Electronics Forum: solder tin migration on pps (2)

Re: Tin-Lead thickness on PWB's

Electronics Forum | Mon May 18 20:57:06 EDT 1998 | Earl Moon

.025" pitch so the only problem we run into is too much HASL on the adhesive side causing improper glue dispense. | As Earl keeps saying HASL thickness is hard to impossible to control. I think we need to look hard at OSP's again but then you get in

Re: Tin-Lead thickness on PWB's

Electronics Forum | Mon May 18 22:54:04 EDT 1998 | Dave F

.025" pitch so the only problem we run into is too much HASL on the adhesive side causing improper glue dispense. | | As Earl keeps saying HASL thickness is hard to impossible to control. I think we need to look hard at OSP's again but then you get

Industry News: solder tin migration on pps (7)

SMTA Announces International Conference on Soldering and Reliability (ICSR) Program

Industry News | 2014-02-18 17:01:34.0

The SMTA is pleased to announce the program for the 2014 International Conference on Soldering and Reliability being held May 13-15 in Toronto, Ontario, Canada.

Surface Mount Technology Association (SMTA)

SMTA Announces International Conference on Soldering and Reliability (ICSR) Program

Industry News | 2015-03-02 11:42:19.0

The SMTA is pleased to announce the program for the 9th Annual International Conference on Soldering and Reliability being held May 19-21, 2015 in Markham, Ontario, Canada. The event will be co-located with the SMTA Toronto Expo.

Surface Mount Technology Association (SMTA)

Express Newsletter: solder tin migration on pps (981)

SMTnet Express - August 1, 2019

SMTnet Express, August 1, 2019, Subscribers: 32,197, Companies: 10,845, Users: 24,998 Tin Whiskers: Risks with Lead Free | Part I Credits: ACI Technologies, Inc. Tin (Sn) metal displays the characteristic of growing "tin whiskers" from pure tin

Partner Websites: solder tin migration on pps (8)

Surge in Consumer Electronics Caused by Rising Demand for Telecommunications Equipment - EPTAC - Tra

| https://www.eptac.com/surge-in-consumer-electronics-caused-by-rising-demand-for-telecommunications-equipment/

on 4th September, 2020 by Leo Lambert Recent Articles IoT and the Aerospace Industry – Too Risky? Leaded vs. Lead-Free Solder: Which is Better? The 5 Essential Tools for Soldering The Importance of IPC-A-610 Certification How to Build on Your Career in Soldering Categories Blog Uncategorized Why Get IPC Certified Due to the global shutdowns

Journal of SMT Articles

Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm

Abstract 19-2 A STUDY OF THE FAILURE MECHANISMS IN LEAD-FREE AND EUTECTIC TIN-LEAD SOLDER BUMPS FOR FLIP CHIP ASSEMBLY Julia Y. Zhao, David Mackessy, and John Jackson Abstract 19-2 EFFECT OF AGING ON PULL STRENGTH OF SnPb, SnAgCu, AND MIXED SOLDER JOINTS IN

Surface Mount Technology Association (SMTA)


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