Electronics Forum | Fri Apr 16 19:32:07 EDT 2021 | mcoass
Hello, I have a very strange problem in a Delta 3 vitronic soltec, drops of tin are fired from the solderpot, I already adjusted the flux profile but these tin stains continue to appear, B.R
Electronics Forum | Wed Feb 28 19:48:11 EST 2001 | davef
If we were talking about a single board problem, we�d be thinking about the laminate, but since you imply the problem is broad-based across multiple assemblies, consider the following machine parameters: * Crank-up preheat time / temperature to driv
Industry News | 2010-01-17 22:24:09.0
Minneapolis, MN - The SMTA Technical Committee cordially invites industry professionals to submit abstracts for the 2010 International Conference on Soldering and Reliability being held this May in Toronto, Ontario, Canada.
Industry News | 2008-12-15 16:20:40.0
Minneapolis, MN � The SMTA Technical Committee invites industry professionals to submit abstracts for the International Conference on Soldering and Reliability to be held May 20-22, 2009 in Toronto, Ontario, Canada. Following on the very successful events of the past two years, this conference will once again bring together the community of soldering and reliability experts.
Technical Library | 2023-02-13 19:23:18.0
Spontaneously forming tin whiskers, which emerge unpredictably from pure tin surfaces, have regained prevalence as a topic within the electronics research community. This has resulted from the ROHS-driven conversion to "lead-free" solderable finish processes. Intrinsic stresses (and/or gradients) in plated films are considered to be a primary driving force behind the growth of tin whiskers. This paper compares the formation of tin whiskers on nanocrystalline and conventional polycrystalline copper deposits. Nanocrystalline copper under-metal deposits were investigated, in terms of their ability to mitigate whisker formation, because of their fine grain size and reduced film stress. Pure tin films were deposited using matte and bright electroplating, electroless plating, and electron beam evaporation. The samples were then subjected to thermal cycling conditions in order to expedite whisker growth. The resultant surface morphologies and whisker formations were evaluated.
Technical Library | 2013-07-18 12:12:40.0
Lead-free nanosolders have shown promise in nanowire and nanoelectronics assembly. Among various important parameters, melting is the most fundamental property affecting the assembly process. Here we report that the melting behavior of tin and tin/silver nanowires and nanorods can be significantly affected by the surface oxide of nanosolders.
Department of Chemical Engineering, University of Massachusetts
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SMTnet Express, May 18, 2017, Subscribers: 30,472, Companies: 10,597, Users: 23,256 How to Use the Right Flux for the Selective Soldering Application Bruno Tolla Ph.D, Denis Jean, Xiang Wei Ph.D; Kester The selective soldering application requires
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