Industry Directory | Manufacturer
Manufacturer of automated production systems;PCB magazine loader,PCB separator,PCB cutting machine,PCB unloaders, PCB conveyors,PCB depaneling machines,PCB turn conveyors,PCB conformal coaters,PCB solder paste printer,PCB buffer
Industry Directory | Manufacturer
We have more than ten years experience in designing and manufacturing pcb separator and hot bar soldering machine and other SMT assembly equipment in China.
The World's Best Convection Reflow Oven The ultimate high volume production reflow oven with belt speeds up to 1.4 m/min to accommodate the fastest pick and place systems. Lead Free Certified reflow oven! Maintenance Free! Lowest Nitrogen &
The World's Best SMT Convection Reflow Ovens for Large Boards and Dual Lane 1826 Mark 5 reflow oven provides consistent performance for high volume reflow requirements while minimizing preventative maintenance and floorspace. Lead Free Certified!
Electronics Forum | Fri Mar 24 08:32:17 EST 2006 | davef
Lifted pads are almost always caused by pad to substrate adhesion likely degraded significantly after too much heat. Poorly trained operators armed with soldering irons can do this expertly.
Electronics Forum | Thu Dec 10 09:06:47 EST 2009 | stepheniii
Just how cold do you store your paste? And what are your solder paste reps like? Here they fall over each other giving support for their paste. And have you seen the problem with flux separation or have you only heard about it?
Used SMT Equipment | Soldering - Wave
Operating System: Windows based Details: • Dual pot-Lead and Lead Free • Includes full pot of Lead Free –SN100C solder and Lead SN63/PB37 solder • Carbon Steel Solder pots with high temperature protective coating • A
Used SMT Equipment | Soldering - Selective
Make: Pillarhouse Jade Model: S-200 MKII Vintage: 2013 Details: Software Level Windows 7 Side Camera 220Vac 1 Top Side Preheat System Equipped with Separate Pumps and Tank Assembly for both lead & leaded solder. Make: Pillargen Mod
Industry News | 2018-10-18 08:21:10.0
How to Prevent Non-Wetting Defect during the SMT Reflow Process
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
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Parts & Supplies | Pick and Place/Feeders
40000575+40000576 cylinder driver include cable 40023687 valve PV-1303050-00 Description: JUKI DRIVE CYLINDER Part No: 40000575 / 40000576 Condition: Original new Payment Term: T/T, Paypal, Westernunion are all allowed. Shipping Ways: DHL, Fed
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Parts & Supplies | Screen Printers
DEK Screen Printer Use 137516 215607 DEK Board Clamp Dek 137516/ 215607 Board Clamp 500mm Dek Clamper 380mm/350mm/250mm 5157438/ 178031/177061 Description: DEK BOARD CLAMPER Part No: 137516/ 215607 Condition: original new /original used Appl
Technical Library | 2024-02-02 07:48:31.0
Maximizing Efficiency: The High-Speed SMT Line With Laser Depanelizer In today's rapidly evolving electronics manufacturing landscape, optimizing efficiency, cost-effectiveness, and precision remains paramount. Businesses engaged in producing industrial control boards, computer motherboards, mobile phone motherboards, and mining machine boards face ongoing challenges in streamlining production processes. The integration of expensive equipment strains budgets, making the creation of an efficient, cost-effective high-speed SMT line a daunting task. However, a solution exists that seamlessly combines these elements into a singular, high-performance, and cost-effective SMT line. Let's delve into the specifics. A Comprehensive High-Speed SMT Line Our innovative solution amalgamates two pivotal components: a cutting-edge SMT (Surface Mount Technology) production line and a laser cutting line equipped with a depanelizer. The SMT Production Line The high-speed SMT line comprises several essential components, each fulfilling a unique role in the manufacturing process: 1. PCB Loader: This initial stage involves loading boards onto the production line with utmost care. Our Board Loader prioritizes safety, incorporating various safety light curtains and sensors to promptly halt operations and issue alerts in case of any anomalies. 2. Laser Marking Machine: Every PCB receives a unique two-dimensional code or barcode, facilitating comprehensive traceability. Despite the high-temperature laser process potentially leading to dust accumulation on PCB surfaces, our dedicated PCB Surface Cleaner swiftly addresses this issue. 3. SMT Solder Paste Printer: This stage involves applying solder paste to the boards, a fundamental step in the manufacturing process. 4. SPI (Solder Paste Inspection): Meticulous inspections are conducted at this stage. Boards passing inspection proceed through the NG (No Good) Buffer Conveyor to the module mounters. Conversely, "No Good" results prompt storage of PCBs in the NG Buffer Conveyor, capable of accommodating up to 25 PCBs. Operators can retrieve these NG boards for rework after utilizing our specialized PCB Mis Cleaner to remove solder paste. 5. Module Mounters: These machines excel in attaching small and delicate components, necessitating precision and expertise in the module mounting process. 6. Standard Pick And Place Machines: The selection of these machines is contingent upon your specific BOM (Bill of Materials) list. 7. Pre-Reflow AOI (Automated Optical Inspection): Boards undergo examination for component quality at this stage. Detected issues prompt the Sorting Conveyor to segregate boards for rework. 8. Reflow Oven: Boards undergo reflow soldering, with our Lyra series reflow ovens recommended for their outstanding features, including nitrogen capability, flux recycling, and water cooling function, ensuring impeccable soldering results. 9. Post-Reflow AOI: This stage focuses on examining soldering quality. Detected defects prompt the Sorting Conveyor to segregate boards for further inspection or rework. Any identified defects are efficiently addressed with the BGA rework station, maintaining the highest quality standards. 10. Laser Depanelizer: Boards advance to the laser depanelizer, where precision laser cutting, often employing green light for optimal results, ensures smoke-free, highly accurate separation of boards. 11. PCB Placement Machine: Cut boards are subsequently managed by the PCB Placement Machine, arranging them as required. With this, all high-speed SMT line processes are concluded. Efficiency And Output This production line demonstrates exceptional productivity when manufacturing motherboards with approximately 3000 electronic components, boasting the potential to assemble up to 180 boards within a single hour. Such efficiency not only enhances output but also ensures cost-effectiveness and precision in your manufacturing processes. At I.C.T, we specialize in crafting customized SMT production line solutions tailored to your product and specific requirements. Our equipment complies with European safety standards and holds CE certificates. For inquiries or to explore our exemplary post-sales support, do not hesitate to contact us. The I.C.T team is here to elevate your electronics manufacturing to new heights of efficiency and cost-effectiveness.
Technical Library | 2019-05-15 22:26:02.0
As the demand for higher routing density and transfer speed increases, Via-In-Pad Plated Over (VIPPO) has become more common on high-end telecommunications products. The interactions of VIPPO with other features used on a PCB such as the traditional dog-bone pad design could induce solder joints to separate during the second and thereafter reflows. The failure has been successfully reproduced, and the typical failure signature of a joint separation has been summarized.To better understand the solder separation mechanism, this study focuses on designing a test vehicle to address the following three perspectives: PCB material properties, specifically the Z-direction or out-of-plane Coefficient of Thermal Expansion (CTE); PCB thickness and back drill depth; and quantification of the driving force magnitude beyond which the separation is due to occur.
1809 MK5 - Heller Advanced In-Line Vacuum Reflow Oven Nitrogen System with Balanced Flow Technology 9 Top And Bottom Heated Zones - highest zone count per linear foot in the industry! 100" Heated Length - for super throughput! 2 Internal C
1.Characteristic: 1.Highly effective recycling of the solder waste, up to 93% yield . 2.No need to add any chemicals or reducers to the process uses physical separation to ensure a good quality product. 3.Button controls, digital temperature contr
Training Courses | | | IPC-7711/7721 Trainer (CIT)
The Certified IPC-7711/7721 Trainer (CIT) courses recognize individuals as qualified trainers in the area of rework and repair of printed boards and electronic assemblies and prepares them to deliver Certified IPC-7711/7721 (CIS) training.
Training Courses | | | IPC-7711/7721 Trainer (CIT)
The Certified IPC-7711/7721 Trainer (CIT) courses recognize individuals as qualified trainers in the area of rework and repair of printed boards and electronic assemblies and prepares them to deliver Certified IPC-7711/7721 (CIS) training.
Events Calendar | Fri Jan 11 00:00:00 EST 2019 - Fri Jan 11 00:00:00 EST 2019 | Richardson, Texas USA
SMTA Dallas Chapter - Understanding Selective Solder Technology
Events Calendar | Tue Jan 23 00:00:00 EST 2018 - Tue Jan 23 00:00:00 EST 2018 | New Milford, Connecticut USA
FREE Webinar: Eliminate Circuit Board Problems and Failure Modes
Career Center | Norcross, Georgia USA | Production
Solder Technician Reports to: Supervisor Responsibilities: 1) Melts and applies solder along adjoining edges of workpieces to solder joints, using soldering iron, gas torch, or electric-ultrasonic equipment. 2) Grinds, cuts, buffs, or bends edge
Career Center | Brooklyn, New York USA | Production
Mini-Circuits designs, manufactures and distributes integrated circuits, modules, and sub-systems for high performance radio frequency (RF) and microwave applications. With design, sales and manufacturing locations in over 30 countries, Mini-Ci
Career Center | INDIA, India | Engineering,Quality Control
BACHELOR OF ENGINEERING IN ELECTRICAL AND ELECTRONICS ENGINEERING EXPERIENCE IN SURFACE MOUNT MANUFACTURING TECHNOLOGY.
Career Center | Johns Creek, Georgia USA | Management,Sales/Marketing
As an awarding winning Regional Sales Manager, I have specialized in securing and growing key accounts in the electronics and materials manufacturing industries. I have been described as a go-getter, energetic, analytical hands-on sales person. In c
SMTnet Express, May 16, 2019, Subscribers: 31,918, Companies: 10,765, Users: 26,116 Transient Solder Separation of BGA Solder Joint During Second Reflow Cycle Credits: Cisco Systems, Inc. As the demand for higher routing density and transfer speed
Are Separate Solder Flip-Chip Bonders Still Required? Are Separate Solder Flip-Chip Bonders Still Required? Increasing miniaturization is now encouraging manufacturers of handheld devices to stack bare dies or packages. As the process
ASCEN Technology | https://www.ascen.ltd/optical_inspection/1048.html
,create a greener environment and assist the quality process. solder recycling machine use special stirring system to melt the tin residues in the tin container and separate tin and ash in the separation container by the high speed of screw rotation
| https://www.eptac.com/faqs/ask-helena-leo/ask/solder-tip-flooding-to-remove-leaded-solder
. We’ve promoted the separation of both processes to prevent contamination, separate solder iron tips and sponges. You mention cross contamination and how much of it can happen by using the sponges for both processes
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