New Equipment | Solder Materials
Indium Corporation manufactures high quality solder powders and pastes. Powders are available in hundreds of alloys and a full range of sizes. Solder pastes can be made from these powders using a wide variety of flux vehicles to get the best fit for
Electronics Forum | Fri Aug 16 10:00:03 EDT 2002 | davef
You have a very bad situation. It�s tough for the gas, flux material, er whatever to escape when the BGA is sitting on top of it and the blind via is blocking it from the other side. Obviously the vias should have been: * Placed on the edge of the
Electronics Forum | Thu Dec 13 20:54:23 EST 2001 | davef
There is neither �nominal thickness� nor �is there a set maximum� for via masking. We use some of our vias as test pads. So, as you�d expect, we get rabid when we get mask bleed onto these pads. IPC-6012 - Qualification & Performance For Rigid Pri
Industry News | 2018-04-09 19:51:33.0
SMTA Europe announces Session 2 Technical Program on Reliability of Soldered Alloys at the “Electronics in Harsh Environments Conference” to be held in Amsterdam, Netherlands, on April 25th, 2018.
Industry News | 2018-08-16 19:58:50.0
The SMTA Capital Chapter is holding its upcoming Capital Expo and Tech Forum at Johns Hopkins University / Applied Physics Lab, Kossiakoff Center, 11100 Johns Hopkins Road, Laurel, MD 20723, on Thursday, August 23rd.
Technical Library | 2017-01-05 16:55:11.0
The July 2006 implementation of ROHS exempted automotive applications from converting to lead free technology. Nine years later, all major OEM and Tier 1 automotive manufacturers have converted or are in the process of converting to lead free circuit assembly processing. Starting with SAC (SnAgCu) alloys as a baseline for lead free soldering, in the last years several specific alloys were developed in order to improve resistance to high temperature creep, vibration survival and the ability to withstand thermal cycling and thermal shock.The paper compares three different solder alloys and two flux chemistries in terms of void formation and mechanical / thermal fatigue properties. Void content and reliability data of the alloys will be presented and discussed in relation to the acceptance criteria of a Tier 1 /OEM automotive supplier. As a result, a ranking list will be presented considering the combined performance of the alloys. In order to analyze the void formation and mechanical behavior of different solder alloys and flux chemistry combinations, statistical methods are used.
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
SMT Express, Volume 2, Issue No. 3 - from SMTnet.com Volume 2, Issue No. 3 Thursday, March 16, 2000 Featured Article Return to Front Page Curtailing Voids in Fine Pitch Ball Grid Array Solder Joints by Gary Morrison and Kevin Lyne
| https://www.eptac.com/wp-content/uploads/2012/06/eptac_07_18_12.pdf
| http://www.thebranfordgroup.com/dnn3/Employees/OnlineAuctionAdmin/TRCCircuits/tabid/1902/Default.aspx
. Digital Shipping Scale Category: 14 Chemcut XLI410-20 Photo Resist Developer, 20" Capacity, s/n 065-7005, (2007 yr.) Sold at TRC Circuits on 11/30/2022 Vadnais Heights MN Previous Item Next Item Lot Number: 14 Description
COT specializes in high quality SMT nozzles and consumables for pick and place machines. We provide special engineering design service of custom nozzles for those unique and odd components.
2481 Hilton Drive
Gainesville, GA USA
Phone: (770) 538-0411
