Electronics Forum | Tue Nov 20 04:38:18 EST 2001 | frha
How to implement an easy SPC in the production line? Im looking for relevant characteristics to perform SPC on electronics (e.g. PC-module with motherboard and UPS, power supply's, field bus cards, servo drive systems etc). I understand that compon
Electronics Forum | Wed Oct 06 03:58:25 EDT 1999 | Brian
| | Hi, | | | | Help! Could anyone help to enlighten me on this? | | | | Question: | | | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a n
Industry News | 2018-04-22 19:12:45.0
SMTA Europe announces Session 7 Technical Program on High Temperature PCB Materials and Fabrication at the “Electronics in Harsh Environments Conference” to be held in Amsterdam, Netherlands, on April 25th, 2018.
Industry News | 2019-09-20 08:45:31.0
09.19.2019 – Boca Raton – “Having worked in the electronics manufacturing industry since graduating from University of Maryland in 1980 with a BSEE, it’s truly puzzling to me that sophisticated machines capturing so much data have not been used to their full potential”, says Frank Mascetti, Owner of Technical Resources Corporation (TRC). For decades, he has witnessed this with respect to semiconductor test systems to In-Circuit Test to assembly and inspection machines alike. When he transitioned from electrical engineering into his sales profession many years ago, he listened to “spinmeisters” who worked very hard on creating a story with sales collateral. The companies acted like “it’s simply magic” and we can “plug all these boxes into one another.” In short, “Industry 4.0 will solve everything.”
Technical Library | 2010-07-08 19:49:59.0
Aging characteristics of new lead free solder alloys are in question by many experts because of higher amount of tin’s effect on the diffusion of other metals, primarily copper, to create undesirable boundary intermetallics over long periods of time and even moderately elevated temperatures. A primary layer of intermetallics, Cu6Sn5 forms as the liquid solder makes contact with the solid copper substrate. This reaction however ceases as the solder temperature falls below that of liquidus. A secondary intermetallic Cu3Sn1, an undesirable weak and brittle layer, is thought to form over time and may be accelerated by even mildly elevated temperatures in electronic modules such as laptops under power. This project was designed to quantify the growth rate of Cu3Sn1 over an extended period of time in a thermal environment similar to a laptop in the power on mode.
SMTnet Express, May 18, 2017, Subscribers: 30,472, Companies: 10,597, Users: 23,256 How to Use the Right Flux for the Selective Soldering Application Bruno Tolla Ph.D, Denis Jean, Xiang Wei Ph.D; Kester The selective soldering application requires
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