Industry Directory | Distributor
Stocking distributor featuring adhesives, sealants, encapsulates, coatings, solder, solder chemicals, release agents, dispensing equipment and supplies.
Datum Alloys is an international supplier of speciality metals and special purpose alloys,
New Equipment | Education/Training
This latest version D of the IPC-A-610 released in Released February 2005, Presented in a one day class this is a must for all quality assurance and assembly departments. IPC-A-610D illustrates industry-accepted workmanship criteria for electronic
New Equipment | Solder Paste Stencils
Sometimes there are products that come along and you think to yourself-Wow! The StikNPeel™ rework stencil is one of those products. It simplifies the rework of site locations by placing a highly flexible, removable, adhesive-backed stencil on to a ci
Electronics Forum | Mon Jul 16 21:25:26 EDT 2001 | davef
Sure, use of U-shape apertures is another way to reduce the amount of paste that you apply. That and similar schemes mentioned in the article are not a function of the flux used. We have used U-shaped apertures for MELF and mini-MELF. They are sug
Electronics Forum | Wed Jul 27 09:58:05 EDT 2011 | davef
Pressure printing systems Conventional stencil printing techniques have fundamental limitations as regards paste handling: The volume of paste available for printing is limited, so frequent replenishment is necessary Paste is difficult to c
Used SMT Equipment | Soldering - Selective
SEHO POWER SELECTIVE Model: Produced: 2014 Working flow Right to Left Actual status: Functional Date of release to sale: 2020 02
Used SMT Equipment | Soldering - Reflow
Model: SEHO GO Reflow 1.8 Produced: 2015 Working flow Right to Left Actual status: Functional in production Date of release to sale: 2020 02
Industry News | 2003-03-21 08:12:24.0
Tecan reckons it is consistently producing what may be regarded as the most efficient stencils in the world today.
Industry News | 2003-06-16 08:33:59.0
This action is part of the DuPont strategy to build on its leadership position in circuit materials, by expanding and strengthening the level of service and support available to its customers.
Parts & Supplies | Tape and Reel
High Temperature Masking dots High temperature masking tape and dots are ideal for masking gold fingers of printed circuit boards during wave solder or solder dip process, as well as for solder wave masking and electrical insulation. The p
Parts & Supplies | Pick and Place/Feeders
Supply&repair juki spare parts at l lower price: JUKI 710(720) CARRY UNIT E86127150B0 JUKI 710(720) CPU CARD E8601715AA0 JUKI 730(740) CARRY BOARD E86067210A0 JUKI 730(740) DC SERVO DRIVER E86037210A0 JUKI 750(760) AC SERVO CARD E86027210A0
Technical Library | 2017-10-26 01:18:49.0
Nano-coatings have been introduced by various manufacturers, with the promise of addressing some of the challenges relative to solder paste printing. Stated benefits include: Reduced underside cleaning, reduced bridging, improved solder paste release and improvements in yield. With several nano technologies already on the market and more likely to be introduced, how can the performance be quantified? How robust are these coatings? How can an assembler approach the ROI of these coatings? What hidden benefits or negative impacts should be considered? This paper will present a rigorous method for evaluating the performance and economic benefits of solder paste stencil nano-coatings.
Technical Library | 2013-06-20 14:33:12.0
With today's consumer technologies driving the need for denser and more compact devices, the assembly process for surface mounted devices has becoming increasingly more difficult. With the mixture of components requiring a broader range of print deposition volume, various techniques are in use in an attempt to ensure consistent and appropriate paste volume is achieved. Some of these techniques include step etching a stencil locally on a targeted device, promoting electroformed smooth wall nickel stencils, through to laser cutting newer grade stencil materials. This paper focuses on the relevant attributes that affect the properties of solder paste release and introduces the effects of surface free energy with respect to key elements that make up the stencil printing process.
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
Events Calendar | Tue Mar 30 00:00:00 EDT 2021 - Tue Mar 30 00:00:00 EDT 2021 | ,
Wisconsin Chapter Webinar: PCB Assembly – Labeling and Marking Technology and Materials
Events Calendar | Tue May 17 00:00:00 EDT 2022 - Thu May 19 00:00:00 EDT 2022 | Amsterdam, Netherlands
Electronics in Harsh Environments Conference and Exhibition
Career Center | Santa Cruz, California USA | Production,Quality Control
Soldering Technician, Touch-up for PCBAs Perform hand soldering and touch-up rework for Printed Circuit Board Assemblies (PCBA), cables and associated equipment. Inspect PCBA for defects, loose connections, missing components. Solder to perform r
Career Center | Rochester, New York USA | Engineering
Job Description: Implements and analyzes manufacturing engineering plans and projects. Designs, develops and transfers manufacturing and engineering tools, strategies and systems. Develops manufacturing strategies for specific products and processes
Career Center | Gainesville, Georgia USA | Production,Quality Control
SKILLS/ATTRIBUTES: Strong mechanical background in building computers and systems. Experienced in soldering, assembly, and quality control techniques. ISO 9001:2000 production department. Experienced with computer, cable, mechanical and electroni
Career Center | Gainesville, Georgia USA | Production,Quality Control
�Strong mechanical background in building computers and systems. �Experienced in soldering, assembly, and quality control techniques. �Familiar with ISO 9001:2000 certification standards. �Experienced with computer, cable, mechanical and electronic a
SMT Express, Volume 2, Issue No. 7 - from SMTnet.com Volume 2, Issue No. 7 Wednesday, July 12, 2000 Featured Article Return to Front Page Photonic Soldering for Rework Applications As appeared in Circuits Assembly, June 2000 Erick Russell