Industry Directory | Distributor
EasySpheres is the exclusive worldwide provider of high quality, Kester solder spheres. We maintain a large inventory of sphere alloys and sizes, and since we specialize in the fulfillment of small orders, we are able to guarantee
Dealing in solder spheres material. Leaded and Lead-free. Also specialise in resale equipments for PCBA and semicon industries.
New Equipment | Solder Materials
WE HAVE BGA SOLDER BALLS, SOLDER SPHERES. Sizes from 0.20mm and up. Quantities from one to one million or more. Available in Lead & Lead Free Solder. One price for Lead, (Sn63Pb37) or Lead Free, (Sn96.5Ag3Cu0.5) in any of these listed solder ball
solder paste Sn63/Pb37 solder paste Sn63/Pb37 Tin solder paste Sn63/Pb37 Tin solder paste Sn63/Pb37 Product description: solder paste Sn63/Pb37 INQUIRY solder paste Sn63/Pb37 Machine Details: Brands QiSMT
Electronics Forum | Tue Feb 17 18:17:28 EST 1998 | John Wilson
I am looking for any information or testing data done on the amount of weight that can be held by a bga package based on size of the solder sphere and number of spheres. I am reflowing components with a bga package on the opposite side and looking f
Electronics Forum | Fri Aug 07 08:53:32 EDT 2009 | zanolli
We are looking for a supplier for solder spheres -- must be a world class supplier for what could be a high volume requirment for .5mm dia spheres -- Any reccomendations
Industry News | 2009-02-02 18:48:47.0
Henkel today announced the appointment of Mr. Luc Godefroid as the company's Global Sales Director for its Semiconductor Group. A key member of Henkel's electronics sales team since 2001, Godefroid's new role sees him building on his previous success and directing the global sales efforts of Henkel's worldwide team and expanded product portfolio.
Industry News | 2015-03-11 18:05:46.0
The SMTA Capital Chapter is pleased to announce Donald Tyler, Managing Director, Corfin Industries, will present “Elimination of Pb-Free Risk by Robotic Hot Solder Dip (RHSD)” at its first meeting of 2015 on March 17th, scheduled from 5:30 pm to 8:00 pm at EIT (Main Building Lunchroom), 108 Carpenter Drive, Sterling, VA 20164.
Technical Library | 2014-03-06 19:04:07.0
Over the last few years, there has been an increase in the rate of Head-in-Pillow component soldering defects which interrupts the merger of the BGA/CSP component solder spheres with the molten solder paste during reflow. The issue has occurred across a broad segment of industries including consumer, telecom and military. There are many reasons for this issue such as warpage issues of the component or board, ball co-planarity issues for BGA/CSP components and non-wetting of the component based on contamination or excessive oxidation of the component coating. The issue has been found to occur not only on lead-free soldered assemblies where the increased soldering temperatures may give rise to increase component/board warpage but also on tin-lead soldered assemblies.
Technical Library | 2008-04-08 17:42:27.0
Concern about the failure of lead-free BGA packages when portable devices such as cell phones are accidentally dropped and a general concern about the resistance of these packages under shock loading has prompted an interest in the impact strength of the soldered BGA connection. This paper reports the results of the measurement of the impact strength of lead-free 0.5±0.01mm diameter BGA spheres on 0.42mm solder mask defined pads on copper/OSP and ENIG substrates using recently developed equipment that can load individual BGA spheres at high strain rates in shear and tension.
ALPHA® Preforms with solder paste adds solder volume.
SN100C P810 D4????????? ???????????? ??????????????????????????????????? ?????????????? ???http://www.nihonsuperior.co.jp/
Career Center | Research Triangle Park, North Carolina USA | Sales/Marketing
Worldwide supplier of solderpaste, flux, adhesives and solder sphere's seeking Independant Manfacturers' Representatives for select protected territories in Illinois, Ohio, Pennsylvania, New York, New Jersey and the Provinces of Canada. Experience in
Strength of Lead-free BGA Spheres in High Speed Loading Strength of Lead-free BGA Spheres in High Speed Loading Concern about the failure of lead-free BGA packages when portable devices such as cell phones are accidentally dropped and a general
Featured Article Return to Front Page Soldering Technolo
GPD Global | https://www.gpd-global.com/lead-free-solder-paste-dispensing.php
. Paste may be leaded or lead free to suit your application requirements. There are four main types of solder paste: Flux type, Metal Makeup, Metal Percentage, and Sphere size (type
Heller Industries Inc. | https://hellerindustries.com/solder-balls-defects/
&place machine Excessive solder paste slump after printing Sphere size of solder paste too large for pitch components being soldered Excessive moisture absorbed by solder paste Solder paste exposed
