Industry Directory | Manufacturer
A US manufacturer of quality hand tools for those engaged in the repair, rework, R & D, testing, and assembly of electronic components and printed circuit boards from Through Hole to 2Mil Pitch Surface Mount.
Industry Directory | Association / Non-Profit / Events Organizer / Training Provider
The SMTA membership is a network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies and related business operations.
New Equipment | Education/Training
The purpose of these courses is to promote best manufacturing practices and enhance the individual’s job performance. These courses are indispensable for everyone involved in Electronics Manufacturing. Blackfox is widely recognized in the industry fo
New Equipment | Education/Training
IPC - Association Connecting Electronics Industries® offers globally recognized industry-traceable training and certification programs on key Electronics Industry Standards. Blackfox, founded in 1996, is the premier Worldwide Approved IPC Training Ce
Electronics Forum | Thu Aug 12 05:06:12 EDT 1999 | FMung
Hello, Can any netters suggest what critical parameters should be considered & what are there assoicated impacts for a solder paste printing process ... B.Regards, Felix
Electronics Forum | Wed Dec 17 13:25:38 EST 2008 | evtimov
I am printing on DEKs and using simulara paramateres as for a solder it works really fine. In general going faster gives you more paste/glue. Less pressure gives you more paste/glue again. All the rest depends on your current board. Regards, Emil
Used SMT Equipment | Pick and Place/Feeders
Product name: KE - 3010ACL high-speed chipmounter Acl. Product code: KE - 3010 Detailed product introduction Characteristic： Constantly improve the KE series products. So as to realize the high speed highquality electric production line of
Used SMT Equipment | SMT Equipment
Product name: KE – 3010ACL high-speed chip mounter Acl. Product code: KE - 3010 Detailed product introduction Characteristic： Constantly improve the KE series products. So as to realize the high speed high quality electric production line of f
Industry News | 2013-08-15 20:58:22.0
Heller Industries announced today that they have entered into a joint development agreement with International Business Machines Corporation (NYSE: IBM), to collaborate on the development of fluxless mass reflow furnace equipment and process for high volume manufacturing. The fluxless process utilizes gas phase formic acid to replace standard fluxing agents, and eliminates the need for pre-reflow fluxing and post-reflow flux cleanup steps.
Industry News | 2020-11-03 18:16:39.0
2020 Global Surface Mount Technology Company Of The Year Award (Soldering Equipment)
Parts & Supplies | SPI / Solder Paste Inspection
Quick programming, friendly programming interface Multiple measurement methods True one-button measurement Eight-way motion button, one-click focus Adjustable scanning pitch Solder paste 3D simulation function Powerful SPC function MARK
Parts & Supplies | Solder Paste Mixers
Solder Cream Mixer Feature of Solder Cream Mixer Excellent for ISO 9000 solder paste mix process condition. Strong mixing power. Increasing printing quality. Cream Solder Mixer Led display panel and microprocessor control, easy to operate. Unive
Technical Library | 2023-01-17 17:12:33.0
Reflowed indium metal has for decades been the standard for solder thermal interface materials (solder TIMs or sTIMs) in most high-performance computing (HPC) TIM1 applications. The IEEE Heterogeneous Integration Thermal roadmap states that new thermal interface materials solutions must provide a path to the successful application of increased total-package die areas up to 100cm2. While GPU architectures are relatively isothermal during usage, CPU hotspots in complex heterogeneously-integrated modules will need to be able to handle heat flux hotspots up to 1000W/cm2 within the next two years. Indium and its alloys are used as reflowed solder thermal interface materials in both CPU and GPU "die to lid/heat spreader" (TIM1) applications. Their high bulk thermal conductivity and proven long-term reliability suit them well for extreme thermomechanical stresses. Voiding is the most important failure mode and has been studied by x-ray. The effects of surface pretreatment, pressure during reflow, solder flux type/fluxless processing, and preform design parameters, such as alloy type, are also examined. The paper includes data on both vacuum and pressure (autoclave) reflow of sTIMs, which is becoming necessary to meet upcoming requirements for ultralow voiding in some instances.
Technical Library | 2023-01-17 18:07:31.0
To achieve higher levels of consistency in PCB output, process engineers are able to maintain tighter controls and reduce process-related defects by using closed-loop process controls. At every stage of assembly, from screen printing through placement to reflow, closed-loop systems help control the variable factors that can have adverse effects on the process.
SMT SEMI AUTO SCREEN PRINTER FOR PCB SIZE 1200 IN SMT LED PRODUCTION LINE Product introduction: 1.Using precision guide rail and the import motor to drive the blade seat conversion, printing, and high accuracy. 2.Printing scraper can rotate 45
Smt Semi-Auto Screen Printer Stencil Printer PCB screen printing machine Product introduction: 1.Using precision guide rail and the import motor to drive the blade seat conversion, printing, and high accuracy. 2.Printing scraper can rotate 45 degre
Training Courses | | | IPC-600 Specialist (CIS)
The Certified IPC-600 Specialist (CIS) training targets quality assurance and acceptance of bare printed circuit boards.
Training Courses | | | IPC-7711/7721 Trainer (CIT)
The Certified IPC-7711/7721 Trainer (CIT) courses recognize individuals as qualified trainers in the area of rework and repair of printed boards and electronic assemblies and prepares them to deliver Certified IPC-7711/7721 (CIS) training.
Events Calendar | Wed Apr 18 00:00:00 EDT 2018 - Thu Apr 19 00:00:00 EDT 2018 | ,
Stencil Printing Process and Solder Paste Inspection – An In-Depth Look - SMTA Webtorial
Events Calendar | Mon Nov 19 00:00:00 EST 2018 - Mon Nov 19 00:00:00 EST 2018 | ,
Hand Soldering & De-Soldering with Lead-Free Solder - Webinar
Career Center | Anaheim, California USA | Maintenance,Production
Job requirements are as follows: 3-5 years experience in handling SMT equipment. knowledge of SMT process, Solder printing, Specialize in Siemens and Juki machines a plus. knowledgelable on how to Operate, maintain and program Automated and Semi-Aut
Career Center | , | 2018-02-22 12:50:43.0
Job Description: • Performs a variety of tasks ranging from repetitive to non-repetitive production assembly operations on printed circuit card assemblies. • Ability to work from diagrams and drawings, make initial layouts, and use hand and/or pow
Career Center | Rochester, New York USA | Engineering
I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research
Career Center | tulsa, Oklahoma | Engineering
Printed Circuit Assembly Process Engineer. Seeking a position in a high-technology operation, utilizing my background supporting a progressive and growth-oriented organization. Offering the technical experience, expertise, and skills gained during th
SMT Express, Volume 3, Issue No. 10 - from SMTnet.com Volume 3, Issue No. 10 Thursday, October 18, 2001 Featured Article Return to Front Page Book Review Reviewed by Dave Fish (davef ), Pandion Electronics, Inc. Title: Coomb's Printed
QYSMT SOLUTION USA LLC / Qinyi Electronics Co.,Ltd | https://www.qy-smt.com/shop/156039-belt-print-carriage-216118?page=204
> DEK Belt, Print Carriage 156039 | QYSMT, dek horizon 03ix, dek screen printer, dek printer, dek 03ix, dek parts, dek horizon, dek generator parts, asm dek printer, dek solder paste printer, 156039 products and services Surplus
Heller Industries Inc. | https://hellerindustries.com/opensor-insufficient-solder/
: Non-coplanar leads on the component Excessive warpage of the PCB or substrate Poor wetting Insufficient amount of solder due to improper printing parameters Skips in the printed solder due to blocked
