Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
EXPERIMENT-BASED COMPUTATIONAL INVESTIGATION OF THERMOMECHANICAL STRESSES IN FLIP CHIP BGA USING THE ATC4.2 TEST VEHICLE David W. Peterson Abstract 1999 12-4 REFLOW SOLDERING OF THROUGH-HOLE COMPONENTS Phil Zarrow Abstract 12-4 NEW GENERATION METALLIC
GPD Global | https://www.gpd-global.com/co_website/pdf/lead-former/CF8-Doc-Package-801-1-01.pdf
and form leads of axial electrical components up to a maximum rate of 25,000 parts per hour. Components are fed into the machine and then the component's leads are trimmed by carbide cutting blades, and crimped and/or cut in a manner that avoids stress
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