Industry Directory: solder splash during tinning (2)

ASKbobwillis.com

Industry Directory | Consultant / Service Provider / Events Organizer / Media / Publisher / Online Resource / Training Provider

On site and online Training and consultancy in electronics manufacture. Wide range of training products which are solder worldwide by IPC, SMTA, SMART Group and others

PROPOX Sp. z o.o.

Industry Directory | Consultant / Service Provider / Manufacturer

PROPOX is a manufacturer of electronics, industrial automatics, telemetric systems, tools, modules and evaluation circuits used by the constructors of electronics.

New SMT Equipment: solder splash during tinning (11)

KappAloy15™ - 85Tin/15Zinc Solder for Hand Soldering Aluminum to Aluminum and Copper

KappAloy15™ - 85Tin/15Zinc Solder for Hand Soldering Aluminum to Aluminum and Copper

New Equipment | Solder Materials

KappAloy15™ is the 85% Tin/ 15% Zinc solder. In hand soldering Aluminum to Aluminum and/or Copper parts, this solder may give you more flexibility. It has a melting range of 390°F to 500°F and 199°C to 260°C. This slushy temperature range allows you

Solder Direct

Horizon Stannatech - Immersion Tin System

Horizon Stannatech - Immersion Tin System

New Equipment | Assembly Services

Perfectly Controlled Immersion Tin System The Horizon Stannatech system is the leading immersion tin system within the entire PCB industry. Together with the Stannatech process and Atotech's unique Crystallizer and ConStannic control systems for im

Atotech

Electronics Forum: solder splash during tinning (161)

Solder splash from component terminal

Electronics Forum | Wed Mar 22 14:59:20 EDT 2017 | solderingpro

Hello Henry, I believe some further clarification may be needed for someone to assist. Is the component already soldered prior to reflow? Does the component have paste already applied going through reflow? (or as per my previous question, is it al

Excess solder during manual solder jumper

Electronics Forum | Thu Nov 14 03:12:42 EST 2019 | jefri_simorangkir

hi Team, observed excess solder after assembly jumper with manual solder method. I already try to duplicate the phenomenon with adding more solder tin/wire,adding more time for solder but not found same condition I have attached the image for the

Industry News: solder splash during tinning (169)

PCB Test Point Provide Easy Component Access

Industry News | 2003-06-13 09:56:46.0

Wire and spring specialist William Hughes can now offer three different versions of its PCB test point - small, large and long-legged in quantities suitable for prototype work or volume production.

SMTnet

Influences of the solder material for the wave soldering machine soldering quality

Industry News | 2018-10-18 08:04:17.0

Influences of the solder material for the wave soldering machine soldering quality

Flason Electronic Co.,limited

Parts & Supplies: solder splash during tinning (2)

Yamaha Automatic PCB Lead Cutter

Parts & Supplies | Other Equipment

Automtaic PCB Lead Cutter, Lead Cutting Machine   FEATHERS    The eagle claw shrapnel clamp can nip PC boards tightly and push them forward automatically and stably. The track board-delivery speed can be adjusted according to pins to increase t

QYSMT SOLUTION USA LLC / Qinyi Electronics Co.,Ltd

Yamaha Automatic PCB Lead Cutter

Yamaha Automatic PCB Lead Cutter

Parts & Supplies | Other Equipment

Automtaic PCB Lead Cutter, Lead Cutting Machine   FEATHERS    The eagle claw shrapnel clamp can nip PC boards tightly and push them forward automatically and stably. The track board-delivery speed can be adjusted according to pins to increase t

QYSMT SOLUTION USA LLC / Qinyi Electronics Co.,Ltd

Technical Library: solder splash during tinning (9)

Lead-Free BGA Rework-Transition Issues

Technical Library | 2007-08-16 13:34:31.0

While experienced inspectors may be able to determine the aesthetic differences between a lead-free PCB assembly and a tin-lead version, one cannot rely on the "experienced eye". "Less wetting out to the pad edges" (Figure A) and "graininess and lack of shininess of the solder joint" (Figure B) are typical comments about some lead-free solder joints. However, in cases where a Nitrogen atmosphere was present during the reflow of the solder joint (Figure C), there will be little visual differences between the lead free alloys and their tin-lead counterparts.

BEST Inc.

Mitigation of Pure Tin Risk by Tin-Lead SMT Reflow- Results of an Industry Round-Robin

Technical Library | 2017-10-12 15:45:25.0

The risk associated with whisker growth from pure tin solderable terminations is fully mitigated when all of the pure tin is dissolved into tin-lead solder during SMT reflow. In order to take full advantage of this phenomenon, it is necessary to understand the conditions under which such coverage can be assured. A round robin study has been performed by IPC Task group 8-81f, during which identical sets of test vehicles were assembled at multiple locations, in accordance with IPC J-STD-001, Class 3. All of the test vehicles were analyzed to determine the extent of complete tin dissolution on a variety of component types. Results of this study are presented together with relevant conclusions and recommendations to guide high reliability end-users on the applicability and limitations of this mitigation strategy.

Raytheon

Videos: solder splash during tinning (13)

SMT solder dross recovery system solder waste recycling separator online automatic solder dross separator

SMT solder dross recovery system solder waste recycling separator online automatic solder dross separator

Videos

SMT solder dross recovery system solder waste recycling separator online automatic solder dross separator HR-SD100 is an endeavor in reverting and recycling the oxides which occur during working of a Wave Soldering Machine in order to reduce product

Shenzhen Honreal Technology Co.,Ltd

High Separation Rate Tin Slag Recovery Equipment Tin Dross Solder Dross Smelting Ash Separating Machine

High Separation Rate Tin Slag Recovery Equipment Tin Dross Solder Dross Smelting Ash Separating Machine

Videos

HR-SD100 is an endeavor in reverting and recycling the oxides which occur during working of a Wave Soldering Machine in order to reduce production cost, create a greener environment and assist the quality process. Use special stirring system to melt

Shenzhen Honreal Technology Co.,Ltd

Training Courses: solder splash during tinning (2)

BGA Rework/Profiling Training Course

Training Courses | | | PCB Rework and Hand Soldering Courses

The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.

BEST IPC Training

Rework of Leadless Devices Course

Training Courses | | | PCB Rework and Hand Soldering Courses

The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.

BEST IPC Training

Events Calendar: solder splash during tinning (1)

Printed Circuit Board (PCB) Inspection & Quality Control

Events Calendar | Mon Sep 14 00:00:00 EDT 2020 - Mon Sep 14 00:00:00 EDT 2020 | ,

Printed Circuit Board (PCB) Inspection & Quality Control

Surface Mount Technology Association (SMTA)

Career Center - Resumes: solder splash during tinning (5)

Sr. Process & Quality Engineer

Career Center | Houston, Texas USA | Engineering,Management,Quality Control,Technical Support

Seasoned Process & Quality Engineer. Degreed Chemical Engineer. 20+ years in Electronics Semiconductor manufacturing. Proficient in Quality Statistical tools, Design of Experiments, FMEAs, APQP, PPAP, ISO 9000, ISO/TS 16949 etc.

BankeemChheda-Resume

Career Center | Rochester, New York USA | Engineering

I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research

Express Newsletter: solder splash during tinning (1007)

Partner Websites: solder splash during tinning (51)

Accept or Reject: Solder Contacting Component Bodies | EPTAC

| https://www.eptac.com/soldertips/accept-or-reject-solder-contacting-component-bodies/

. If this condition occurred during a wave or reflow soldering process, then this points to underlying process issues. With wave soldering, if there is excessive solder flow up through the holes, this may indicate the possibility that the board is traveling too slowly in the process

How To Set Profile In SMT Reflow Oven-SMT Technical-Reflow oven,SMT Reflow Soldering Oven-cmsadmin

| http://etasmt.com/cc?ID=te_news_industry,24163&url=_print

homothermal period to solder melting and this rapid heating process has a close relationship with such defects as solder balls due to splash down and warped components due to imbalanced wettings on components


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Software for SMT placement & AOI - Free Download.
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Private label coffee for your company - your logo & message on each bag!