Electronics Forum | Thu Dec 21 21:37:19 EST 2006 | Jack
Hi Pavel, Real Chunks, Thanks for your valuable inputs..Selecting the correct location for board profiling is critical in determining the solder joint quality. Am I right to say TC wire attachment locations priority should be as below: (1) Thermal
Electronics Forum | Tue May 01 20:40:38 EDT 2018 | sarason
In the past I have worked on 600 Amp FET Blocks. The rule was no voids. The circuit board would be heavy copper. 4 times normal plating time. Not particularly high resolution on the board say 20 mils. To help with the heavy plating. The boards were t
The X3 is an automatic X-Ray inspection system featuring combined Transmission and 3D Technology for sophisticated high-speed inspection in electronic production. The system is based on the motion concept of the MatriX X2.5 AXI system. A newly develo
SMTnet Express, December 16, 2017, Subscribers: 31,015, Companies: 10,789, Users: 24,054 Controlling Voiding Mechanisms in the Reflow Soldering Process Keith Sweatman, Takatoshi Nishimura, Kenichiro Sugimoto, Akira Kita; Nihon Superior Co., Ltd
Voiding Control for QFN Assembly Voiding Control for QFN Assembly Quad Flat No Leads (QFN) package designs receive more and more attention in electronic industry nowadays. This package offers a number of benefits including (1) small size
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes
Chip Scale Package 0540 CSP Delamination 0543 CSP Voids 0657 CSP Die Attach Delamination, Through Transmission Flip Chip 0354 Flip Chip - Disbonded solder bumps and halo defects 0355 Flip Chip Heat Sink Attach1016Flip Chip Underfill Void and Solder Bump Defects 2271 Flip Chip Underfill Void2466Flip Chip Underfill Multiple Voids Hybrid
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
Cleaning Ning-Cheng Lee, Ph.D. Abstract 23-1 Reliability Study and AF Modeling for SnAgCu Solder Joints and SnPb Solder Joints in QFN Packages Dong Hyun Kim, Mudasir Ahmad, Sue Teng Abstract 23-1 Second Generation Pb-Free Alloys Randy Schueller, Ph.D
