Industry Directory: solder paste density (214)

Heller Industries Inc.

Heller Industries Inc.

Industry Directory | Manufacturer

Reflow ovens for automated SMT PCB assembly, specializing in lead free processing and nitrogen reflow. The best convection reflow ovens on the market.

Pillarhouse USA

Pillarhouse USA

Industry Directory | Equipment Dealer / Broker / Auctions / Manufacturer / Manufacturer's Representative / Training Provider

Global OEM manufacturer of selective wave soldering machines. With a world-wide install base in over 65 countries, we are a global leader in the selective soldering space. Highly customized solutions available in all industries.

New SMT Equipment: solder paste density (5458)

SMT Dispensing Pumps for Integration

SMT Dispensing Pumps for Integration

New Equipment | Dispensing

Retrofit existing system with Innovative Dispensing Technology for Excellent Dispense Control and Repeatability Advanced pump technologies available for retrofitting include: True Volumetric Pump, Precision Auger Pump, Simplified Jetting Pump and Ti

GPD Global

Precision Auger Pump

Precision Auger Pump

New Equipment | Dispensing

New Advanced Precision Auger Pump - Single Pump Solution The Precision Auger pump is designed to work with mid-to-high viscosity liquid such as glues, conductive, and non-conductive adhesive and pastes.  The pump is controlled with a servo motor equ

GPD Global

Electronics Forum: solder paste density (6703)

Re: Very high interconnect density

Electronics Forum | Thu Sep 30 03:37:26 EDT 1999 | Brian

| We are all faced with increasing interconnect density in all we do. This means smaller everything, especially components and that which they are mounted upon but, hopefully, without smaller minds and thoughts. It all demands more process control an

Re: Very high interconnect density

Electronics Forum | Fri Oct 01 00:18:18 EDT 1999 | Earl Moon

| | We are all faced with increasing interconnect density in all we do. This means smaller everything, especially components and that which they are mounted upon but, hopefully, without smaller minds and thoughts. It all demands more process control

Used SMT Equipment: solder paste density (472)

Industry News: solder paste density (3423)

Heller Industries Announces Joint Development Agreement with IBM for Fluxless Mass Reflow Soldering Process for High Volume Manufacturing

Industry News | 2013-08-15 20:58:22.0

Heller Industries announced today that they have entered into a joint development agreement with International Business Machines Corporation (NYSE: IBM), to collaborate on the development of fluxless mass reflow furnace equipment and process for high volume manufacturing. The fluxless process utilizes gas phase formic acid to replace standard fluxing agents, and eliminates the need for pre-reflow fluxing and post-reflow flux cleanup steps.

Heller Industries Inc.

Frost & Sullivan Award Highlights Heller Industries' Achievements in Global SMT Reflow Soldering Equipment Market

Industry News | 2013-05-21 22:12:09.0

Based on its recent analysis of the surface mount technology (SMT) reflow soldering equipment market, Frost & Sullivan recognizes Heller Industries, Inc. with the 2013 Global Frost & Sullivan Award for Market Share Leadership.

Heller Industries Inc.

Parts & Supplies: solder paste density (130)

Panasonic  8x4mm SMT feeder

Panasonic 8x4mm SMT feeder

Parts & Supplies | Pick and Place/Feeders

Panasonic  10896BF071 8x4mm SMT feeder More SMT parts in stocks: SMT equipment and accessories: SMT Feeders, smt nozzles, feeder parts, feeder storage cart, conveyor, SMD parts counter, solder paste , nozzle filter, board, bearing, motor, cylinder,

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Panasonic High quality Panasonic SMT printer SP18 SP60 SP28 stainless steel squeegee for solder paste and red glue

Panasonic High quality Panasonic SMT printer SP18 SP60 SP28 stainless steel squeegee for solder paste and red glue

Parts & Supplies | Screen Printers

High quality Panasonic SMT printer SP18 SP60 SP28 stainless steel squeegee for solder paste and red glue ZK Electronic Technology Co.,Limited becky@hysmt.cn www.smt-cn.com skype:beckysmt wechat:15323874439

ZK Electronic Technology Co., Limited

Technical Library: solder paste density (200)

Vacuum Fluxless Reflow Technology for Fine Pitch First Level Interconnect Bumping Applications

Technical Library | 2023-01-17 17:58:36.0

Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.

Heller Industries Inc.

Void Reduction in Bottom Terminated Components Using Vacuum Assisted Reflow

Technical Library | 2019-07-10 23:36:14.0

Pockets of gas, or voids, trapped in the solder interface between discrete power management devices and circuit assemblies are, unfortunately, excellent insulators, or barriers to thermal conductivity. This resistance to heat flow reduces the electrical efficiency of these devices, reducing battery life and expected functional life time of electronic assemblies. There is also a corresponding increase in current density (as the area for current conduction is reduced) that generates additional heat, further leading to performance degradation.

Heller Industries Inc.

Videos: solder paste density (597)

No drip or drool across a wide range of fluid viscosities (low-to-mid and low-to-high) with GPD Global PCD Pumps for total control of your dispensing fluids.

No drip or drool across a wide range of fluid viscosities (low-to-mid and low-to-high) with GPD Global PCD Pumps for total control of your dispensing fluids.

Videos

http://www.gpd-global.com No drip no drool across a wide range of fluid viscosities (low-to-mid and low-to-high). No manual adjustment to compensate for pump variability. Truly Volumetric PCD Pumps for total control of dispensing fluids. Ability to

GPD Global

Precision Auger Pump Cleaning - Easy

Precision Auger Pump Cleaning - Easy

Videos

New Advanced Precision Auger Pump - Single Pump Solution The Precision Auger pump is designed to work with mid-to-high viscosity liquid such as glues, conductive, and non-conductive adhesive and pastes.  The pump is controlled with a servo motor equ

GPD Global

Training Courses: solder paste density (21)

Virtual Course: PCB Design for Implementing 3D and High Density Semiconductor Package Technologies

Training Courses | | | PCB Design Courses

The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.

Surface Mount Technology Association (SMTA)

Events Calendar: solder paste density (34)

Stencil Printing Process and Solder Paste Inspection – An In-Depth Look - SMTA Webtorial

Events Calendar | Wed Apr 18 00:00:00 EDT 2018 - Thu Apr 19 00:00:00 EDT 2018 | ,

Stencil Printing Process and Solder Paste Inspection – An In-Depth Look - SMTA Webtorial

Surface Mount Technology Association (SMTA)

Fan Out Packaging- Technology Overview and Evolution - SMTA Webtorial

Events Calendar | Tue Jul 17 00:00:00 EDT 2018 - Wed Jul 18 00:00:00 EDT 2018 | ,

Fan Out Packaging- Technology Overview and Evolution - SMTA Webtorial

Surface Mount Technology Association (SMTA)

Career Center - Jobs: solder paste density (60)

Process Engineer

Career Center | Dallas, Texas USA | Engineering

Skills/Requirements: 4+years of experience in SMT process engineering, specializing in solder related issues. Strong experience with solder paste, reflow wave solder, etc. Duties/Finctions: Provide expertise to SMT processes through solder process en

EMSR, Inc.

SMT Operator

Career Center | Fremont, California USA | Production,Quality Control

Local industry leading EMS Company seeking SMT operators. Will be doing SMT line Change overs, SMT machine operation for solder printing, placement, reflow. Solder paste height measurement and record. Solder printing quality check after solder paste

Adecco USA, Inc

Career Center - Resumes: solder paste density (71)

Cad designer

Career Center | Daviddav, India | Engineering,Maintenance,Production,Quality Control,Research and Development

Created and defined component landing patterns for high density layouts beyond the specifications of IPC standards and in compliance with RoHs. • Designing SMT stencils (Solder paste & Glue(Epoxy) stencils).

SMT Manufacturing

Career Center | , | Engineering,Maintenance,Production

Production Planning ~ Supply Chain Management ~ Productivity Management ~ Sub Contracting Management ~ Process Quality Management ~ Process innovation & Lean Mfg ~ Cost efficiency Management ~ Manpower Management ~Multi Skilling & Training, Six Sigma

Express Newsletter: solder paste density (1017)

SMTnet Express - March 1, 2018

SMTnet Express, March 1, 2018, Subscribers: 31,280, Companies: 10,908, Users: 24,452 Deposition of Solder Paste into High Density Cavity Assemblies Fernando Coma, Jeffrey Kennedy, Thilo Sack; Celestica Corporation Circuit functional density

Partner Websites: solder paste density (23259)

Cyberoptics Solder Paste

1st Place Machinery Inc. | http://www.firstplacemachinery.com/first_place_smt_pcb_aoi_cyberoptics.html

Cyberoptics Solder Paste   Cyberoptics Solder Paste Inspection Model Number: SE200 2D/3D Solder Paste Inspection 115 volt  Serial Number: 45026 Year: July 2000 Includes Monitor - Keyboard - Mouse No Manual

1st Place Machinery Inc.

Solder Paste | Nordson ASYMTEK

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/fluid-types/solder-paste?con=t&page=6

Solder Paste | Nordson ASYMTEK ASYMTEK Products Corporate | Global Directory | Languages Division Only All of Nordson Fluid Dispensing Systems Jets

ASYMTEK Products | Nordson Electronics Solutions


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