Industry Directory | Equipment Dealer / Broker / Auctions
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Industry Directory | Manufacturer
Manufacturer of sintering, electrically conductive materials. Applications include semiconductor die attach, component attach, via fill, z-axis interconnection, conductive lines and traces and plated-through hole fill.
When Applications Require Large Board Processing &/or Versatility The DS Series of dispensers is a robust, large format platform designed to handle all types of applications with ease. Ideal for dispense applications utilizing adhesive, solder paste
High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En
Electronics Forum | Wed Dec 08 12:48:01 EST 1999 | Chuck C.
Is anyone out there having problems with noise in analog circuits caused by the residue that no-clean solder paste leaves after reflow? If so do you have any suggestions on how to eliminate the problem??
Electronics Forum | Tue Jan 28 17:23:11 EST 2003 | C. M. Gabel
I am working with a BGA package. The laminate layer is being modeled as BT-Cu smear. The thermal conductivity of BT is 0.19 W/mK. Does anyone know what the density and specific heat values are for BT?
Used SMT Equipment | Soldering Equipment/Fluxes
High speed solder paste dispensing • Rapid SMD prototyping and low volume production • Dispensing instead of printing • Saves cost for stencils • Fine pitch dispensing of solder paste or conductive glue • Integrated valve heating • Direct impor
Used SMT Equipment | Soldering Equipment/Fluxes
This 2007 Ersa Versa Flow 40/50 Selective Solder System is currently being used in a lead free environment. It will be included in the Sept. 27th Webcast auction we will be conducting on behalf of Millennium Electronics in Crystal Lake, Illinois.
Industry News | 2013-10-10 09:56:45.0
GPD Global has again pushed the limits for small-volume dispensing with its new Nano-Piston pump. Dots of conductive adhesive down to 100 μm and solder paste for 01005s are possible with the Nano-Piston Pump.
Industry News | 2013-10-09 10:29:04.0
GPD Global will exhibit in Stand 214 in Hall A4 at the Productronica International Trade Fair. On display will be the versatile Max Series platform for dispensing of SMT glue, solder paste, conductive adhesives, underfill, UV, LED and more, configured with the volumetric PCD4H dispense pump and shown for the first time will be the NCM5000 simplified jetting pump.
Parts & Supplies | Tape and Reel
SMT Kapton Tape Polymide film tape Specifications: Antistatic Thermally conductive Polyimides for fine line circuitry Cryogenic insulation Corona resistant Pigmented for color Conformable Other films tailored to meet customers needs Param
Parts & Supplies | Circuit Board Assembly Products
1) 36*36mm/1up, Aluminium type: A5052 2) Thermal conductivity: 0.8-1.3 W/mk, 3) Single sided, 1.6mm 4) White solder mask/ Black Legend 5) Copper weight: 35μm 6) Surface Finish: ENIG 7) Profile: Punch
Technical Library | 2019-07-10 23:36:14.0
Pockets of gas, or voids, trapped in the solder interface between discrete power management devices and circuit assemblies are, unfortunately, excellent insulators, or barriers to thermal conductivity. This resistance to heat flow reduces the electrical efficiency of these devices, reducing battery life and expected functional life time of electronic assemblies. There is also a corresponding increase in current density (as the area for current conduction is reduced) that generates additional heat, further leading to performance degradation.
Technical Library | 2023-01-17 17:12:33.0
Reflowed indium metal has for decades been the standard for solder thermal interface materials (solder TIMs or sTIMs) in most high-performance computing (HPC) TIM1 applications. The IEEE Heterogeneous Integration Thermal roadmap states that new thermal interface materials solutions must provide a path to the successful application of increased total-package die areas up to 100cm2. While GPU architectures are relatively isothermal during usage, CPU hotspots in complex heterogeneously-integrated modules will need to be able to handle heat flux hotspots up to 1000W/cm2 within the next two years. Indium and its alloys are used as reflowed solder thermal interface materials in both CPU and GPU "die to lid/heat spreader" (TIM1) applications. Their high bulk thermal conductivity and proven long-term reliability suit them well for extreme thermomechanical stresses. Voiding is the most important failure mode and has been studied by x-ray. The effects of surface pretreatment, pressure during reflow, solder flux type/fluxless processing, and preform design parameters, such as alloy type, are also examined. The paper includes data on both vacuum and pressure (autoclave) reflow of sTIMs, which is becoming necessary to meet upcoming requirements for ultralow voiding in some instances.
When Applications Require Large Board Processing &/or Versatility The DS Series of dispensers is a robust, large format platform designed to handle all types of applications with ease. Ideal for dispense applications utilizing adhesive, solder paste
New Advanced Precision Auger Pump - Single Pump Solution The Precision Auger pump is designed to work with mid-to-high viscosity liquid such as glues, conductive, and non-conductive adhesive and pastes. The pump is controlled with a servo motor equ
Training Courses | | | IPC J-STD-001 Trainer (CIT) Recert.
The Certified IPC J-STD-001 Trainer (CIT) recertification courses are intended for those individuals who were previously accredited to provide Certified IPC J-STD-001 (CIS) training.
Training Courses | | | IPC-7711/7721 Trainer (CIT)
The Certified IPC-7711/7721 Trainer (CIT) courses recognize individuals as qualified trainers in the area of rework and repair of printed boards and electronic assemblies and prepares them to deliver Certified IPC-7711/7721 (CIS) training.
Events Calendar | Wed Mar 07 00:00:00 EST 2018 - Wed Mar 07 00:00:00 EST 2018 | ,
Solder Paste Qualification Testing - SMTA Webinar
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Career Center | Cleveland, Ohio USA | Management,Purchasing,Sales/Marketing
Content Procurement Manager Negotiates to acquire rights to utilize content for electronics assembly industry web site. Contacts identified sources and promote benefits of web site as a vehicle for publication and distribution of materials. Sources
Career Center | Suwanee, Georgia USA | Research and Development
Alpha Advanced Materials, a business unit of Alent plc and the global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, d
Career Center | Lakewood, California USA | Engineering,Maintenance,Management,Production
Quality conscience, detail oriented, manufacturing engineer, with a hands on approach to overall process improvement and development. Motivated with excellent communication skills and a dedicated team player. Qualifications include: � Safety /Diver
Career Center | Mysore, India | Engineering,Production,Quality Control,Technical Support
· New Product production line setup, Risk assessment, quality system deployment. · Process Engineering activities, PCB Design review w.r.t Design for manufacturability in Pilot lot. · Printed wiring Assembly Process Improvement (Stencil, PCB type, sc
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-glossary-of-terms
Solder Dictionary of Terms | Nordson EFD Nordson EFD Corporate | Global Directory | Languages Division Only All of Nordson Home Products Accessories
| https://www.eptac.com/blog/leaded-vs-lead-free-solder-which-is-better?hsLang=en
. Generally, it is more economical and effective to use lead solder because of its unique properties and benefits. There continues to be some industries that use leaded solders because of these properties and benefits
