SMT Production Line Usage Automatic No Clean Lead Free Solder Paste Heater Type: Thawing machine Power Source: Electric Dimension(L*W*H): L500 x W300cm x H230mm Weight: 15KG Warranty: One year Condition: New Place of Origin: Guangdong, Chin
SMT Production Line Usage Automatic No Clean Lead Free Solder Paste Heater Type: Thawing machine Power Source: Electric Dimension(L*W*H): L500 x W300cm x H230mm Weight: 15KG Warranty: One year Condition: New Place of Origin: Guangdong, Chin
Industry News | 2018-10-18 08:39:14.0
Stencil Technology for SMT production
Industry News | 2018-10-18 08:40:47.0
Stencil aperture considerations for QFN chips
Technical Library | 2013-01-24 19:16:35.0
The electronics industry has mainly adopted the higher melting point Sn3Ag0.5Cu solder alloys for lead-free reflow soldering applications. For applications where temperature sensitive components and boards are used this has created a need to develop low melting point lead-free alloy solder pastes. Tin-bismuth and tin-bismuth-silver containing alloys were used to address the temperature issue with development done on Sn58Bi, Sn57.6Bi0.4Ag, Sn57Bi1Ag lead-free solder alloy pastes. Investigations included paste printing studies, reflow and wetting analysis on different substrates and board surface finishes and head-in-pillow paste performance in addition to paste-in-hole reflow tests. Voiding was also investigated on tin-bismuth and tin-bismuth-silver versus Sn3Ag0.5Cu soldered QFN/MLF/BTC components. Mechanical bond strength testing was also done comparing Sn58Bi, Sn37Pb and Sn3Ag0.5Cu soldered components. The results of the work are reported.
Technical Library | 2018-09-05 21:41:30.0
In recent years, a growing number of electronic devices are being incorporated into automotive and other high reliability end products where the challenge is to make these devices more reliable. The package size of the devices is largely driven by the consumer industry with their sizes getting smaller making it harder to assemble and be reliable at the same time. For automotive and other high reliability electronics product, it is of the utmost priority to secure high reliability because it directly involves human life and safety. Challenges include selecting an appropriate solder alloy and having good reliability of the solder paste flux.
LED Lead Free Reflow Oven for LED Lighting ❙ Introduce of Reflow Soldering Oven ETA advanced reflow oven, reflow soldering, reflow soldering oven, SMT reflow oven technology | 25 years SMT technology experience | professional overse
Hot Sale SMT Lead Free Reflow Oven Solder Machine for LED Production Line ❙ Introduce of Reflow Soldering Oven ETA advanced reflow oven, reflow soldering, reflow soldering oven, SMT reflow oven technology | 25 years SMT technology ex
SMTnet Express, Septemeber 1, 2016, Subscribers: 26,288, Companies: 14,937, Users: 41,025 Reliability Study of Low Silver Alloy Solder Pastes Jennifer Nguyen, David Geiger and Murad Kurwa; Flex (Flextronics International) Sn3.0Ag0.5Cu (SAC305
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ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/fluid-types/solder-paste?con=t&page=1
Automated Dispensing of Lead Free Solder Paste Nordson ASYMTEK A. Lewis (2003) (PDF 254 KB) Advancements in Solder Paste Dispensing Nordson ASYMTEK D. Ashley, S. Adamson
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