Industry Directory | Manufacturer
Reflow ovens for automated SMT PCB assembly, specializing in lead free processing and nitrogen reflow. The best convection reflow ovens on the market.
Industry Directory | Equipment Dealer / Broker / Auctions
BAJA Bid was founded to form an auction organization with the primary objective of providing an outstanding experience for both our buyers and sellers.
When Applications Require Large Board Processing &/or Versatility The DS Series of dispensers is a robust, large format platform designed to handle all types of applications with ease. Ideal for dispense applications utilizing adhesive, solder paste
New Equipment | Solder Paste Stencils
Flip Up SMT Rework Stencils are laser cut solder paste stencils designed to replicate the intial manufacturing process albeit for a designated component or selected area. These laser cut mini stencils can either have flaps (to prevent neighboring are
Used SMT Equipment | Screen Printers
2007 Speedline Accuflex Screen Printer - WATCH VIDEO LINK(S) - Power: 110V; 5A; 60Hz Serial: AFMMI-100701 Features: O/S: Windows 2000; S/W: 8.6.0 Automatic Tooling 2D Post Solder Inspection Stencil Wipe; SMEMA Solder Paste Dispenser
Used SMT Equipment | Screen Printers
MPM AP25 Screen Printer Dimensions: 70" x 64" x 60" [AP25] Dimensions: 22" x 22" x 25" [SPS_5] Serial: 6913 Features: Includes Malcolm Solder Paste Softener
Industry News | 2013-05-21 22:12:09.0
Based on its recent analysis of the surface mount technology (SMT) reflow soldering equipment market, Frost & Sullivan recognizes Heller Industries, Inc. with the 2013 Global Frost & Sullivan Award for Market Share Leadership.
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Technical Library | 2007-02-01 09:57:15.0
The rapid assimilation of Ball Grid Array (BGA) and other Area Array Package technology in the electronics industry is due to the fact that this package type allows for a greater I/O count in a smaller area while maintaining a pitch that allows for ease of manufacture.
Technical Library | 2007-06-21 17:03:16.0
The rapid assimilation of Ball Grid Array (BGA) and other Area Array Package technology in the electronics industry is due to the fact that this package type allows for a greater I/O count in a smaller area while maintaining a pitch that allows for ease of manufacture (...) While there have been several studies comparing these two attachment methods, this study highlights the effect of rework technique on the electrical characteristics and reliability of reworked BGAs.
http://www.gpd-global.com No drip no drool across a wide range of fluid viscosities (low-to-mid and low-to-high). No manual adjustment to compensate for pump variability. Truly Volumetric PCD Pumps for total control of dispensing fluids. Ability to
When Applications Require Large Board Processing &/or Versatility The DS Series of dispensers is a robust, large format platform designed to handle all types of applications with ease. Ideal for dispense applications utilizing adhesive, solder paste
Training Courses | ON DEMAND | | Other Courses
Other courses related to electronics manufacturing and assembly
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Events Calendar | Wed Apr 29 18:30:00 UTC 2020 - Wed Apr 29 18:30:00 UTC 2020 | ,
Screen Printing Key Factors
Events Calendar | Tue May 30 18:30:00 UTC 2023 - Tue May 30 18:30:00 UTC 2023 | Holtsville, New York USA
Long Island Chapter Meeting: Fine Feature Paste Printing, Stencil Design and Solder Technology
Career Center | , Sant Julia de Loria Saudi Arabia | Engineering,Production,Research and Development
SNR MANUFACTURING ENGINEER WANTED Design Change Management and New product Introduction. Solder paste printing process (knowledge of Fuji screen printer machines. Stencil design/ modification and the use of Gerber data. SMT placement machines (Kno
Career Center | Brockton, Massachusetts USA | Production
Responsible for the programming, setup, complete maintenance, and troubleshooting of circuit board assembly line equipment and processes including, but not limited to, surface mount assembly machines, screen printer, pick and place machine, reflow ov
Career Center | Danao city, Cebu Philippines | Engineering,Maintenance,Production,Quality Control
JUKI Chip Mounter Maintenance and Troubleshooting JUKI Chip Mounter programming MINAMI Solder Paste Printer Maintenance and Troubleshooting MINAMI Solder Paste Printer programming PWB Loader / Unloader Maintenance and Troubleshooting TAMURA Reflow ma
Career Center | Hyderabad, Telangana India | Engineering,Maintenance,Production
Experience in handling Process related issues throughout the Product Manufacturability. Programming and maintenance of SMT Pick and Place Machines of Mirae, Panasonic, NXT and MyData Programming and maintenance of Solder Paste Printer of DEK
SMT Express, Volume 3, Issue No. 5 - from SMTnet.com Volume 3, Issue No. 5 Thursday, May 17, 2001 Featured Article Return to Front Page Solder Paste Measurement: A Yield Improvement Strategy That Helps Improve Profits by Mike Riddle , ASC
to Front Page Solder Paste Measurement: A Yield Improvem
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145515 DEK Solder Paste Stencil Printer Timing Belt Leave a Message We will call you back soon! Your message must be between 20-3,000 characters
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