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New Equipment | Soldering - Other
Features: 1.Uses special mixing & seperation design, the dross automatically feeded into inner part of mixing part. 2.Automatic separation of tin and tin ash,into the tin and tin-ash collection device. 3.Separated liquid pure tin automatically st
New Equipment | Cleaning Equipment
Automatic SMT Stencil Cleaning Machine BMP-1000X Feature ▶The cleaning tank, the original tank, and the spray tank are designed with a liquid level sensor overflow alarm. ▶The opening of the front door is designed with photoelectric sensor protectio
Electronics Forum | Sun Feb 12 22:52:20 EST 2017 | ltchsze
Hi fellow professionals, Wondering whether anyone has experience with solder splashing from component terminal. Have identified the source using the component without printing solder paste on PCB. Wondering the root-cause of the solder splashing fr
Electronics Forum | Tue Feb 21 16:39:03 EST 2017 | ltchsze
Thanks for input, dyoungquist. The condition here is without any flux or paste applied. Solder from component terminal started splashing by itself when put through re-flow.
Used SMT Equipment | Screen Printers
DEK Horizon Specs: DEK HORIZON Screen Printer D.O.M.:2000 S/N:274691 Top Clamp Board Hold down, Wet/Dry/Vacuum wiper, Pin Support tooling, and External Vacuum Pump Location:Chicago, IL Machine being auctioned off June 12th - 14th at the
Used SMT Equipment | Board Cleaners
ELECTROVERT AQUASTORM 100 Inline Wash D.O.M.:Nov-98 S/N:11875938 Excellent Condition! Includes: ReSys System and Aqua Klean water close loop system, Large Filtration, includes filters on walls Location:Anaheim, CA Machine being auctioned off June 1
Industry News | 2023-06-12 21:14:11.0
The 2023 Beijing Intelligent Manufacturing and SMT Technology Exchange Conference, hosted by the Intelligent Manufacturing Committee of the Beijing Electronics Society, was successfully held in Beijing on May 25th. HELLER was honored to be invited and actively participated by sharing their cutting-edge technology and expertise.
Industry News | 2003-06-10 08:16:44.0
The following text describes the application of NWA Quality Analyst to quality control in the assembly of electronic components.
Technical Library | 2017-05-17 22:33:43.0
The selective soldering application requires a combination of performance attributes that traditional liquid fluxes designed for wave soldering applications cannot fulfill. First, the flux deposition on the board needs to be carefully controlled. Proper fine tuning of the flux physicochemical characteristics combined with a process optimization are mandatory to strike the right balance between solderability and reliability. However, localization of the flux residue through the drop jet process is not enough to guarantee the expected performance level. The flux needs to be designed to minimize the impact of unavoidable spreading and splashing events.From this perspective a fundamental understanding of the relationships between formulation and reliability is critical. In this application, thermal history of the flux residues (from room temperature to solder liquidus) is a key performance driver. Finally, it is necessary to conduct statistically designed experiments on industrial selective soldering machines in order to map the relationships between flux characteristics and selective process friendliness.
OBSMT DIP soldering machine suitable welding the THT chips . Best suitable for small production quantity welding. Economic and save labor. E: sales@obsmt.com T:86-13926596436(wechat/whatsapp)
Dinghua Technology-- the leading manufacturer of BGA rework station, Automatic screw locking machine, Automatic soldering station and non-standard equipment. For more details, please just contact John, WhatsApp/Wechat:+86 1576811 4827 , Skype: si
SMTnet Express, May 18, 2017, Subscribers: 30,472, Companies: 10,597, Users: 23,256 How to Use the Right Flux for the Selective Soldering Application Bruno Tolla Ph.D, Denis Jean, Xiang Wei Ph.D; Kester The selective soldering application requires
| http://etasmt.com/cc?ID=te_news_industry,23964&url=_print
too fast The solvent in flux vapours out too fast, causing some tiny paste areas to separate from the major paste area and forming individual solder balls around the component. Solder splash
Heller Industries Inc. | https://hellerindustries.com/heller/vacuum-profile-reflow/
. Fast pump-down rates can perform better than slower pump-down rates for void removal, but it comes with a higher risk. If pressure is reduced too quickly, voids can be pulled out of the joint violently causing solder to splash across the board, and even shifting the component
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