Industry Directory: solder profile (26)

Surface Mount Technology Association (SMTA)

Surface Mount Technology Association (SMTA)

Industry Directory | Association / Non-Profit / Events Organizer / Training Provider

The SMTA membership is a network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies and related business operations.

Solderstar

Industry Directory | Consultant / Service Provider / Manufacturer

SolderStar produce thermal profiler solutions for reflow soldering, selective solder machine profiling and wave solder optimization.

New SMT Equipment: solder profile (190)

Flux Free Formic Acid Reflow Oven - 1936 MKV

Flux Free Formic Acid Reflow Oven - 1936 MKV

New Equipment | Reflow

Flux Free Formic Reflow Reflow in Formic Acid Vapor Heller has designed and built an production ready horizontal reflow oven for formic acid vapor. This new oven has been designed to meet Semi S2/S8 safety standards (including toxic gases). Form

Heller Industries Inc.

BGA Reballing Training

New Equipment | Education/Training

In this One-Day class you will learn successful techniques to re-ball BGA Components.  Both Lead and Lead Free Solder Balls will be covered.  The student will have an opportunity to use and evaluate some of the most popular BGA rework fixtures on the

Precision PCB Services, Inc

Electronics Forum: solder profile (2483)

Reflow profile for Sn50/Pb50 solder paste

Electronics Forum | Tue Jul 15 21:04:17 EDT 2003 | Thomas

It is for an evaluation run for wafer bumping....Well guys any recommendation for the profile ??

Reflow profile for Sn50/Pb50 solder paste

Electronics Forum | Mon Jul 14 20:49:22 EDT 2003 | Thomas

Hi Need some help here. Anybody got the recommended profile for Sn50/Pb50 solder paste. Thanks.

Used SMT Equipment: solder profile (75)

Heller REFLOW OVEN MK3 2013

Heller REFLOW OVEN MK3 2013

Used SMT Equipment | Soldering - Reflow

Heller REFLOW OVEN MK3 2013 Condition: 2013 USED Standard type Feel free to contact me if interested!! Availability: Available on backorder The 1800 models support high mix / high volume throughput… at speeds up to 32 inches (80 centimeters) per min

Qinyi Electronics Co.,Ltd

Heller 1707  MKIII

Heller 1707 MKIII

Used SMT Equipment | Soldering - Reflow

Details: • Edge Rail and Mesh Belt Conveyors • Auto Oiler • On Board Profiler • 208/240V • Air Condition:  Complete & Operational *** Very low usage hours*** Location & Shipping:  USA / FOB Origin Av

Lewis & Clark

Industry News: solder profile (740)

Heller Industries Announces Joint Development Agreement with IBM for Fluxless Mass Reflow Soldering Process for High Volume Manufacturing

Industry News | 2013-08-15 20:58:22.0

Heller Industries announced today that they have entered into a joint development agreement with International Business Machines Corporation (NYSE: IBM), to collaborate on the development of fluxless mass reflow furnace equipment and process for high volume manufacturing. The fluxless process utilizes gas phase formic acid to replace standard fluxing agents, and eliminates the need for pre-reflow fluxing and post-reflow flux cleanup steps.

Heller Industries Inc.

Parts & Supplies: solder profile (20)

DEK Arcom-8-Channel

DEK Arcom-8-Channel

Parts & Supplies | Assembly Accessories

137037  Arcom-8-Channel DEK-CHANNEL-MONIOR-181507 181507  ​ EIDEN Channel TV modulator 121B  ​ Furnace temperature teste KIC 2000 profile 9 channel  ​ Furnace temperature tester ..KIC 2000 profile 9 channel  KIC

Qinyi Electronics Co.,Ltd

DEK Arcom-8-Channel

DEK Arcom-8-Channel

Parts & Supplies | Assembly Accessories

137037  Arcom-8-Channel DEK-CHANNEL-MONIOR-181507 181507  ​ EIDEN Channel TV modulator 121B  ​ Furnace temperature teste KIC 2000 profile 9 channel  ​ Furnace temperature tester ..KIC 2000 profile 9 channel  KIC

Qinyi Electronics Co.,Ltd

Technical Library: solder profile (44)

Effect of Reflow Profile on SnPb and SnAgCu Solder Joint Shear Force

Technical Library | 2023-01-17 17:27:13.0

Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305) solder joint shear force. Specifically, the effect of the reflow peak temperature and time above solder liquidus temperature are studied. Nine reflow profiles for SAC 305 and nine reflow profiles for SnPb have been developed with three levels of peak temperature (230 o C, 240 o C, and 250 o C for SAC 305; and 195 o C, 205 o C, and 215 o C for SnPb) and three levels of time above solder liquidus temperature (30 sec., 60 sec., and 90 sec.). The shear force data of four different sizes of chip resistors (1206, 0805, 0603, and 0402) are compared across the different profiles. The shear force of the resistors is measured at time 0 (right after assembly). The fracture surfaces have been studied using a scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS)

Heller Industries Inc.

THE EFFECT OF VACUUM REFLOW PROCESSING ON SOLDER JOINT VOIDING AND THERMAL FATIGUE RELIABILITY

Technical Library | 2023-01-17 17:19:44.0

A test program was developed to evaluate the effectiveness of vacuum reflow processing on solder joint voiding and subsequent thermal cycling performance. Area array package test vehicles were assembled using conventional reflow processing and a solder paste that generated substantial void content in the solder joints. Half of the population of test vehicles then were re-processed (reflowed) using vacuum reflow. Transmission x-ray inspection showed a significant reduction in solder voiding after vacuum processing. The solder attachment reliability of the conventional and vacuum reflowed test vehicles was characterized and compared using two different accelerated thermal cycling profiles. The thermal cycling results are discussed in terms of the general impact of voiding on solder thermal fatigue reliability, results from the open literature, and the evolving industry standards for solder voiding. Recommendations are made for further work based on other void reduction methods and additional reliability studies.

Heller Industries Inc.

Videos: solder profile (430)

HELLER INDUSTRIES Presents: Formic Acid Sintering

HELLER INDUSTRIES Presents: Formic Acid Sintering

Videos

Nano-copper sintering in formic acid vapor.

Heller Industries Inc.

HELLER INDUSTRIES Presents: 1936 MKV Vacuum Reflow Oven

HELLER INDUSTRIES Presents: 1936 MKV Vacuum Reflow Oven

Videos

1809 MK5 - Heller Advanced In-Line Vacuum Reflow Oven Nitrogen System with Balanced Flow Technology 9 Top And Bottom Heated Zones - highest zone count per linear foot in the industry! 100" Heated Length - for super throughput! 2 Internal C

Heller Industries Inc.

Training Courses: solder profile (20)

Profiling and Solder Reflow Course

Training Courses | | | PCB Assembly Courses

The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.

ACI Technologies, Inc.

IPC 7095 BGA Rework Certification

Training Courses | | | PCB Rework and Hand Soldering Courses

The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.

Precision PCB Services, Inc

Events Calendar: solder profile (7)

Wisconsin Chapter In-Person PCBA Profile Workshop

Events Calendar | Wed Feb 21 00:00:00 EST 2024 - Wed Feb 21 00:00:00 EST 2024 | Menomonee, Wisconsin USA

Wisconsin Chapter In-Person PCBA Profile Workshop

Surface Mount Technology Association (SMTA)

IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2

Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,

IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2

Association Connecting Electronics Industries (IPC)

Career Center - Jobs: solder profile (44)

SMT Manufacturing Engineer

Career Center | Moorpark, California USA | Engineering

Responsible for the set up of the SMT line, Wave Solder Machine and actual production.  Maintain, program and operate line equipment.  Troubleshoot and repair equipment, coordinating with vendors when necessary. Develop standards for stencil app

CTS Corporation

Process Engineer

Career Center | Las Vegas, Nevada USA | Engineering

We are looking for a Process Engineer or Manufacturing Engineer with at least 3 - 5 years exp. in a production or engineering enviroment. *Must be able to effectively interact with engineering and production to develop assembly procedures, test re

Grand Products Nevada, Inc.

Career Center - Resumes: solder profile (77)

Private Resume #5155

Career Center | , India | Engineering,Maintenance,Production,Technical Support

 Hands on experience in PLC based machine, DEK Printer Machine, Camlot Glue dot machine, Fuji NXT, SPI machine, reflow: Vitronics XPM2/3,  Expertise in SMT Profiling Qualification & NPI Build,  Soldering defects, Analysis & rework.  Line modifi

Sr.Engineer EMS

Career Center | Delhi, India | Maintenance,Production,Sales/Marketing,Technical Support

7 Years of experiance in SMT line

Express Newsletter: solder profile (1041)

SMT Express, Volume 2, Issue No. 9 - from SMTnet.com

SMT Express, Volume 2, Issue No. 9 - from SMTnet.com Volume 2, Issue No. 9 Thursday, September 14, 2000 Featured Article Return to Front Page Reflow Profiling The Benefits of Implementing a Ramp-to-Spike Profile by David Suraski /AIM

SMT Express, Volume 4, Issue No. 1 - from SMTnet.com

INSERT INTO tracking_express (userid, username, page_id, ts) VALUES ('#Quser_profile.id#', '#Quser_profile.username#', 97, (#ts#)) SMT Express, Volume 4, Issue No. 1 - from SMTnet.com Volume 4, Issue No. 1 Thursday, January 17, 2002 Featured

Partner Websites: solder profile (6075)

Effect of Reflow Profile on SnPb and SnAgCu Solder Joint Shear Force. - Heller Industries

Heller Industries Inc. | https://hellerindustries.com/bit_publications/effect-of-reflow-profile-on-snpb-and-snagcu-solder-joint-shear-force/

Effect of Reflow Profile on SnPb and SnAgCu Solder Joint Shear Force. - Heller Industries Phone 1-973-377-6800 Company About News Events New Equipment Convection Reflow Ovens Reflow Oven MK7 -New

Heller Industries Inc.

Solder Stencil Printer,solder paste stencil Machine,solder printing Machine,solder screen printing,P

| https://www.smtfactory.com/China-Automatic-Solder-paste-printer-Factory-Supplier-pd42676824.html

Solder Stencil Printer,solder paste stencil Machine,solder printing Machine,solder screen printing,PCB Printer Machine Price,Pcb Stencil Printer,Smt Stencil Printer Machine,Smt Printing Machine


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