you dealing with Leaded or Lead Free P-BGA ? soldering by Lead or Lead Free paste ? Any way, some time, bridges can be caused by moisture entrapped in the BGA body. Make sure if is respected the correct MSL's allowed flore exposure time, ot
Electronics Forum | Thu Jan 17 11:49:54 EST 2008 | wayne123
HI, I have ran into this a time or two, and what I did before we got the BGA rework station was to run some flux under the component, and since the flux that was in the solder on the other solder joints has at least part of the way burned off in the
Industry News | 2018-10-18 10:13:08.0
The Application of the Pin-in-Paste Reflow Process
Industry News | 2018-10-18 08:27:03.0
An Analysis of SMT Solder Paste Printing Defects
Technical Library | 2013-07-03 10:31:54.0
It has been demonstrated in numerous pieces of work that stencil printing, one of the most complex PCB assembly processes, is one of the largest contributors to defects (Revelino et el). This complexity extends to prototype builds where a small number of boards need to be assembled quickly and reliably. Stencil printing is becoming increasingly challenging as packages shrink in size, increase in lead count and require closer lead spacing (finer pitch). Prototype SMT assembly can be further divided between industrial and commercial work and the DIYer, hobbyist or researcher groups. This second group is highly price sensitive when it comes to the materials used for the board assembly as their funds are sourced from personal or research monies as opposed to company funds. This has led to development of a lower cost SMT printing stencil made from plastic film as opposed to the more traditional stainless steel stencil used by industrial and commercial users.This study compares the performance of these two traditional materials and their respective impact on solder paste printing including efficiency and print quality.
Technical Library | 2013-03-12 13:25:18.0
High density and miniaturized circuit assemblies challenge the solder paste printing process. The use of small components such as 0201, 01005 and μBGA devices require good paste release to prevent solder paste bridging and misalignment. When placing these miniaturized components, taller paste deposits are often required. To improve solder paste deposition, a nano-coating is applied to laser cut stencils to improve transfer efficiency. One concern is the compatibility of the nano-coating with cleaning agents used in understencil wipe and stencil cleaning. The purpose of this research is to test the chemical compatibility of common cleaning agents used in understencil wipe and stencil cleaning processes.Compatibility of Cleaning Agents With Nano-Coated Stencils
The Sawa Eco-Roll eliminates waste and saves money by reusing wiper rolls for printing machines. The SC-ER360 cleans wiper rolls in just 20 minutes and measures W900 x D850 x H1200 mm. Sawa Stencil Cleaners are widely used in the Japanese electronic
This animation shows the overview of programming and running of a MYDATA MY500 Jet Printing machine. Check the ''Jet Printing in detail'' video to see how Jet Printing works
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Career Center | Rochester, New York USA | Engineering
I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research
SMTnet Express, April 5, 2018, Subscribers: 30,982, Companies: 10,916, Users: 24,587 High Reliability and High Throughput Ball Bumping Process Solution – Solder Joint Encapsulant Adhesives Dr. Mary Liu and Dr. Wusheng Yin; YINCAE Advanced
| https://www.feedersupplier.com/sale-13119494-145515-dek-solder-paste-stencil-printer-timing-belt.html
Printer Parts 145515 DEK Solder Paste Stencil Printer Timing Belt Basic Information Place of Origin: Guangdong, China Brand Name: dek Model Number: 145515 Minimum Order Quantity
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/fluid-types/solder-paste?con=t&page=8
Solder Paste | Nordson ASYMTEK ASYMTEK Products Corporate | Global Directory | Languages Division Only All of Nordson Fluid Dispensing Systems Jets
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