New Equipment | Cleaning Equipment
BMP-1000X Automatic SMT Stencil Cleaning Machine BMP-1000X Feature ▶The cleaning tank, the original tank, and the spray tank are designed with a liquid level sensor overflow alarm. ▶The opening of the front door is designed with photoelectric s
New Equipment | Solder Paste Stencils
Flip Up SMT Rework Stencils are laser cut solder paste stencils designed to replicate the intial manufacturing process albeit for a designated component or selected area. These laser cut mini stencils can either have flaps (to prevent neighboring are
Electronics Forum | Mon Sep 29 23:46:51 EDT 2003 | daman
Hello everybody, We have a new product having a lot of open gold area. solder splashes during the reflow is a pain in the... Its an extremely small PCB and kapton taping is not an option. Stencil is at 10% reduction, Cleaning after every cycle. Reflo
Electronics Forum | Tue Sep 30 14:16:49 EDT 2003 | davef
While your waiting for others to respond, search to fine SMTnet Archives on: "solder and gold and finger"
Used SMT Equipment | Screen Printers
DEK Horizon Specs: DEK HORIZON Screen Printer D.O.M.:2000 S/N:274691 Top Clamp Board Hold down, Wet/Dry/Vacuum wiper, Pin Support tooling, and External Vacuum Pump Location:Chicago, IL Machine being auctioned off June 12th - 14th at the
Used SMT Equipment | Board Cleaners
ELECTROVERT AQUASTORM 100 Inline Wash D.O.M.:Nov-98 S/N:11875938 Excellent Condition! Includes: ReSys System and Aqua Klean water close loop system, Large Filtration, includes filters on walls Location:Anaheim, CA Machine being auctioned off June 1
Industry News | 2003-06-10 08:16:44.0
The following text describes the application of NWA Quality Analyst to quality control in the assembly of electronic components.
Industry News | 2018-10-18 08:27:03.0
An Analysis of SMT Solder Paste Printing Defects
Technical Library | 2017-05-17 22:33:43.0
The selective soldering application requires a combination of performance attributes that traditional liquid fluxes designed for wave soldering applications cannot fulfill. First, the flux deposition on the board needs to be carefully controlled. Proper fine tuning of the flux physicochemical characteristics combined with a process optimization are mandatory to strike the right balance between solderability and reliability. However, localization of the flux residue through the drop jet process is not enough to guarantee the expected performance level. The flux needs to be designed to minimize the impact of unavoidable spreading and splashing events.From this perspective a fundamental understanding of the relationships between formulation and reliability is critical. In this application, thermal history of the flux residues (from room temperature to solder liquidus) is a key performance driver. Finally, it is necessary to conduct statistically designed experiments on industrial selective soldering machines in order to map the relationships between flux characteristics and selective process friendliness.
OBSMT DIP soldering machine suitable welding the THT chips . Best suitable for small production quantity welding. Economic and save labor. E: sales@obsmt.com T:86-13926596436(wechat/whatsapp)
Dinghua Technology-- the leading manufacturer of BGA rework station, Automatic screw locking machine, Automatic soldering station and non-standard equipment. For more details, please just contact John, WhatsApp/Wechat:+86 1576811 4827 , Skype: si
SMTnet Express, May 18, 2017, Subscribers: 30,472, Companies: 10,597, Users: 23,256 How to Use the Right Flux for the Selective Soldering Application Bruno Tolla Ph.D, Denis Jean, Xiang Wei Ph.D; Kester The selective soldering application requires
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2020/02/Void-Reduction-Warpage-Vacuum-Reflow-Soldering.pdf
(e.g., bridging, solder splashes, etc.) at μBGAs Advantages of Vacuum-Assisted Convection Reflow The advantages of vacuum-assisted reflow are
