Jet printing for high mix production The MY500 Jet Printer is a breakthrough innovation. Well proven on five continents, it shoots solder paste on the fly at split-second speeds while moving above the board. The MY500 is designed to keep pace with
Exceptional repeatability and print accuracy FLEXIBILITY - SP700AVi platforms address the critical demands of fast set up and product changeover through flexible automation strategies that streamline assembly throughput. AUTOMATION - Features inc
Electronics Forum | Thu Aug 06 09:51:20 EDT 1998 | Bob Willis
This text may be of interest to any one with tin lead spots Guide to Solder Spots - A New Plague in Manufacture ? So what are solder spots ? They appear to be the next big problem in modern reflow assembly in fact in any process that involves solder
Electronics Forum | Mon Jun 25 20:37:14 EDT 2001 | davef
You are 100% correctamundo that the pad on PCB should be the same as the pad on the BGA interposer, but let�s not expend that thinking to the aperture of your solder paste stencil, right away. Generally, paste on large pitch BGA is often 1:1, but as
Industry News | 2003-04-30 08:51:08.0
Electrolube played the role of environmental champion in Australia recently.
Industry News | 2012-01-13 13:27:59.0
The SMT stencil market has a slew of new options in foil materials, coatings and cutting technologies, all of which promise to improve the solder paste printing process. Which of these options really do help assemblers keep yields up and costs down, and which don’t?
Technical Library | 2017-04-13 16:14:27.0
The drive to reduced size and increased functionality is a constant in the world of electronic devices. In order to achieve these goals, the industry has responded with ever-smaller devices and the equipment capable of handling these devices. The evolution of BGA packages and leadless devices is pushing existing technologies to the limit of current assembly techniques and materials.As smaller components make their way into the mainstream PCB assembly market, PCB assemblers are reaching the limits of Type 3 solder paste, which is currently in use by most manufacturers.The goal of this study is to determine the impact on solder volume deposition between Type 3, Type 4 and Type 5 SAC305 alloy powder in combination with stainless steel laser cut, electroformed and the emerging laser cut nano-coated stencils. Leadless QFN and μBGA components will be the focus of the test utilizing optimized aperture designs.
This animation shows the overview of programming and running of a MYDATA MY500 Jet Printing machine. Check the ''Jet Printing in detail'' video to see how Jet Printing works
Speedprint SP710 SMT stencil printer with the ADu+ option can now put down glue and paste lines
Career Center | tulsa, Oklahoma | Engineering
Printed Circuit Assembly Process Engineer. Seeking a position in a high-technology operation, utilizing my background supporting a progressive and growth-oriented organization. Offering the technical experience, expertise, and skills gained during th
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ASCEN Technology | https://www.ascen.ltd/Products/Solder_paste_printer/171.html
” on the boards using the silk-screen method. When the PCB solder paste printer finish the component soldering, the PCB boards are transferred to the SMT assembly line, where the components will be soldered
KingFei SMT Tech | https://www.smtspare-parts.com/sale-9441243-automatic-solder-paste-mixer-smt-assembly-equipment-tin-cream-mixer-for-pcb-assembly.html
Automatic Solder Paste Mixer SMT Assembly Equipment Tin Cream Mixer For PCB Assembly Leave a Message We will call you back soon
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